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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
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dc.contributor.advisor | 高振宏(C. Robert Kao) | |
dc.contributor.author | Meng-Hong Tsai | en |
dc.contributor.author | 蔡孟宏 | zh_TW |
dc.date.accessioned | 2021-05-20T19:58:50Z | - |
dc.date.available | 2010-07-12 | |
dc.date.available | 2021-05-20T19:58:50Z | - |
dc.date.copyright | 2010-07-12 | |
dc.date.issued | 2010 | |
dc.date.submitted | 2010-07-06 | |
dc.identifier.citation | [1] C.A. Harper, Electronic packaging and interconnection handbook, McGraw-Hill, New York (2005).
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Kao, Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate, J. Mater. Res. 24 (2009) 3407-3411. [52] D.R. Frear, P.T. Vianco, Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys, Metall. Mater. Trans. A-Phys. Metall. Mater. Sci. 25 (1994) 1509-1523. | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/8601 | - |
dc.description.abstract | Soldering reactions of the high-Pb/Cu at 350°C and the high-Pb/Ni at 400°C were investigated to uncover the massive spalling phenomenon, which was frequently observed in solder joint systems. As a function of solder compositions (99.5Pb0.5Sn, 99Pb1Sn, 97Pb3Sn and 95Pb5Sn, in wt.%) and reaction time (1–240 min), the sequence of events during the massive spalling was observed in step-by-step process which was ever recorded in such detail for this phenomenon. Moreover, the spalling process strongly depended on the Sn concentration in solder. The ternary phase diagram is successfully used in this study to rationalize the massive spalling phenomenon. With the help of diffusion path, a key kinetic diffusion feature of the driving force behind the massive spalling in this study was proposed. A possible mechanism of penetration through triple-junctions of intermetallic grains was proposed to explain the large-scale detachment of intermetallic layer without disintegrating the intermetallic layer into individual grains.
The only intermetallic compound formed in high-Pb/Cu solder reaction was Cu3Sn. However, the type of Ni–Sn intermetallic compounds formed in high-Pb/Ni soldering reaction was directly related to the Sn concentration in solder. When the Sn concentration was 5 wt.%, Ni3Sn4 formed first and followed by the formation of Ni3Sn2. When the Sn concentration decreased to 3 wt.%, Ni3Sn2 formed first and followed by the formation of Ni3Sn. When the Sn concentration became 1 wt.%, only Ni3Sn2 was observed after 240 min. This fascinating concentration dependency can be rationalized by using the Pb–Sn–Ni isotherm. The grain boundaries penetration of pure Ni by molten Pb-rich phase was observed in high-Pb/Ni soldering reactions at 400°C. This suggests that high-Pb solders are not compatible with pure Ni substrates at 400°C or higher temperature. | en |
dc.description.provenance | Made available in DSpace on 2021-05-20T19:58:50Z (GMT). No. of bitstreams: 1 ntu-99-D93527006-1.pdf: 12677919 bytes, checksum: ffb09d5c0e39d6c2f86b6fa45372224e (MD5) Previous issue date: 2010 | en |
dc.description.tableofcontents | 口試委員會審定書 i
Acknowledgements ii 中文摘要 iii Abstract v Contents vii Figure Captions viii Table Captions xiv Chapter 1 Introduction 1 Chapter 2 Literature review 3 2.1 Electronic packaging 3 2.2 Phase diagram 8 2.3 Diffusion path 12 2.4 Spalling phenomenon 25 2.5 Grain boundaries penetration 37 Chapter 3 Experimental procedures 43 3.1 Preparation of substrates 43 3.2 Preparation of solder alloys 43 3.3 high-Pb/Cu soldering reactions 43 3.4 high-Pb/Ni soldering reactions 44 3.5 Metallographic and analysis 44 Chapter 4 Results and discussion 47 4.1 high-Pb/Cu soldering reactions 47 4.2 high-Pb/Ni soldering reactions 59 Chapter 5 Conclusion 70 Reference 72 | |
dc.language.iso | en | |
dc.title | 高鉛/銅與高鉛/鎳液固反應中之大規模剝離現象 | zh_TW |
dc.title | Study of massive spalling in high-Pb/Cu and high-Pb/Ni soldering reactions | en |
dc.type | Thesis | |
dc.date.schoolyear | 98-2 | |
dc.description.degree | 博士 | |
dc.contributor.oralexamcommittee | 吳子嘉(Albert T. Wu),陳智(Chih Chen),陳志銘(Chih-Ming Chen),顏怡文(Yee-Wen Yen) | |
dc.subject.keyword | 大規模剝離,高鉛,銲料,介金屬,擴散,晶界穿透, | zh_TW |
dc.subject.keyword | massive spalling,high-Pb,soldering,intermetallic compound,diffusion,grain boundary penetration, | en |
dc.relation.page | 77 | |
dc.rights.note | 同意授權(全球公開) | |
dc.date.accepted | 2010-07-07 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 材料科學與工程學研究所 | zh_TW |
顯示於系所單位: | 材料科學與工程學系 |
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