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| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 莊東漢 | zh_TW |
| dc.contributor.advisor | Tung-Han Chuang | en |
| dc.contributor.author | 葉于禎 | zh_TW |
| dc.contributor.author | Yu-Chen Yeh | en |
| dc.date.accessioned | 2023-03-19T22:04:34Z | - |
| dc.date.available | 2023-12-26 | - |
| dc.date.copyright | 2022-08-10 | - |
| dc.date.issued | 2022 | - |
| dc.date.submitted | 2002-01-01 | - |
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| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/84081 | - |
| dc.description.abstract | 電子產品的微縮化為製程帶來了精密度的考驗，例如奈米尺寸下銅應用於內連線的可靠度，而透過奈米孿晶銅膜的優勢能提升機械強度、抗電遷移與熱穩定度，因此成為重視的研究之一。 奈米孿晶擁有非常良好的熱穩定性與機械性質，而且強化時晶體並不會失去延展性，因此含有越多奈米孿晶比例的銅膜為本研究的目標。本研究透過改變基板的濺鍍偏壓與基板種類，以能期找到良好品質的銅奈米孿晶薄膜，並透過熱處理以觀察微結構變化，證實其穩定性。銅為面心立方金屬(FCC)，最密堆積平面族為{111}，由於擁有最小的表面能而促使奈米孿晶以平行於表面的{111}平面生長，因此{111}被視為奈米孿晶多寡的衡量指標，藉由X射線繞射分析、電子背向式散射繞射技術(EBSD)、聚焦離子束影像分析(FIB)，可以間接與直接得到奈米孿晶銅膜的機械性質與微結構變化。 優良的奈米孿晶薄膜可以應用在輔助銅-銅的低溫接合，奈米孿晶薄膜高比例的<111>優選方向其擴散速率較快，意即降低接合溫度，較低的溫度能降低預算，或是應用於對溫度敏感的晶片時，大幅提升良率。本研究針對不同試片作低溫接合，觀察接合溫度和接合壓力對孔隙率之影響，並以推力測試測其接合強度。 | zh_TW |
| dc.description.abstract | With the shrinkage of the electric device, there is also a challenge come to the reliability of the process such as applying Cu on interconnects in nanoscale. Today, it’s popular for elevating mechanical strength, great resistivity of migration, and excellent thermal stability. Film with nanotwins have great thermal stability and excellent mechanical property yet not losing great ductility. In this study, we changed the substrates and the sputtering bias to obtain densely nano-twinned film, annealing the thin film to confirm the microstructure of nanotwins would not change at high temperature. Cu belongs to Face Centered Cubic metal, which possess closest packing plane {111}. Due to the smallest surface energy, the nanotwins grow in the {111} plane parallel to the surface, {111} is regarded as a measure of the amount of nanotwins. X-Ray Diffraction (XRD), Electron Back-Scattered Diffraction (EBSD), and Focused Ion Beam image analysis (FIB) can indirectly and directly obtain the mechanical properties and microstructural changes of nanotwinned copper films. Excellent nano-twinned films can be used to assist low-temperature bonding of copper-copper. The high proportion of nano-twinned films in the preferred direction of <111> has a faster diffusion rate, which means lower bonding temperature. Lower temperature can reduce the budget, or when applied to temperature-sensitive chips, the yield can be greatly improved. In this study, different test pieces were bonded at low temperature, the effects of bonding temperature and bonding pressure on porosity were observed, and the bonding strength was measured by thrust test. | en |
| dc.description.provenance | Made available in DSpace on 2023-03-19T22:04:34Z (GMT). No. of bitstreams: 1 U0001-1707202223011000.pdf: 8220507 bytes, checksum: 080a0a783da432721a374204e94725e8 (MD5) Previous issue date: 2022 | en |
| dc.description.tableofcontents | 目錄 I 圖目錄 IV 表目錄 IX 第一章 前言 1 1.1 研究背景 1 1.1.1 電子構裝的重要性 1 1.1.2 先進封裝－3D 封裝 3 1.1.3 異質整合 3 1.1.4 2D、2.5D 封裝、3D 封裝以及 3D FabricTM 5 1.2 研究動機與目的 7 第二章 文獻回顧 9 2.1 晶界與孿晶界 9 2.1.1 強化機械性質之方法 9 2.1.2 共位晶格晶界 10 2.1.3 孿晶 13 2.1.4 奈米孿晶之特性 14 2.1.5 奈米孿晶的形成機制 15 2.1.6 奈米孿晶退火微結構變化 16 2.2 晶圓接合 19 2.2.1 直接接合 22 2.2.2 間接接合 27 2.3 用於3D IC 的接合技術 29 2.3.1 銅－銅熱壓接合 29 2.3.2 銅－銅表面活化接合 30 第三章 實驗方法與步驟 32 3.1 實驗流程圖 32 3.1.1 奈米孿晶銅薄膜 32 3.1.2 直接接合 33 3.2 材料種類及其預處理 34 3.2.1 基板與基板清潔 34 3.2.2 鍍膜材料 34 3.3 薄膜製備及真空熱壓熱處理 35 3.3.1 四槍磁控濺鍍系統 35 3.3.2 真空熱壓設備 36 3.3.3 真空熱處理設備 37 3.4 材料性質分析 39 3.4.1 聚焦離子束顯微鏡(FIB) 39 3.4.2 電子背向散射繞射技術(EBSD) 41 3.4.3 X射線繞射分析(XRD) 42 3.5 材料機械性質 43 3.5.1 推力測試(Dage 4000 die shear test) 43 第四章 結果與討論 44 4.1 單晶銅及多晶銅濺鍍銅奈米孿晶薄膜之特性 44 4.1.1 不同偏壓之奈米孿晶銅薄膜 44 4.1.2 不同基板優選方向之奈米孿晶銅薄膜 49 4.1.3 稀硝酸預處理 59 4.1.4 熱穩定性及微結構變化 65 4.2 銅奈米孿晶薄膜輔助低溫接合 71 4.2.1 銅奈米孿晶薄膜輔助單晶銅－銅低溫接合 73 4.2.2 銅奈米孿晶薄膜輔助多晶銅－銅低溫接合 76 4.2.3 銅－銅直接接合 81 第五章 結論 83 參考文獻 85 | - |
| dc.language.iso | zh_TW | - |
| dc.subject | 內連線 | zh_TW |
| dc.subject | 表面能 | zh_TW |
| dc.subject | 奈米孿晶銅膜 | zh_TW |
| dc.subject | 低溫接合 | zh_TW |
| dc.subject | 表面能 | zh_TW |
| dc.subject | 內連線 | zh_TW |
| dc.subject | 奈米孿晶銅膜 | zh_TW |
| dc.subject | 低溫接合 | zh_TW |
| dc.subject | low temperature bonding | en |
| dc.subject | nanotwinned copper film | en |
| dc.subject | Interconnect | en |
| dc.subject | Interconnect | en |
| dc.subject | nanotwinned copper film | en |
| dc.subject | low temperature bonding | en |
| dc.title | 銅單晶與多晶濺鍍銅奈米孿晶薄膜及其低溫接合研究 | zh_TW |
| dc.title | Study On Sputtering Nano-twinned Cu Thin Film On Single / Polycrystalline Cu And Low Temperature Bonding | en |
| dc.type | Thesis | - |
| dc.date.schoolyear | 110-2 | - |
| dc.description.degree | 碩士 | - |
| dc.contributor.oralexamcommittee | 張世穎;林惠娟;曹龍泉;王彰盟 | zh_TW |
| dc.contributor.oralexamcommittee | Shi-Ying Zang;Hui-Juan Lin;Long-Quan Cao;Zhang-Meng Wang | en |
| dc.subject.keyword | 奈米孿晶銅膜,內連線,表面能,低溫接合, | zh_TW |
| dc.subject.keyword | low temperature bonding,nanotwinned copper film,Interconnect, | en |
| dc.relation.page | 90 | - |
| dc.identifier.doi | 10.6342/NTU202201515 | - |
| dc.rights.note | 同意授權(限校園內公開) | - |
| dc.date.accepted | 2022-07-20 | - |
| dc.contributor.author-college | 工學院 | - |
| dc.contributor.author-dept | 材料科學與工程學系 | - |
| dc.date.embargo-lift | 2027-06-30 | - |
| 顯示於系所單位： | 材料科學與工程學系 | |
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