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| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 高振宏 | |
| dc.contributor.author | Tzu-Hsuan Chiu | en |
| dc.contributor.author | 丘子軒 | zh_TW |
| dc.date.accessioned | 2021-06-17T07:02:22Z | - |
| dc.date.available | 2024-08-15 | |
| dc.date.copyright | 2019-08-15 | |
| dc.date.issued | 2019 | |
| dc.date.submitted | 2019-07-30 | |
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| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/72634 | - |
| dc.description.abstract | 扇出型晶圓級構裝可容納高I/O數，為具優勢之封裝結構，但其線路重佈層中之銅線路可能在熱應力作用下斷裂。取代銅線路的材料必須兼顧好的機械性質及介面反應性質，銅錫合金錫含量10wt%以內具有良好強化效果，但銅錫合金與焊料之介面反應少有文獻探討。本研究中觀察Cu/solder、Cu-3Sn/solder、Cu-6Sn/solder、Cu-10Sn/solder等介面在迴焊後以及在150℃、180℃、200℃下持溫後之介金屬形貌及厚度，進而得出介金屬成長速率及活化能。實驗結果顯示基材中的錫含量越高，Cu3Sn的成長速率僅微幅增加。此外Cu-3Sn/solder、Cu-6Sn/solder、Cu-10Sn/solder等介面之介金屬形貌皆與Cu/solder相似。 | zh_TW |
| dc.description.abstract | Fan-out wafer-level packaging (FOWLP) technology is gaining popularity for its performance and for its ability to meet high I/O counts. However, cracks were detected on Cu RDL under thermal stress. The material that can replace Cu must have better mechanical properties and good solder joint reliability after soldering and thermal aging. The fact that Cu-Sn alloys have good strengthening effect when tin is below 10wt% has been studied. Few studies have investigated the interfacial reaction between solder and Cu-Sn alloys. In this study, the interfacial reaction between Cu-xSn(x=0, 3, 6 and 10wt%) substrates and SAC305 solder after reflow, and aging at 150℃, 180℃, 200℃, respectively, are investigated. The morphology and the thickness of intermetallic compound (IMC) can be observed. Moreover, the activation energy and the growth rate of IMC corresponding to the diffusion can be obtained. The experimental result shows that the growth rate of Cu3Sn is slightly accelerated if there is higher concentration of Sn in Cu-xSn substrates. In addition, all the morphology of IMC in Cu-3Sn/solder、Cu-6Sn/solder、Cu-10Sn/solder are similar to that of Cu/solder. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-17T07:02:22Z (GMT). No. of bitstreams: 1 ntu-108-R06527014-1.pdf: 3774163 bytes, checksum: b758a5a80b249d2f84431162eb8f675d (MD5) Previous issue date: 2019 | en |
| dc.description.tableofcontents | 口試委員會審定書 i
誌謝 ii 中文摘要 iii 英文摘要 iv 第一章 緒論 1 1.1 扇出型晶圓級構裝及線路重佈層 1 1.2 添加錫至銅基材對機械性質的影響 5 1.3 無鉛焊料與銅基材之介面反應 8 1.4 添加其他元素至銅基材的影響 11 第二章 研究動機與目標 14 第三章 實驗步驟與方法 15 3.1 銅錫合金製備 15 3.2 檢測合金成分 15 3.3 介面反應相關之實驗步驟 15 3.3.1 迴焊 15 3.3.2 固態時效反應 16 3.3.3 金相分析試片製備 16 3.3.4 掃描式電子顯微鏡(SEM)觀察 16 3.4 基材之機械性質測試 16 第四章 結果與討論 17 4.1 測試合金成分結果 17 4.2 迴焊後之微結構 17 4.3 固態時效反應 19 4.4 動力學分析 28 4.5 機械性質量測 35 第五章 結論 37 參考文獻 38 | |
| dc.language.iso | zh-TW | |
| dc.subject | 時效 | zh_TW |
| dc.subject | 介面反應 | zh_TW |
| dc.subject | 基材 | zh_TW |
| dc.subject | 錫添加 | zh_TW |
| dc.subject | 無鉛焊料 | zh_TW |
| dc.subject | 介金屬化合物 | zh_TW |
| dc.subject | aging | en |
| dc.subject | lead-free solder | en |
| dc.subject | Sn addition | en |
| dc.subject | substrate | en |
| dc.subject | interfacial reaction | en |
| dc.subject | intermetallic compounds | en |
| dc.title | 添加錫至銅基材對於銅基材與無鉛焊料之介面反應的影響 | zh_TW |
| dc.title | Effect of Sn Addition to Cu Substrate on the Interfacial Reaction with Lead Free Solder | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 107-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 何政恩,吳子嘉,陳志銘 | |
| dc.subject.keyword | 介金屬化合物,無鉛焊料,錫添加,基材,介面反應,時效, | zh_TW |
| dc.subject.keyword | intermetallic compounds,lead-free solder,Sn addition,substrate,interfacial reaction,aging, | en |
| dc.relation.page | 40 | |
| dc.identifier.doi | 10.6342/NTU201902065 | |
| dc.rights.note | 有償授權 | |
| dc.date.accepted | 2019-07-31 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 材料科學與工程學研究所 | zh_TW |
| 顯示於系所單位： | 材料科學與工程學系 | |
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| ntu-108-1.pdf 未授權公開取用 | 3.69 MB | Adobe PDF |
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