化合物半導體代工產業佈局第三代半導體策略分析－以穩懋與宏捷科為例

Abstract

在供應鏈方面，2019年第二代化合物半導體－砷化鎵產業生產多以IDM為主，代工僅佔市場不到10%，然而隨著2020年新冠疫情爆發、商用市場需求的急遽增加，市場開始意識到專業分工、分散風險的重要性，逐漸將代工移轉給代工廠製作，也再次凸顯台灣在晶圓代工的重要性。台灣砷化鎵晶圓代工廠，如穩懋、宏捷科，面臨技術與需求的改變，以及第三代化合物半導體的出現，使半導體產業競爭更趨激烈。現有廠商要如何擴大現有的優勢技術的同時，並思考如何跨入第三代半導體市場、探索自己的產品定位、合作模式等，以鞏固自身代工地位，成為現今代工廠重要議題。 本研究首先聚焦在第二、三代半導體現況發展進行六力分析，了解第二代半導體代工廠商布局第三代半導體的策略方向。由於第三代半導體目前尚存良率低、關鍵材料有限等問題，導致無法有效降低成本。若未來在成本上有所突破，將有利於提升終端產品導入第三代半導體的意願。其次， 透過子產業之移動矩陣，將半導體產業分為第一、二、三代半導體三大子產業。短期而言，第二、三代半導體有其技術為基礎，與現有合作廠商或與第三代半導體子產業廠商合作，而使得彼此間競爭加劇，甚至導致產業重整，並在不同應用市場做競爭。長期而言，隨著第三代半導體技術逐漸成熟、應用範圍擴大，第二、三代半導體裡各子產業有可能在市場進行重疊、匯聚，在此匯聚的過程中，探討第二、三代半導體的機會又是如何。最後，以穩懋與宏捷科全球前兩大第二代半導體晶圓代工廠為分析個案，透過個案之價值網分析，對於公司當前的第二代半導體代工策略，以及第三代半導體代工布局提供策略分析與建議。 半導體產業生態正逐漸從單向的產品、單純的技術競爭擴及到生態系間的競合，公司不能僅依靠公司的產品、技術維持公司營運，隨著新需求與新技術的出現，半導體產業鏈的新參與者也不斷地出現，唯有與價值網上的參與者不斷相互合作、競爭，建構完整的生態系，持續在產品、技術、服務等面向進行創新，提供具有優勢、差異化的服務，才能不被時代的洪流所取代。

In terms of the supply chain, the industry of second-generation semiconductors, GaAs, mainly adopts the integrated device manufacturer (IDM) approach in 2019, whereas contract manufacturing only accounts for less than 10% of the market. However, the outbreak of the novel coronavirus pandemic in 2020 and the rapid increase in market demand manifested the importance of specialized division of labor and risk diversification and thus led to more outsourcing orders to contract manufacturers, which once again highlighted the importance of Taiwan in wafer contract manufacturing. Taiwan's GaAs contract manufacturers, such as WIN Semiconductors and Advanced Wireless Semiconductor Company, are facing challenges of technological and demand changes, the emergence of the third-generation semiconductors, and the growing competition in the semiconductor industry. Aside from expanding the existing advantage in technology as well as delving into the R&D of the third-generation semiconductors, the current foundry contract manufacturers need to secure their industry position by exploring new product positioning and collaboration models. By conducting the six forces analysis of the current development of the third-generation semiconductor industry, this thesis would like to examine how the contract manufacturers of the second-generation semiconductors can formulate their entry strategies into the third-generation semiconductor market. Due to the current yield problems and constraints of key materials faced by third-generation semiconductor industry companies, the cost cannot be effectively reduced. If there is a breakthrough in the cost in the future, it will make industry operators more willing to incorporate the third-generation semiconductors into end products. Next, this thesis will analyze the transformation matrix of the semiconductor industry's three sub-markets, first, second, and third-generation. In the short term, the second and third-generation semiconductor companies would rely on their technologies to collaborate with their existing partners or other vendors in the third-generation semiconductor submarket, which could lead to the restructuring of the industry and trigger competition in different application markets. In the long run, with the increasing maturity and the wider applications of the third-generation semiconductor technologies, the second and third-generation semiconductor submarkets may even overlap and converge in the application markets. This thesis employs the value net analyses of WIN Semiconductors and Advanced Wireless Semiconductor Company, the world's top two GaAs foundry contract manufacturers, as to explore how the second-generation semiconductor companies can configure their entry strategies into the third-generation semiconductor market. The semiconductor industry is gradually expanding from pure product and technology competition to competition and cooperation (i.e., co-opetition) between ecosystems. Companies cannot rely only on existing brands, products, and technologies for competitive advantages. With the continuous emergence of new markets, new technologies, and new market entrants, companies in the semiconductor industry have to stay relevant by competing while cooperating with the other participants in the value network, and even building a complete ecosystem for continuous product and technological innovation.