請用此 Handle URI 來引用此文件:
http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/71316
標題: | 以有機相/水相乳化液及溶劑揮發法製備含環氧樹脂硬化劑之微膠囊 Microencapsulation of epoxy curing agent by oil-in-water emulsion and solvent evaporation method |
作者: | Chia-Ju Chang 張加儒 |
指導教授: | 童世煌(Shih-Huang Tung) |
關鍵字: | 環氧樹脂,硬化劑,微膠囊化技術,有機相/水相乳化液,溶劑揮發法, Epoxy,Curing agents,Microencapsulation,Oil-in-water emulsion,Solvent evaporation method, |
出版年 : | 2018 |
學位: | 碩士 |
摘要: | 環氧樹脂擁有優越的機械韌性、化學抵抗性,廣泛使用於工業塗層、黏著劑、封裝材料及複合材料等。現今許多硬化劑在室溫下即可與環氧樹脂快速反應,所以環氧樹脂與硬化劑一般分開存放,需要時再行混合,以避免不必要的固化反應,然而此方法有著保存及加工較為複雜的問題。本研究以不同有機溶劑系統,環氧樹脂硬化劑採用2-苯基咪唑與高分子聚己內酯,並以不同界面活性劑,在均質機高速攪拌下製備有機相/水相乳化液,藉由溶劑揮發法製備包覆環氧樹脂硬化劑之微膠囊。此微膠囊與環氧樹脂混合後可於室溫下長期存放,需要時再行加溫固化。我們探討不同溶劑、攪拌速度、界面活性劑種類、界面活性劑濃度、有機相與水相比例、硬化劑與高分子比例等製備條件與微膠囊形成之關係,並利用FT-IR、TGA、DSC分析物性、SEM觀測樣品之形貌及測試使用微膠囊交聯固化後成品之機械性質。研究發現採用無毒性溶劑乙酸乙酯作為有機相所製備之微膠囊在室溫與環氧樹脂混合後可保存7天以上不反應,經加熱至50℃可使外層保護之高分子熔融軟化,釋放出內含之硬化劑與環氧樹脂反應,形成交聯固化之成品,達成室溫下可長期存放,低溫即可交聯固化之目的。經過TGA鑑定以無毒性溶劑乙酸乙酯所製備之微膠囊環氧樹脂硬化劑含量為43 wt%,多於使用二氯甲烷所製備的30 wt%。測試機械性質後發現使用乙酸乙酯所製備之微膠囊與環氧樹脂固化反應後,相較於使用純硬化劑之表現,在韌性表現可提升46%。 Although epoxy resins have excellent mechanical and chemical properties, epoxy resins and curing agent are generally stored in two pots to prevent unnecessary curing reaction at room temperature. To solve this problem, we developed a one pot system which can be stored for a long time at room temperature by a simple, nontoxic processing. This involves the encapsulation of the curing agent, 2-phenylimidazole (2PhI), in polycaprolactone (PCL) microcapsules fabricated by oil-in-water emulsion and solvent evaporation method with different organic solvents and surfactants. The encapsulated curing agents can greatly extend the storage time when the microcapsules and epoxy are mixed at room temperature, and the curing reaction can be triggered at elevated temperature. The effect of solvent, rotation speed during the microcapsule formation, surfactant, the concentration of surfactant, the ratio of oil phase and water phase, and the ratio of 2PhI and PCL were investigated. We use SEM to observe the morphology, DSC to examine the curing behavior, TGA to measure the amount the curing agents, FT-IR to confirm the interaction between PVA and PCL, and test the mechanical properties of final curing epoxy specimen. The microcapsules fabricated by nontoxic solvent, ethyl acetate, contain 43 wt% curing agent and can be stored with epoxy for more than 7 days at room temperature without significant reaction while the curing reaction can be triggered upon heating to 50 ˚C. The toughness of cured specimens prepared with the microcapsules is 46% better than that with the pure curing agent. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/71316 |
DOI: | 10.6342/NTU201700731 |
全文授權: | 有償授權 |
顯示於系所單位: | 高分子科學與工程學研究所 |
文件中的檔案:
檔案 | 大小 | 格式 | |
---|---|---|---|
ntu-107-1.pdf 目前未授權公開取用 | 5.27 MB | Adobe PDF |
系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。