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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 林怡成(Yi-Cheng Lin) | |
dc.contributor.author | Gaun-Yu Lin | en |
dc.contributor.author | 林冠宇 | zh_TW |
dc.date.accessioned | 2021-06-17T08:46:24Z | - |
dc.date.available | 2019-08-07 | |
dc.date.copyright | 2019-08-07 | |
dc.date.issued | 2019 | |
dc.date.submitted | 2019-08-06 | |
dc.identifier.citation | [1]A. Enayati, W. Deraedt, and G. A. E. Vandenbosch, “Antenna-in-package solution for millimeter-wave applications: Slotted-patch in a multilayer PCB,” in Proc. IEEE Antennas Propag. Soc. Int. Symp. APSIS’12, Chicago, IL, USA, pp. 1-2, Jul. 2012.
[2]A. Enayati, W. Deraedt, and G. A. E. Vandenbosch, “End-fire antenna-in-package solution for millimeter-wave applications in a Teflon-based PCB technology,” in Proc. European Microwave Conf. EuMC’13, Nuremberg, DEU, pp. 48-51, Oct. 2013. [3]N. Ghassemi, and K. Wu, “Millimeter-wave integrated pyramidal horn antenna made of multilayer printed circuit board (PCB) process,” IEEE Trans. Antennas Propag., vol. 60, no. 9, pp. 4432-4435, Sep. 2012. [4]A. E. I. Lamminen, J. Saily, and A. R. Vimpari, “60-GHz patch antennas and arrays on LTCC with embedded-cavity substrates,” IEEE Trans. Antennas Propag., vol. 56, no. 9, pp. 2865-2874, Sep. 2008. [5]N. Kaneda et al, “A broadband planar quasi-Yagi antenna,” IEEE Trans. Antennas Propag., vol. 50, no. 8, pp. 1158-1160, Aug. 2002. [6]P. R. Grajek, B. Schoenlinner, and G. M. Rebeiz, “A 24-GHz high-gain Yagi-Uda antenna array,” IEEE Trans. Antennas Propag., vol. 52, no. 5, pp. 1257-1261, May. 2014. [7]R. A. Alhalabi, and G. M. Rebeiz, “Differentially-fed millimeter-wave Yagi-Uda antennas with folded dipole feed,” IEEE Trans. Antennas Propag., vol. 58, no. 3, pp. 966-969, Mar. 2010. [8]R. A. Alhalabi, Y. C. Chiou, and G. M. Rebeiz, “Self-shielded high-efficiency Yagi-Uda antennas for 60 GHz communications,” IEEE Trans. Antennas Propag., vol. 59, no. 3, pp. 742-750, Mar. 2011. [9]G. R. Dejean, and M. M. Tentzeris, “A new high gain microstrip Yagi array antenna with a high front to back ratio for WLAN and millimeter-wave applications,” IEEE Trans. Antennas Propag., vol. 55, no. 2, pp. 298-304, Feb. 2007. [10]R. A. Alhalabi, and G. M. Rebeiz, “High-gain Yagi-Uda antennas for millimeter-wave switched-beam systems,” IEEE Trans. Antennas Propag., vol. 57, no. 11, pp. 3672-3676, Nov. 2009. [11]I. Nasr et al, ‘‘A highly integrated 60-GHz 6-channel transceiver with antenna-in-package for smart sensing and short-range communications,’’ IEEE J. Solid-State Circuits, vol. 51, no. 9, pp. 2066-2076, Sep. 2016. [12]R.V. Ulaganathan et al, ‘‘Beamforming with multi-channel V-Band system-on-chip radar platform for gesture sensing,’’ in Proc. European Radar Conf. EuRAD’16, London, UK, 2016 [13]D. Liu, B. Gaucher, U. Pfeiffer, and J. Grzyb, Advanced Millimeter-Wave Technologies: Antennas, Packaging and Circuits. Hoboken, NJ, USA: Wiley, 2009. [14]Y. P. Zhang et al, “Antenna-in-package design for wirebond interconnection to highly integrated 60-GHz radios,” IEEE Trans. Antennas Propag., vol. 57, no. 10, pp. 2842-2852, Oct. 2009. [15]S. Liao, and Q. Xue, ‘‘Dual polarized planar aperture antenna on LTCC for 60- GHz antenna-in-package applications,’’ IEEE Trans. Antennas Propag., vol. 65, no. 1, pp. 63-70, Jan. 2017 [16]A. Amadjikpe et al, ‘‘Integrated 60-GHz antenna on multilayer organic package with broadside and end-fire radiation’’, IEEE Trans. Microw. Theory Tech., vol. 61, no. 1, pp. 303-315, Jan. 2013. [17]S. T. Liu, Y. W. Hsu, and Y. C. Lin, “A dual polarized cavity-backed aperture antenna for 5G mmW MIMO applications,” in Proc. IEEE Int. Conf. Microwaves, Commun. Antennas Electron. Syst. COMCAS’15, Tel Aviv, ISR, 2015. [18]A. E. I. Lamminen, J. Saily, and A. R. Vimpari, “60-GHz patch antennas and arrays on LTCC with embedded-cavity substrates,” IEEE Trans. Antennas Propag., vol. 56, no. 9, pp. 2865-2874, Sep. 2008. | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/74624 | - |
dc.description.abstract | 本論文針對未來第五代行動通訊的發展,分別在毫米波頻段38 GHz與60 GHz設計兩種封裝式整合天線。我們首先由文獻探討,比較晶片嵌入式天線和封裝式天線之差異。在射頻電路與毫米波天線的整合上,因考量天線的輻射效率,而採用天線與晶片整合之封裝技術。
在38GHz的部分,本論文提出設計在印刷電路板之毫米波準八木偶極天線,結合封裝的打線技術,將天線與射頻晶片作整合。所設計之天線有著寬頻、單向性輻射、高增益、高效率的特色,特別適合應用在第五代行動通訊系統上。在60GHz的部分,本論文提出一種應用於短距雷達之天線封裝模組,利用接地共平面波導作為天線饋入,結合共振背腔式設計。為了將電路整合在毫米波雷達晶片上,採用覆晶式封裝技術,以達到小型的一發射二接收之多通道多天線雷達模組。以上內容皆涵蓋文獻探討、設計架構、輻射機制、模擬結果、散射參數以及輻射場型的量測。 | zh_TW |
dc.description.abstract | In this thesis, we demonstrate two kinds of millimeter-wave (mmW) antennas in the 38 GHz and 60 GHz bands for the development of the fifth-generation (5G) mobile communications. In the beginning, antenna-on-chip (AoC) and antenna-in-package (AiP) which integrate RF circuits with antennas in mmW band are compared and discussed, where AiP is adopted because of the antenna efficiency.
In the 38 GHz part, a mmW quasi-Yagi antenna on standard printed circuit board (PCB) is proposed, combining with the wire-bonding technology to integrate the antenna with the RF chip. The proposed antenna has several features, including broadband, unidirectional pattern, high gain, and high efficiency, which is especially suitable for 5G mobile communication applications. In the 60 GHz part, an AiP module for short range radar applications is presented, using grounded coplanar waveguide (GCPW) feed, and combined with resonant cavity-backed design. In order to integrate the antenna and the mmW radar chip, the flip-chip packaging is introduced to achieve a compact multi-channel multi-antenna radar module, which consists of 1-Tx and 2-Rx. The contents of the thesis cover the literature survey, the design configuration, the radiation mechanism, simulated results, and measured S-parameters and radiation patterns. | en |
dc.description.provenance | Made available in DSpace on 2021-06-17T08:46:24Z (GMT). No. of bitstreams: 1 ntu-108-R06942088-1.pdf: 6952666 bytes, checksum: 68b4fb13c587a29783ed94e230c93cf8 (MD5) Previous issue date: 2019 | en |
dc.description.tableofcontents | 口試委員會審定書 i
誌謝 ii 中文摘要 iii ABSTRACT iv CONTENTS v LIST OF FIGURES vii LIST OF TABLES xv Chapter 1 Introduction 1 1.1 Research Motivation 1 1.2 Organization of the Thesis 3 Chapter 2 A 38-GHz Quasi-Yagi Antenna for 5G Mobile Communications 5 2.1 Introduction and Literature Survey 5 2.2 Antenna Design and Configuration 6 2.2.1 Element Design of Quasi-Yagi Antenna 6 2.2.2 1 by 4 Antenna Array Design 15 2.2.3 1 by 8 Antenna Array Design 27 2.3 Implementation and Measurement 38 2.3.1 1 by 4 Antenna Array Design 38 2.3.2 1 by 8 Antenna Array Design 49 2.4 Summary 58 Chapter 3 A 60-GHz Aperture Antenna with Cavity-Backed Design for Radar Applications 60 3.1 Introduction and Literature Survey 60 3.2 Antenna Design and Configuration 61 3.2.1 Overview of Packaging Configuration 61 3.2.2 Element Design of Cavity-Backed Aperture Antenna 64 3.2.3 Antenna-in-Package Design for 1T2R Radar 73 3.3 Implementation and Measurement 86 3.3.1 Measurement Setup 86 3.3.2 Measurement Results 88 3.4 Summary 91 Chapter 4 Enhanced Design with Stable Radiation Pattern for 60-GHz Radar Applications 93 4.1 Introduction 93 4.2 Enhanced Design and Configuration 94 4.2.1 Aperture Design for Radiation Patterns 94 4.2.2 Feeding Design for Impedance Matching 105 4.2.3 Optimal Integrated Design for 1T2R Radar 118 4.3 Simulation Results 124 4.3.1 Transmission Structure from RF chip to Antenna 124 4.3.2 Final Design of Antenna-in-Package for 1T2R Radar 126 4.4 Summary 142 Chapter 5 Conclusion 144 REFERENCES 146 | |
dc.language.iso | en | |
dc.title | 應用於5G毫米波之天線設計與封裝 | zh_TW |
dc.title | Design and Implementation of Antenna-in-Package
for 5G Millimeter-Wave Applications | en |
dc.type | Thesis | |
dc.date.schoolyear | 107-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 曾昭雄(Chao-Hsiung Tseng),張嘉展(Chia-Chan Chang),廖文照(Wen-Jiao Liao) | |
dc.subject.keyword | 第五代行動通訊,毫米波,天線封裝,覆晶式封裝,單向性輻射, | zh_TW |
dc.subject.keyword | fifth-generation mobile communications,millimeter-wave,antenna-in-package,flip-chip packaging,unidirectional radiation, | en |
dc.relation.page | 148 | |
dc.identifier.doi | 10.6342/NTU201902427 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2019-08-06 | |
dc.contributor.author-college | 電機資訊學院 | zh_TW |
dc.contributor.author-dept | 電信工程學研究所 | zh_TW |
顯示於系所單位: | 電信工程學研究所 |
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