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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 楊申語(Sen-Yeu Yang) | |
dc.contributor.author | Kun-Cheng Ke | en |
dc.contributor.author | 柯坤呈 | zh_TW |
dc.date.accessioned | 2021-06-17T06:32:13Z | - |
dc.date.available | 2028-08-17 | |
dc.date.copyright | 2018-08-18 | |
dc.date.issued | 2018 | |
dc.date.submitted | 2018-08-16 | |
dc.identifier.citation | [1] H. Becker, C. Gärtner, Polymer based micro-reactors, Rev. Mol. Biotechnol. 82 (2001) 89–99. doi:10.1016/S1389-0352(01)00032-0.
[2] 張哲豪, 流體微熱壓製程開發研究, 國立臺灣大學, 2004. [3] H. Lee, S. Hong, K. Yang, K. Choi, Fabrication of 100nm metal lines on flexible plastic substrate using ultraviolet curing nanoimprint lithography, Appl. Phys. Lett. 88 (2006) 143112. doi:10.1063/1.2193653. [4] S. Ahn, J. Cha, H. Myung, S. Kim, S. Kang, Continuous ultraviolet roll nanoimprinting process for replicating large-scale nano- and micropatterns, Appl. Phys. Lett. 89 (2006) 213101. doi:10.1063/1.2392960. [5] S. Park, K. Choi, G. Kim, J. Lee, Nanoscale patterning with the double-layered soft cylindrical stamps by means of UV-nanoimprint lithography, Microelectron. Eng. 86 (2009) 604–607. [6] S.H. Ahn, J.-S. Kim, L.J. Guo, Bilayer metal wire-grid polarizer fabricated by roll-to-roll nanoimprint lithography on flexible plastic substrate, J. Vac. Sci. Technol. B Microelectron. Nanometer Struct. Process. Meas. Phenom. 25 (2007) 2388–2391. doi:10.1116/1.2798747. [7] S.H. Ahn, L.J. Guo, Large-Area Roll-to-Roll and Roll-to-Plate Nanoimprint Lithography: A Step toward High-Throughput Application of Continuous Nanoimprinting, ACS Nano. 3 (2009) 2304–2310. doi:10.1021/nn9003633. [8] G. D, M. A, B. A, L. J.L, L. C, Feasibility of Selected Methods for Embossing Micro-Features in Thermoplastics, 東京工業大学附属図書館 文献データベース. (n.d.). http://tdl.libra.titech.ac.jp/journaldocs/recordID/article.bib-01/ZR000000257257 (accessed June 20, 2016). [9] P. Xie, P. He, Y.-C. Yen, K.J. Kwak, D. Gallego-Perez, L. Chang, W. Liao, A. Yi, L.J. Lee, Rapid hot embossing of polymer microstructures using carbide-bonded graphene coating on silicon stampers, Surf. Coat. Technol. 258 (2014) 174–180. doi:10.1016/j.surfcoat.2014.09.034. [10] P.M.A. Alam, D.S. Kumar, Flexible Electronics, in: P.B. Bhushan (Ed.), Encycl. Nanotechnol., Springer Netherlands, 2012: pp. 860–865. doi:10.1007/978-90-481-9751-4_147. [11] A.K. Geim, K.S. Novoselov, The rise of graphene, Nat. Mater. 6 (2007) 183. doi:10.1038/nmat1849. [12] A.K. Geim, P. Kim, Carbon wonderland, Sci. Am. 298 (2008) 90–97. [13] K.P. Loh, Q. Bao, P.K. Ang, J. Yang, The chemistry of graphene, J. Mater. Chem. 20 (2010) 2277–2289. doi:10.1039/B920539J. [14] W.S. Hummers, R.E. Offeman, Preparation of Graphitic Oxide, J. Am. Chem. Soc. 80 (1958) 1339–1339. doi:10.1021/ja01539a017. [15] C.-Y. Su, A.-Y. Lu, Y. Xu, F.-R. Chen, A.N. Khlobystov, L.-J. Li, High-Quality Thin Graphene Films from Fast Electrochemical Exfoliation, ACS Nano. 5 (2011) 2332–2339. doi:10.1021/nn200025p. [16] J. Kang, S. Hwang, J.H. Kim, M.H. Kim, J. Ryu, S.J. Seo, B.H. Hong, M.K. Kim, J.-B. Choi, Efficient transfer of large-area graphene films onto rigid substrates by hot pressing, ACS Nano. 6 (2012) 5360–5365. doi:10.1021/nn301207d. [17] M. Her, R. Beams, L. Novotny, Graphene transfer with reduced residue, Phys. Lett. A. 377 (2013) 1455–1458. doi:10.1016/j.physleta.2013.04.015. [18] J.W. Suk, A. Kitt, C.W. Magnuson, Y. Hao, S. Ahmed, J. An, A.K. Swan, B.B. Goldberg, R.S. Ruoff, Transfer of CVD-Grown Monolayer Graphene onto Arbitrary Substrates, ACS Nano. 5 (2011) 6916–6924. doi:10.1021/nn201207c. [19] W. Regan, N. Alem, B. Alemán, B. Geng, Ç. Girit, L. Maserati, F. Wang, M. Crommie, A. Zettl, A direct transfer of layer-area graphene, Appl. Phys. Lett. 96 (2010) 113102. doi:10.1063/1.3337091. [20] L. Gao, G.-X. Ni, Y. Liu, B. Liu, A.H. Castro Neto, K.P. Loh, Face-to-face transfer of wafer-scale graphene films, Nature. 505 (2014) 190–194. doi:10.1038/nature12763. [21] T.L. Chen, D.S. Ghosh, M. Marchena, J. Osmond, V. Pruneri, Nanopatterned Graphene on a Polymer Substrate by a Direct Peel-off Technique, ACS Appl. Mater. Interfaces. 7 (2015) 5938–5943. doi:10.1021/acsami.5b00163. [22] 石墨烯, 維基百科,自由的百科全書. (2016). https://zh.wikipedia.org/w/index.php?title=%E7%9F%B3%E5%A2%A8%E7%83%AF&oldid=40312205 (accessed August 3, 2016). [23] D.G. Papageorgiou, I.A. Kinloch, R.J. Young, Mechanical properties of graphene and graphene-based nanocomposites, Prog. Mater. Sci. 90 (2017) 75–127. doi:10.1016/j.pmatsci.2017.07.004. [24] G. Eda, G. Fanchini, M. Chhowalla, Large-area ultrathin films of reduced graphene oxide as a transparent and flexible electronic material, Nat. Nanotechnol. 3 (2008) 270–274. doi:10.1038/nnano.2008.83. [25] Graphene and functionalized graphene: Extraordinary prospects for nanobiocomposite materials - ScienceDirect, (n.d.). https://www.sciencedirect.com/science/article/pii/S1359836817309812 (accessed June 8, 2018). [26] 柯冠如, 磺酸化尼龍6/氧化石墨烯奈米複合材料之製備與特性研究, 國立中興大學, 2013. [27] 材料世界網:石墨烯於功能性高分子複合材料的應用, (n.d.). https://www.materialsnet.com.tw/DocView.aspx?id=10270 (accessed July 25, 2016). [28] 江仁吉, 奈米碳管/氮化硼/石墨烯/聚亞醯胺奈米複合薄膜之研究, 國立勤益科技大學, 2012. [29] 趙英捷, 石墨烯/聚乳酸奈米複合材料製備與性質研究, 朝陽科技大學, 2013. [30] S.Y. Chou, P.R. Krauss, P.J. Renstrom, Nanoimprint lithography, J. Vac. Sci. Technol. B. 14 (1996) 4129–4133. doi:10.1116/1.588605. [31] H. Becker, U. Heim, Hot embossing as a method for the fabrication of polymer high aspect ratio structures, Sens. Actuators Phys. 83 (2000) 130–135. doi:10.1016/S0924-4247(00)00296-X. [32] X.-J. Shen, L.-W. Pan, L. Lin, Microplastic embossing process: experimental and theoretical characterizations, Sens. Actuators Phys. 97–98 (2002) 428–433. doi:10.1016/S0924-4247(02)00029-8. [33] G.-B. Lee, S.-H. Chen, G.-R. Huang, W.-C. Sung, Y.-H. Lin, Microfabricated plastic chips by hot embossing methods and their applications for DNA separation and detection, Sens. Actuators B Chem. 75 (2001) 142–148. doi:10.1016/S0925-4005(00)00745-0. [34] N.S. Ong, Y.H. Koh, Y.Q. Fu, Microlens array produced using hot embossing process, Microelectron. Eng. 60 (2002) 365–379. doi:10.1016/S0167-9317(01)00695-5. [35] Soft Lithography - Xia - 1998 - Angewandte Chemie International Edition - Wiley Online Library, (n.d.). https://onlinelibrary.wiley.com/doi/abs/10.1002/%28SICI%291521-3773%2819980316%2937%3A5%3C550%3A%3AAID-ANIE550%3E3.0.CO%3B2-G (accessed June 8, 2018). [36] M.T. Gale, Replication techniques for diffractive optical elements, Microelectron. Eng. 34 (1997) 321–339. doi:10.1016/S0167-9317(97)00189-5. [37] H. Tan, A. Gilbertson, S.Y. Chou, Roller nanoimprint lithography, J. Vac. Sci. Technol. B Microelectron. Nanometer Struct. Process. Meas. Phenom. 16 (1998) 3926–3928. doi:10.1116/1.590438. [38] S. Lan, J.-H. Song, M.G. Lee, J. Ni, N.K. Lee, H.-J. Lee, Continuous roll-to-flat thermal imprinting process for large-area micro-pattern replication on polymer substrate, Microelectron. Eng. 87 (2010) 2596–2601. doi:10.1016/j.mee.2010.07.021. [39] L.P. Yeo, S.H. Ng, Z. Wang, Z. Wang, N.F. de Rooij, Micro-fabrication of polymeric devices using hot roller embossing, Microelectron. Eng. 86 (2009) 933–936. doi:10.1016/j.mee.2008.12.021. [40] L.-T. Jiang, T.-C. Huang, C.-Y. Chang, J.-R. Ciou, S.-Y. Yang, P.-H. Huang, Direct fabrication of rigid microstructures on a metallic roller using a dry film resist, J. Micromechanics Microengineering. 18 (2008) 015004. doi:10.1088/0960-1317/18/1/015004. [41] S.-Y. Hwang, S.-H. Hong, H.-Y. Jung, H. Lee, Fabrication of roll imprint stamp for continuous UV roll imprinting process, Microelectron. Eng. 86 (2009) 642–645. doi:10.1016/j.mee.2008.11.055. [42] H. Hiroshima, M. Komuro, Control of bubble defects in UV nanoimprint, Jpn. J. Appl. Phys. Part 1 Regul. Pap. Short Notes Rev. Pap. 46 (2007) 6391–6394. doi:10.1143/JJAP.46.6391. [43] 吳景棠, 氣囊輪紫外光樹脂滾壓製程技術之研發及應用, 國立臺灣大學, 2010. [44] J.-T. Wu, S.-Y. Yang, A gasbag-roller-assisted UV imprinting technique for fabrication of a microlens array on a PMMA substrate, J. Micromechanics Microengineering. 20 (2010) 085038. doi:10.1088/0960-1317/20/8/085038. [45] 莊岱融, PDMS環模結合氣囊滾輪複製UV樹脂微奈米結構製程的研發及應用, 國立臺灣大學, 2011. [46] V.L. Lanin, A.I. Lappo, Comparative effectiveness of infrared heat sources for mounting and dismounting electronic modules, Surf. Eng. Appl. Electrochem. 53 (2017) 394–399. doi:10.3103/S106837551704010X. [47] R.B. Roemer, Ultrasonic Heating Techniques, in: Phys. Technol. Hyperth., Springer, Dordrecht, 1987: pp. 390–402. doi:10.1007/978-94-009-3597-6_15. [48] O. Lucía, P. Maussion, E.J. Dede, J.M. Burdío, Induction Heating Technology and Its Applications: Past Developments, Current Technology, and Future Challenges, IEEE Trans. Ind. Electron. 61 (2014) 2509–2520. doi:10.1109/TIE.2013.2281162. [49] Q. Chen, L. Zhang, G. Chen, Far infrared-assisted embossing and bonding of poly(methyl methacrylate) microfluidic chips, RSC Adv. 4 (2014) 56440–56444. doi:10.1039/C4RA09909E. [50] C. Lu, Y.-J. Juang, L.J. Lee, D. Grewell, A. Benatar, Analysis of laser/IR-assisted microembossing, Polym. Eng. Sci. 45 (2005) 661–668. doi:10.1002/pen.20324. [51] N. Qi, Y. Luo, X. Yan, X. Wang, L. Wang, Using silicon molds for ultrasonic embossing on Polymethyl Methacrylate (PMMA) substrates, Microsyst. Technol. 19 (2012) 609–616. doi:10.1007/s00542-012-1671-1. [52] Y. Luo, X. Yan, N. Qi, X. Wang, L. Wang, Study of Double-Side Ultrasonic Embossing for Fabrication of Microstructures on Thermoplastic Polymer Substrates, PLOS ONE. 8 (2013) e61647. doi:10.1371/journal.pone.0061647. [53] C.-C. Cheng, S.-Y. Yang, D. Lee, Novel Real-Time Temperature Diagnosis of Conventional Hot-Embossing Process Using an Ultrasonic Transducer, Sensors. 14 (2014) 19493–19506. doi:10.3390/s141019493. [54] C.-Y. Chang, C.-H. Yu, A basic experimental study of ultrasonic assisted hot embossing process for rapid fabrication of microlens arrays, J. Micromechanics Microengineering. 25 (2015) 025010. doi:10.1088/0960-1317/25/2/025010. [55] S.-K. Hong, Y.-M. Heo, J. Kang, Replication of polymeric micro patterns by rapid thermal pressing with induction heating apparatus, in: 3rd IEEE Int. Conf. NanoMicro Eng. Mol. Syst. 2008 NEMS 2008, 2008: pp. 911–915. doi:10.1109/NEMS.2008.4484471. [56] 蔡宗鴻, 感應加熱技術輔助微結構熱壓印成形之研究, 國立高雄第一科技大學, 2013. [57] W.-C. Tu, Y.-T. Chang, C.-H. Yang, D.-J. Yeh, C.-I. Ho, C.-Y. Hsueh, S.-C. Lee, Hydrogenated amorphous silicon solar cell on glass substrate patterned by hexagonal nanocylinder array, Appl. Phys. Lett. 97 (2010) 193109. doi:10.1063/1.3515853. [58] S. Cai, C. Zhang, H. Li, S. Lu, Y. Li, K.-C. Hwang, X. Feng, Surface evolution and stability transition of silicon wafer subjected to nano-diamond grinding, AIP Adv. 7 (2017) 035221. doi:10.1063/1.4979579. [59] Plastic Electronic Devices Through Line Patterning of Conducting Polymers - Hohnholz - 2005 - Advanced Functional Materials - Wiley Online Library, (n.d.). https://onlinelibrary.wiley.com/doi/abs/10.1002/adfm.200400241 (accessed June 8, 2018). [60] M. Im, H. Im, J.-H. Lee, J.-B. Yoon, Y.-K. Choi, A robust superhydrophobic and superoleophobic surface with inverse-trapezoidal microstructures on a large transparent flexible substrate, Soft Matter. 6 (2010) 1401–1404. doi:10.1039/B925970H. [61] S.R. Forrest, The road to high efficiency organic light emitting devices, Org. Electron. 4 (2003) 45–48. doi:10.1016/j.orgel.2003.08.014. [62] Thiophene Polymer Semiconductors for Organic Thin‐Film Transistors - Ong - 2008 - Chemistry – A European Journal - Wiley Online Library, (n.d.). https://onlinelibrary.wiley.com/doi/full/10.1002/chem.200701717 (accessed June 8, 2018). [63] Flexible transparent conductive materials based on silver nanowire networks: a review - IOPscience, (n.d.). http://iopscience.iop.org/article/10.1088/0957-4484/24/45/452001/meta (accessed June 8, 2018). [64] A. Nathan, A. Ahnood, M.T. Cole, S. Lee, Y. Suzuki, P. Hiralal, F. Bonaccorso, T. Hasan, L. Garcia-Gancedo, A. Dyadyusha, S. Haque, P. Andrew, S. Hofmann, J. Moultrie, D. Chu, A.J. Flewitt, A.C. Ferrari, M.J. Kelly, J. Robertson, G.A.J. Amaratunga, W.I. Milne, Flexible Electronics: The Next Ubiquitous Platform, Proc. IEEE. 100 (2012) 1486–1517. doi:10.1109/JPROC.2012.2190168. [65] Printed Electronics in Sports: Flexible, Connected, Smart, (n.d.). http://www.oe-a.org/article/-/articleview/541411 (accessed June 8, 2018). [66] J. Kang, H. Kim, K.S. Kim, S.-K. Lee, S. Bae, J.-H. Ahn, Y.-J. Kim, J.-B. Choi, B.H. Hong, High-Performance Graphene-Based Transparent Flexible Heaters, Nano Lett. 11 (2011) 5154–5158. doi:10.1021/nl202311v. [67] U. Khan, T.-H. Kim, K.H. Lee, J.-H. Lee, H.-J. Yoon, R. Bhatia, I. Sameera, W. Seung, H. Ryu, C. Falconi, S.-W. Kim, Self-powered transparent flexible graphene microheaters, Nano Energy. 17 (2015) 356–365. doi:10.1016/j.nanoen.2015.09.007. [68] H. Li, P. He, J. Yu, L.J. Lee, A.Y. Yi, Localized rapid heating process for precision chalcogenide glass molding, Opt. Lasers Eng. 73 (2015) 62–68. doi:10.1016/j.optlaseng.2015.04.007. [69] J.-E. An, Y.G. Jeong, Structure and electric heating performance of graphene/epoxy composite films, Eur. Polym. J. 49 (2013) 1322–1330. doi:10.1016/j.eurpolymj.2013.02.005. [70] C. Cheng, K.-C. Ke, S.-Y. Yang, Application of graphene–polymer composite heaters in gas-assisted micro hot embossing, RSC Adv. 7 (2017) 6336–6344. doi:10.1039/C6RA27618K. [71] Y.-M. Shih, C.-C. Kao, K.-C. Ke, S.-Y. Yang, Imprinting of double-sided microstructures with rapid induction heating and gas-assisted pressuring, J. Micromechanics Microengineering. 27 (2017) 095012. doi:10.1088/1361-6439/aa7acd. [72] Y.-H. Lee, K.-C. Ke, N.-W. Chang, S.-Y. Yang, Development of an UV rolling system for fabrication of micro/nano structure on polymeric films using a gas-roller-sustained seamless PDMS mold, Microsyst. Technol. (2018) 1–8. doi:10.1007/s00542-017-3683-3. [73] K.-C. Ke, C. Cheng, L.-J. Lin, S.-Y. Yang, A novel flexible heating element using graphene polymeric composite ink on polyimide film, Microsyst. Technol. (2018) 1–7. doi:10.1007/s00542-018-3824-3. | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/72266 | - |
dc.description.abstract | 高分子壓印製程面臨升溫太慢與溫度不均之問題,如何提升升溫速率與改善溫度均勻性成為亟需克服之挑戰。本研究利用具有優良導電性、導熱性及機械性質的石墨烯複合材料開發可撓曲大面積加熱薄膜並應用於曲面微熱壓與微熱滾壓製程。
首先,探討不同膠體對分散性、電阻與片電阻之影響與可撓式測試,確立可撓式加熱器效能之可行性。接著應用可撓式加熱器開發石墨烯複合材料平板加熱器,探討其電流走向趨勢、邊界效應與電熱性質。實驗數據證明找出供給電壓、塗佈面積與升溫速率、穩態溫度之間的關係,結果顯示隨著電壓的升高,升溫速率與穩態溫度皆會提升。 本研究利用加熱器的高度可撓性,將其應用於曲面壓印製程,25V電壓驅動加熱器,於130秒內溫度由40℃提升至160℃。將此加熱器用於曲面基材上,輔以氣體施壓以進行曲面壓印;成型之結果顯示,V型結構複製率達到97%以上。顯示本實驗架構下可有效於曲面下複製表面微結構。 本研究更進一步將石墨烯複材加熱器應用於滾壓成型,開發滾筒可撓式加熱器,設計滾筒內部貼附開發完成加熱器,藉由調整電壓測試其滾筒式電熱性質、四方位動態溫度均勻性、橫向動態升溫均勻性與穩態溫度與電壓之關係。四方位動態升溫控制其溫度於2.8℃內,橫向動態溫度結果控制於1.2℃ 以內。 本研究亦將可撓式加熱器應用於微熱滾壓製作微透鏡陣列結構,探討壓力、工作溫度與進給速度對成型之關係。固定進給速度參數下,微透鏡陣列高度與直徑成型皆超過原模具尺寸。接著,複製V型結構,壓印參數固定在120℃,其成型結果更能達到98%之複製率。V型結構有效增強光強度。本研究證實石墨烯複合材料可撓式加熱器用於曲面與滾筒壓印的可行性與潛力。 | zh_TW |
dc.description.abstract | The polymer process faces the problems of slow temperature rise and uneven temperature. Increasing the heating rate and improving the temperature uniformity become an urgent challenge. In this study, a flexible large-area graphene-composite heating film was developed .The heating films were then applied to the processes of curved micro-hot embossing and micro-hot rolling embossing.
First, the effects of different colloids on dispersibility, resistance, sheet resistance and flexible testing were investigated to determine the feasibility of flexible flexible heaters. Then, a flexible graphene composite flat panel heater was developed. The results show that as the voltage increases, the heating rate and steady-state temperature increases. The flexible heater was used to the hot embossing on the curved substrate. With the power of 25V, the temperature was raised from 40 ° C to 160 ° C in 130s. Stable temperature can be maintained. The V-shaped microstructures are replicated with replication rate higher than 97%. A roller heater was developed for roller hot embossing. The heater was fabricated by wire bar coating of graphene polymer composite onto the inner wall of the hollow roller. The electrothermal property, the four-quadrant dynamic temperature uniformity, the lateral dynamic temperature uniformity and the steady-state temperature and voltage are tested by adjusting the voltage. The four-quadrant dynamic temperature control temperature is controlled within 2.8 °C, and the lateral dynamic temperature result is controlled within 1.2 °C. The roller heater was used in micro-hot roller embossing to fabricate microlens array and V-type structures. The relationship between pressure, working temperature and feed rate on forming were investagated. Under the fixed feed rate parameter, the height and diameter of the microlens array were all larger than original sizes of the mold. The V-shaped structure is formed at the fixed rolling speed rate parameter. With the embossing temperature fixed at 120 ° C, the replication rate were higher than 97%. Finally, the application of V-type structure to light intensity enhancement was verified. This study proved the feasibility and potential of the graphene polymer composite heater successfully. | en |
dc.description.provenance | Made available in DSpace on 2021-06-17T06:32:13Z (GMT). No. of bitstreams: 1 ntu-107-D03522028-1.pdf: 11547831 bytes, checksum: 05f4183f78b0e8c9bb5a15e9a07011cb (MD5) Previous issue date: 2018 | en |
dc.description.tableofcontents | 誌謝 ii
中文摘要 iii ABSTRACT iv 目錄 v 圖目錄 xi 表目錄 xix 第一章 導論 1 1.1 前言 1 1.2 微熱壓成型技術 2 1.3 氣體輔助微熱壓成型技術 5 1.4 連續滾壓成型技術 7 1.5 加熱技術 8 1.6 軟性電子導電膜技術 9 1.7 石墨烯簡介與物性 10 1.7.1 石墨烯性質與製備 12 1.7.2 石墨烯複合材料製程方法與加熱原理 17 1.8 研究動機與目標 21 1.9 論文內容與架構 23 第二章 文獻回顧 24 2.1 微熱壓成型技術與應用 24 2.2 滾壓成型技術說明 27 2.3 加熱技術與應用 35 2.3.1 紅外線快速加熱技術 36 2.3.2 超音波快速加熱技術 39 2.3.3 感應式快速加熱技術 43 2.4 軟性電子導電膜之技術與應用 45 2.4.1 軟性電子簡介 45 2.4.2 軟性電子優勢與應用 48 2.5 石墨烯相關之加熱技術與應用 49 2.5.1 石墨烯微加熱器 49 2.5.2 石墨烯加熱技術應用於微熱壓製程 51 2.5.3 石墨烯複材快速加熱技術 52 2.6 綜合歸納 54 第三章、平面石墨烯複材可撓加熱器之開發 56 3.1 整體壓印架設與操作說明 56 3.1.1 PI基板與石墨烯複材 56 3.1.2 石墨烯複材加熱器製作流程 60 3.1.3 客製電源供應器 60 3.2 塗佈方法探討 62 3.2.1 浸塗法(Dip coating) 63 3.2.2 鑄造塗佈法(Casting coating) 65 3.2.3 網印塗佈法(Screen painting) 66 3.2.4 線棒塗佈法(Wire bar coating) 67 3.2.5 塗佈方式結論 70 3.3 石墨烯複材加熱器製作流程 72 3.4 石墨烯分散性探討 73 3.4.1 掃描式電子顯微鏡 (Scanning Electron Microscope, SEM) 73 3.4.2 I-EP32 石墨烯之分散性討論 75 3.4.3 I-MS18 石墨烯之分散性討論 77 3.5 I-MS18複合材料導電性探討 79 3.5.1 石墨烯複合材料電阻與片電阻值 79 3.5.2 塗佈厚度對電阻之影響 80 3.6 可撓性電子測試實驗 82 3.7 加熱器發熱原理 84 3.8 平板式電流走向說明 84 3.9 石墨烯複材平板加熱器之熱電性質 86 3.9.1 紅外線熱影像儀 86 3.9.1 平板式加熱溫度均勻性探討 90 3.9.2 電壓對升溫速率之影響 93 3.9.3 加熱面積對熱電性質之影響 95 3.9.4 加熱效果對薄膜電阻之影響 98 3.10 結論 100 第四章 氣體輔助施壓複材加熱曲面微結構熱壓之開發 102 4.1 設置方法與製程步驟 102 4.2 曲面式氣體輔助式壓印機台設計 104 4.2.1 曲面基材 104 4.2.2 氣體輔助熱壓設備 105 4.3 壓印材料 106 4.4 壓力均勻性 107 4.5 曲面式平板加熱器溫度均勻性 107 4.6 曲面式平板加熱器性質探討 108 4.6.1 變電壓對升溫速率之影響 108 4.6.2 穩態溫度與電壓之關係 109 4.7 V型結構壓印 110 4.7.1 表面輪廓儀 110 4.7.2 成型參數探討 111 4.8 結論 117 第五章 滾筒式石墨烯複材加熱器之開發 118 5.1 膠體塗佈方式說明 118 5.2 加熱器發熱原理 119 5.3 滾動壓力與增加保壓狀態 119 5.3.1 壓力量測 119 5.3.2 連續滾壓時壓力均勻度測試結果 121 5.3.3 增加保壓狀態 123 5.4 滾筒式加熱器之熱電性質 124 5.4.1 四方位動態升溫結果與說明 125 5.4.2 橫向動態升溫結果與說明 127 5.4.3 滾筒式加熱溫度均勻性探討 128 5.4.4 電壓對升溫速率之影響 131 5.4.5 穩態溫度與電壓之關係 133 5.5 結論 136 第六章 滾筒式複材加熱器應用於滾對板壓印之壓印結果 137 6.1 滾動式壓印機台設計 137 6.1.1 移動平台 138 6.1.2 滾輪設計與設置 141 6.1.3 氣壓缸作用力與壓力之關係 141 6.1.4 滾筒設計說明 142 6.1.5 壓力作動方式與說明 144 6.1.6 移動平台組件 145 6.2 微透鏡陣列之壓印結果 145 6.2.1 電鑄鎳模具 146 6.2.2 雷射共軛焦顯微鏡 147 6.2.3 固定滾輪進給速度之直徑與高度成型率 148 6.2.4 固定工作壓力之直徑與高度成型率 155 6.3 V型微結構之壓印結果 161 6.3.1 電鑄鎳模具 161 6.3.2 固定滾輪進給速度下之成型率 162 6.3.3 固定工作壓力之成型率 170 6.4 V型結構之光強度增強應用 176 6.5 結論 178 第七章 總結與未來展望 180 7.1 研究總結 180 7.2 未來展望 182 參考文獻 184 附錄:作者簡歷 191 附錄:學術成就 192 | |
dc.language.iso | zh-TW | |
dc.title | 可撓式石墨烯高分子軟性導電薄膜加熱器之開發應用於滾壓與曲板壓印製程之探討 | zh_TW |
dc.title | Development of Rolling and Curved Surface Hot Embossing System Using Ultra-thin Flexible Electronic Heating Elements of Graphene Polymeric Composite in Polymeric Components Fabrication | en |
dc.type | Thesis | |
dc.date.schoolyear | 106-2 | |
dc.description.degree | 博士 | |
dc.contributor.oralexamcommittee | 粘世智(Shih-Chih Nian),張致遠(Chih-Yuan Chang),邱智瑋(Chih-Wei Chiu),韓麗龍(Lee-Long Han) | |
dc.subject.keyword | 可撓性,石墨烯複材,軟性電子,薄膜加熱器,微熱滾壓,曲面板壓印, | zh_TW |
dc.subject.keyword | flexibility,graphene composite,flexible electronic,thin film heater,curved micro-hot embossing,micro-hot rolling embossing, | en |
dc.relation.page | 196 | |
dc.identifier.doi | 10.6342/NTU201803675 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2018-08-16 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
顯示於系所單位: | 機械工程學系 |
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