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標題: | 高速差動傳輸介面中共模衍生電磁暨射頻干擾之預測與消除 Prediction and Elimination of CM-Caused EMI/RFI in High-Speed Differential Interfaces |
作者: | Chi-Hsuan Cheng 鄭齊軒 |
指導教授: | 吳宗霖(Tzong-Lin Wu) |
關鍵字: | 吸收,共模雜訊,差模訊號傳輸,數位訊號,電磁干擾,低溫陶瓷共燒,縮小化,輻射,射頻干擾,印刷電路板,預測方法,三維積體電路, Absorption,common-mode noise,differential signaling,digital signals,electromagnetic interference (EMI),low-temperature co-fired ceramic (LTCC),miniaturization,radiation,radio-frequency interference (RFI),printed circuit board (PCB),prediction method,three-dimensional integrated circuit (3-D IC), |
出版年 : | 2016 |
學位: | 博士 |
摘要: | 若高速差動傳輸系統中的共模雜訊流經轉接介面等不連續處時,將會有輻射能量以干擾的形式而產生,並衍生電磁干擾及射頻干擾等嚴重問題。目前已有許多研究嘗試解釋及預測共模雜訊是如何造成輻射能量,以及如何抑制共模雜訊以解決此輻射干擾問題;這些研究的確對於評估及設計電路上有許多的幫助,但仍有些未能完整解釋的部分,以及在設計上仍有些限制。
本文以一輻射預測方法作為開端,此方法透過引入一種被稱為「天線模態」的輻射模態,搭配研究出的多導體傳輸線模態解析方法,可以預測差模及共模轉變成輻射能量的比例,以及評估不同結構或不同不連續面對於輻射生成的影響。 本文亦提出了三種共模濾波器的設計以消除共模雜訊。其一是一應用於三維積體電路且和矽連通柱共設計的共模濾波器,透過將矽連通柱的寄生效應變成設計的一部分,此設計可以有效地運用並節省面積,其物理尺寸僅有0.9毫米長與0.8毫米寬。另外此設計可以透過晶片堆疊技術來使共模抑制的響應更為優秀,在本文的實施例中可以達成106%的比例頻寬。 本文亦提出了一種設計方法,可以將三個共模傳輸零點設計在同一個止帶中,透過自由地控制該三個零點以形成寬頻設計(比例頻寬114%)或是高抑制量設計(20 dB)。依此方法,該共模濾波器可以透過低溫陶瓷共燒形成表面貼片式元件,或是直接實施於印刷電路板中作為內嵌式雜訊解決方案。 最後,一可以吸收共模雜訊的吸收式共模濾波器的設計方法被提出,並可以實現於成本較低的印刷電路板中。此共模濾波器設計不但可以有效吸收共模雜訊,亦保有很高地差模對共模截止頻率比。 When common-mode noise in the high-speed differential signaling system flows to the discontinuities such as interconnection, unwanted radiation will rise and cause some problems, in which electromagnetic interference (EMI) and radio-frequency interference (RFI) are the most critical ones. To solve these problems, many works have been done to characterize the radiating mechanism and to suppress the CM noise as radiating source. Those works indeed provide lots of help in dealing with the CM-caused interference, but there are still much undone and unstudied. In the beginning of this dissertation, an analysis method to explain and predict the CM-caused radiation is proposed. By involving a radiating mode called antenna mode (AM) into the modal analysis of multiconductor-transmission-line (MTL) system, the mode conversion from differential mode (DM) or CM to AM can be calculated. Then the relative radiation intensity of different structures or discontinuities can be obtained. Next, three common-mode filters (CMFs) are designed to eliminate the CM noise. The first one is a through-silicon-via-based common-mode filter (TSV-CMF) implemented in three-dimensional integrated circuits (3-D ICs). The parasitics of the TSVs are applied into the design and miniaturization can be achieved with a size of only 0.8 mm × 0.9 mm. The DM insertion loss is less than 3 dB from dc and up to 25 GHz. By using stacking-chip techniques, a CM stopband with a fractional bandwidth (FBW) of 106% is performed. Then, a design method to involve three CM transmission zeroes (TZs) in a stopband is established. This kind of CMF can be implemented both in low-temperature co-fired ceramic (LTCC) as a surface-mounted device (SMD) or in printed-circuit boards (PCBs) as an embedded solution. Either a wide stopband of -10 dB with an FBW of 114% or a high-suppression one of -20 dB can be achieved. Finally, an absorptive common-mode filter (A-CMF) is developed to really dissipate the CM noise. With the proposed analytic design method, it can be easily implemented in the cost-efficient PCB process. Not only absorption of CM noise, but also the high cutoff frequency of DM to CM and high FBW of CM stopband can be all achieved in this work. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/78153 |
DOI: | 10.6342/NTU201601750 |
全文授權: | 有償授權 |
顯示於系所單位: | 電信工程學研究所 |
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