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Title: | 矽核光纖抽絲、研磨和熔接技術的改良及高效率光耦合器的設計 Technology Improvement on Fiber Drawing, Grinding, and Splicing of Silicon Cored Fibers and Design of High-Efficiency Fiber-to-Chip Coupler |
Authors: | Sung-Pu Yang 楊淞普 |
Advisor: | 王倫(Lon A. Wang) 王倫(Lon A. Wang | lon@ntu.edu.tw | ), |
Keyword: | 矽核光纖,D型光纖,漸細化光纖,藍寶石光纖,光纖熔接,光纖-晶片光耦合器,漸細化D型端面光耦合器, silicon cored fibers,D-shaped fibers,tapered fibers,sapphire fibers,fiber splicing,fiber-to-chip coupler,ground tapered SCF coupler, |
Publication Year : | 2022 |
Degree: | 碩士 |
Abstract: | 在本論文中,我們提到了目前製作矽核光纖抽絲所遇到的應力破裂以及融化矽聚堆的問題,並藉由分析過去的抽絲數據紀錄,找出延展預形體與抽出光纖時的速度調控可能是影響抽絲成功與否關鍵因素。因此我們提出以兩階段的方式製作含有連續矽核的預形體再進行抽絲,並初步驗證此法的可行性與穩定性。我們接著討論D型光纖的製作,提出採用接觸式與懸空式並用的方法,藉此控制研磨時間並提高研磨精度。我們先以單模光纖驗證實驗架構與方法的可重複性,並以矽核光纖驗證此方法可獲得矽核厚度僅140nm的D型光纖。我們還探討各種熔接的方式,我們首先驗證CO2雷射熔接矽核光纖的可行性,並發現此方法在玻璃披層厚度較薄、比例較低時受到限制,因此提出以藍寶石光纖吸收CO2雷射光來產生足夠熱量,輔助小尺寸的矽核光纖熔接,並透過實驗驗證此方法已可熔接尖端矽核直徑小於1微米、外徑小於10微米的漸細化矽核光纖。我們接著又提出以HPMC高分子材料作為接合溶劑,實現非破壞性的光纖接合。我們最後提出多種以矽核光纖為基礎的光纖-晶片光耦合器,包含單純基於漸細化光纖或D型光纖的光耦合器,以及漸細化、D型研磨並用的漸細化D型端面光耦合器。最後我們選擇以光損耗較低、耦合效率接近99%的漸細化D型端面光耦合器作為最終方案,證實了矽核光纖應用於光纖-晶片光耦合器的可行性與潛力。 In this thesis, we describe the problems of stress crack and melted silicon aggregation encountered in the current silicon cored fiber (SCF) drawing, and by analyzing the past data records of the fiber drawing, we found that the speed regulation when extending the preform and drawing out the fiber might be the key factor affecting the success rate of SCF drawing. Therefore, we propose a two-stage method to first fabricate a preform with continuous silicon cores before drawing. Preliminary experimental results verified the feasibility and stability of this method. We then discuss the fabrication of D-shaped SCF (D-SCFs), and propose a new method of combining contact and suspension methods to simultaneously control the grinding time and improve the grinding precision. We first used an SMF to verify the repeatability of the experimental platform and method, and then used an SCF to verify that this method could obtain a D-SCF with a silicon core thickness as small as 140 nm. We then discuss various splicing methods. We first used a CO2 laser to splice two SCFs, and found that when the thickness of the glass cladding was too thin and the cladding/core ratio was too low, the glass cladding couldn’t provide enough heat for splicing. Therefore, we used a sapphire fiber to absorb CO2 laser light and thus generated enough heat to assist the splicing of small-sized SCF. Experimental results show that the use of a sapphire fiber could splice two tapered SCFs with a tip silicon core diameter smaller than 1 micron and a cladding diameter smaller than 10 microns. Finally, we verified that HPMC polymer material could be used as the bonding solvent to realize non-destructive fiber splicing. Meanwhile, we propose a variety of optical couplers based on SCFs, including a tapered SCF, a D-SCF, and a ground tapered SCF coupler using both tapering and D-shaped grinding. Among them, we chose the ground tapered SCF coupler as the final scheme after individual analysis. It has almost 99% coupling efficiency from the coupler to a Si single mode waveguide (Si SMWG). We thus confirm the feasibility and potential of using SCF for fiber-to-chip coupling. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/86237 |
DOI: | 10.6342/NTU202202795 |
Fulltext Rights: | 同意授權(全球公開) |
metadata.dc.date.embargo-lift: | 2025-09-01 |
Appears in Collections: | 光電工程學研究所 |
Files in This Item:
File | Size | Format | |
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U0001-2508202210433700.pdf Until 2025-09-01 | 15.64 MB | Adobe PDF |
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