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標題: | 銀銲線之離子遷移與電化學腐蝕研究 Research for Ion Migration and Electrochemical Corrosion of Ag Bonding Wire |
作者: | Chia-Tzu Tsai 蔡佳恣 |
指導教授: | 莊東漢(Tung-Han Chuang) |
關鍵字: | 純銀銲線,離子遷移,水滴法試驗,電化學腐蝕,樹枝狀晶, Ag bonding wire,ion migration,water drop test,electrochemical corrosion,dendrite, |
出版年 : | 2017 |
學位: | 碩士 |
摘要: | 電子產業開始嘗試使用純銀銲線做為替代材以取代其他金屬銲線在打線接合上遇到的接合困難已經行之多年,純銀銲線雖然有絕佳的物理性質,但在水氣含量充足的環境下,會發生銀離子遷移現象,此現象嚴重的話會使得電子元 件短路以及失效。銀離子遷移現象此觀點早在1930年代被提出,且亦有部分研究致力於抑制銀離子遷移現象的發生,例如添加金、鈀…等合金元素至銲線中,即是一項有效抑制離子遷移現象發生之方法。
離子遷移現象的反應一般而言被認為是一種腐蝕行為,因此為了確認離子遷移與腐蝕的關聯性,本研究主要分為兩部分進行,其分別為利用純銀銲線在不同水溶液下進行離子遷移實驗以及電化學腐蝕實驗,離子遷移實驗係使用符合美國材料與試驗協會的F1996標準規範以水滴法進行,而電化學腐蝕實驗則是利用極化曲線的量測,以得知在不同水溶液下進行腐蝕的相關數據,水溶液的種類則有氯化鈉、鹽酸、氫氧化鈉、溴化鈉以及碘化鈉共五種。 研究結果發現水溶液在某些濃度下離子遷移現象所造成的短路現象並不會發生,而造成樹枝狀晶生成之條件必須低於某濃度之下,此稱為臨界離子遷移濃度,此外,電化學腐蝕中,腐蝕速率會隨著水溶液濃度的降低而下降,但發生離子遷移現象的試樣結果中,卻得到在越低的濃度下會有越高的離子遷移率,與預期中腐蝕速率與離子遷移率呈現正相關的結果恰好是相反的,然而,此兩種實驗手法反應後的生成物,其成長情況卻是類似的。透過本研究除了能夠進一步了解純銀在不同水溶液下的離子遷移情形,亦能比較離子遷移與電化學腐蝕之間的差別,以期許未來得以幫助建立一套完整離子遷移機制之模型。 It has been several years that the silver bonding wires are used to replace with some other metal wires in order to conquer the difficulties in wire bonding. Although silver bonding wire has excellent physical properties, it gives rise to ion migration which may cause failure in electronic devices if the water vapor is sufficient. The viewpoint on ion migration has been brought up in 1930s, and some researchers devoted to finding ways on how to restrain the ion migration efficiently. Adding alloy elements such as palladium or gold in silver wires is a valid method to modify the ion migration. Ion migration is generally regarded as a corrosion behavior. In order to confirm the relation between ion migration and corrosion, this study is divided into two parts, using silver bonding wires separately proceeds the experiment of ion migration and electrochemical corrosion in five different solution including NaCl, HCl, NaOH, NaBr and NaI, the former experiment utilizes water drop test via the standards of ASTM-F1996, and the latter uses silver bonding wire as work electrode to obtain the related corrosive data by measuring the polarization curve in solutions. The results have been found that the short circuit due to ion migration didn’t happen under some specific concentration of solutions, and the dendritic precipitates only occurs below a concentration which is defined as critical ion migration concentration. On the other hand, the corrosive rate declines along with the reduction of the concentration in electrochemical reaction. But the ion migration rate increases as the concentration decreases. This is out of expectation on account of the fact that the result is opposite to what we predicted the positive correlation between the corrosive and ion migration rate. It is also found that the products after reaction grow similarly covered on the surface of silver wire in these two means of experiment. Through this study, we can not only know the phenomenon about silver ion migration in different solution but also compare the difference between ion migration and electrochemical corrosion. It is expected that the study could help to build a complete model on the reaction of ion migration in the future. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/76591 |
DOI: | 10.6342/NTU201700971 |
全文授權: | 未授權 |
顯示於系所單位: | 材料科學與工程學系 |
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