請用此 Handle URI 來引用此文件:
http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/67897
完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 陳瑤明(Yau-Ming Chen) | |
dc.contributor.author | Chen-Hsiang Lao | en |
dc.contributor.author | 勞禎祥 | zh_TW |
dc.date.accessioned | 2021-06-17T01:56:44Z | - |
dc.date.available | 2017-07-21 | |
dc.date.copyright | 2017-07-21 | |
dc.date.issued | 2017 | |
dc.date.submitted | 2017-07-20 | |
dc.identifier.citation | [1] GREENPEACE綠色和平組織,《Clicking Clean點擊綠》,2014。http://www.greenpeace.org/taiwan/Global/taiwan/planet3/publications/reports/2014/clickclean.pdf
[2] Y. F. Maydanik and Y. F. Gerasimov. “Heat Pipe,” USSR Inventor’s Certificate No. 449213, 1974. [3] J. F. Maidanik, S. V. Vershinin, V. F. Kholodov, and J. E. Dolgirev. “Heat Transfer Apparatus,” US Patent No. 4515209, 1985. [4] Y. F. Maydanik. “Loop Heat Pipes,” Applied Thermal Engineering, 2005, 25.5: 635-657. [5] R. Singh, A. Akbarzadeh, C. Dixon, M. Mochizuki, and R. R. Riehl. “Miniature Loop Heat Pipe With Flat Evaporator for Cooling Computer CPU,” IEEE Trnasactions on Components and Packaging Technology, 30.1:42-49, 2007. [6] C. C. Yeh, C. N. Chen, and Y. M. Chen. “Heat transfer analysis of a loop heat pipe with biporous wicks,” International Journal of Heat and Mass Transfer, 52.19: 4426-4434, 2009. [7] Y. F. Maydanik, M. A. Chernysheva, and V. G. Pastukhov. “Review: loop heat pipes with flat evaporators,” Applied Thermal Engineering, 67.1: 294-307, 2014. [8] M. A. Chernysheva, S. I. Yushakova, and Y. F. Maydanik. “Effect of external factors on the operating characteristics of a copper–water loop heat pipe,” International Journal of Heat and Mass Transfer, 81: 297-304, 2015. [9] C. Park, J. Zuo, P. Rogers, and J. Perez. “Hybrid Loop Thermal Bus Technology for Vehicle Thermal Management,” Advanced Cooling Technologies, Inc Lancaster PA, 2004. [10] D. Bugby, K. Wrenn, D. Wolf, E. Kroliczek, J. Yun, and S. Krein. “Multi-evaporator hybrid loop heat pipe for small spacecraft thermal management,” Aerospace Conference, IEEE, 2005. [11] C. Park, A. Vallury, J. Zuo, J. Perez, and P. Rogers. “Electronics thermal management using advanced hybrid two-phase loop technology,” ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, 911-916, 2007. [12] I. Setyawan, I. I. Hakim, and N. Putra. “Experimental study on a hybrid loop heat pipe,” MATEC Web of Conferences, EDP Sciences, 101, 03011, 2017. [13] S. Kang, R. Schmidt, K. M. Kelkar, and A. Radmehr. “A methodology for the design of perforated tiles in raised floor data centers using computational flow analysis,” Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on. IEEE, 1, 215-224, 2000. [14] T. J. Breen, E. J. Walsh, J. Punch, A. J. Shah, and C. E. Bash. “From chip to cooling tower data center modeling: Part I influence of server inlet temperature and temperature rise across cabinet,” Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on. IEEE, 2010. [15] K. Ebrahimi, G. F. Jones, and A. S. Fleischer. “A review of data center cooling technology, operating conditions and the corresponding low-grade waste heat recovery opportunities,” Renewable and Sustainable Energy Reviews, 31: 622-638, 2014. [16] Y. Ma, G. Ma, S. Zhang, and F. Zhou. “ Cooling performance of a pump-driven two phase cooling system for free cooling in data centers,” Applied Thermal Engineering, 95: 143-149, 2016. [17] M. Vuckovic & N. Depret. “Impacts of local cooling technologies on air cooled data center server performance: Test data analysis of Heatsink, Direct Liquid Cooling and passive 2-Phase Enhanced Air Cooling based on Loop Heat Pipe,” Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2016 32nd. IEEE, 2016. [18] C. Gerhart, D. F. Gluck, S. Stanley, M. J. Bragg, and M. S. El-Genk. “Initial characterization results of metal wick capillary pumps,” AIP Conference Proceedings. Eds. Mary J. Bragg, and Mohamed S. El-Genk. Vol. 458. No. 1. AIP, 1999. [19] N. Zhang. 'Innovative heat pipe systems using a new working fluid.' International communications in heat and mass transfer, 28.8: 1025-1033, 2010. [20] Y. Abe. 'Self‐Rewetting Fluids,' Annals of the New York Academy of Sciences, 1077.1: 650-667, 2006. [21] J. H. Boo and B. C. Won. 'Experimental study on the thermal performance of a small-scale loop heat pipe with polypropylene wick,' Journal of mechanical science and technology, 19.4: 1052-1061, 2005. [22] H. Nagano, F. Fukuyoshi, H. Ogawa, and H. Nagai. 'Development of an experimental small loop heat pipe with PTFE wick,' 40th International Conference on Environmental Systems, 2010. [23] ASTM Standard E128-99 (2005) “Standard test method for maximum pore diameter and permeability of rigid porous filters for laboratory use,” ASTM International, West Conshohocken, PA, 2005. [24] R. J. Moffat. 'Describing the uncertainties in experimental results,' Experimental thermal and fluid science, 1.1: 3-17, 1988. [25] S. C. Wu, C. J. Huang, W. H. Yang, J. C. Chang, and C. C. Kung. 'Effect of sintering temperature curve in wick manufactured for loop heat pipe,' World Academy of Science, Engineering and Technology, 62: 631-636, 2012. [26] Y. Chen, M. Groll, R .Mertz, Y. F. Maydanik, and S. V. Vershinin. 'Steady-state and transient performance of a miniature loop heat pipe,' International Journal of Thermal Sciences, 45.11: 1084-1090, 2006. [27] Koomey, Jonathan G. 'Estimating total power consumption by servers in the US and the world,' 2007. [28] L. Vasiliev, D. Lossouarn, C. Romestant, and A. Alexandre. 'Loop heat pipe for cooling of high-power electronic components,' International Journal of Heat and Mass Transfer, 52.1: 301-308, 2009. [29] B. J. Huang, H. H. Huang, and T. L. Liang. 'System dynamics model and startup behavior of loop heat pipe,' Applied Thermal Engineering, 29.14: 2999-3005, 2009. | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/67897 | - |
dc.description.abstract | 隨著雲端產業的蓬勃發展,伺服器與資料中心的設置也與日俱增,而伴隨而升的運算廢熱儼然成為急需解決的難題。目前絕大多數的資料中心採用空調氣冷方式散熱,但其中所使用的壓縮機與冰水主機相當耗電,或需仰賴濱海地區(如Facebook、Google)、涼爽氣候(如Apple、Foxconn)等天然資源協助冷卻,於設置上有地區的限制,十分不便。因此,開發一省電且不需依靠天然資源的散熱系統有其必要性。
複合式迴路式熱管為一套具高熱通量與長熱傳距離之散熱系統,於傳統迴路式熱管中加裝一低耗電量的液體泵,使原本的被動元件轉為主動元件,額外的泵功率不但延緩乾涸(dry out)的發生,更能增加系統穩定性與提升熱傳性能。故本研究欲利用複合式迴路式熱管之良好特性,開發一適用於資料中心散熱之複合式迴路式熱管散熱系統,以達節能且不需依靠天然資源協助散熱之目的。 實驗結果顯示,以鎳為毛細結構,並搭配丙酮為工作流體,在100oC操作溫度限制內,複合式迴路式熱管之總路徑長達15m,水平操作時達700W的最大熱傳性能,逆向抬升1m時達600W,最低熱阻為0.112oC/W。相較於複合式迴路式熱管,傳統迴路式熱管當總路徑長為2m時,水平操作之最大熱傳量為200W,最低熱阻為0.346oC/W;總路徑長為5.5m時,系統在水平操作或逆向抬升時皆無法順利啟動。對比之下,複合式迴路式熱管之熱傳性能、熱傳距離與抗重力能力明顯有大幅度的提升。 總結本研究之成果,複合式迴路式熱管系統以耗電量低的風扇及液體泵,即可使傳統迴路式熱管系統的各項性能得到倍數的成長,且根據本研究之估算,此散熱系統可節省現階段資料中心冷卻用電的2/3以上。耗電量低以及良好的抗重力能力,使複合式迴路式熱管未來於資料中心散熱的應用層面更具彈性與潛力。 | zh_TW |
dc.description.abstract | With the vigorous development of cloud industry, the implement of servers and data centers grows accordingly, causing tons of waste heat waiting for a proper thermal solution. Most of the data centers adopt HVAC (Heating, Ventilation and Air Conditioning) to deal with waste heat. But it requires power-consuming compressors and chillers, or relies on the assist of natural resources such as coastal region (e.g. Facebook & Google) or cool weather (e.g. Apple & Foxconn). So the sites are limited by the locations. Therefore, it is necessary to develop an energy-saving cooling system without relying on natural resources.
Hybrid loop heat pipe (HLHP) is a novel cooling system with high heat flux and long transport distance. Adding a low-power-consuming liquid pump to a traditional loop heat pipe (LHP), it turns into an active device from a passive device. The pumping power not only puts off the dry out phenomena, but also greatly enhances the stability of the system and increases the heat transfer performance of LHP. Hence, this study aims to utilize the advantages of HLHP to develop an energy-saving HLHP applied to data center cooling. The experimental results show that with the use of nickel wick and acetone as working fluid within 100 oC operating temperature limitation, HLHP can deal with 700W of heat at horizontal position, and 600W at 1m adverse elevation with 15m of the total transport length and 0.112oC/W of the minimum thermal resistance. In contrast with HLHP, when the total length of LHP is 2m, the maximum heat transfer performance is 200W and the minimum thermal resistance is 0.346oC/W at horizontal position. When the total length of LHP is 5.5m, it can’t successfully operate at either horizontal or adverse elevation positions. By contrast, the performance, the transport distance and the anti-gravity ability of HLHP are greatly enhanced. To summarize, the heat transfer performance of HLHP, using a very low amount of pumping energy and fan power, can be successfully multiplied by many times compared to that of traditional LHP. According to the estimation of this study, HLHP can save more than 2/3 of electricity used in current data centers cooling system. Low power consumption and good anti-gravity ability make the future application to data center more flexible and promising. | en |
dc.description.provenance | Made available in DSpace on 2021-06-17T01:56:44Z (GMT). No. of bitstreams: 1 ntu-106-R04522401-1.pdf: 3658356 bytes, checksum: 8e6643050e7fce9cb2706eef4b3ae339 (MD5) Previous issue date: 2017 | en |
dc.description.tableofcontents | 學位論文口試委員審定書 III
誌謝 V 摘要 VII ABSTRACT VIII 目錄 X 圖目錄 XIII 表目錄 XV 第1章 緒論 1 1-1 前言 1 1-1-1 暖通空調(Heating, Ventilation and Air Conditioning, HVAC) 2 1-1-2 外氣冷卻(Air Free Cooling) 3 1-1-3 冷水空調節能(Water Free Cooling) 3 1-1-4 水冷(Direct-to-Chip Water Cooling) 4 1-1-5 浸泡液冷(Immersed Liquid Cooling) 5 1-1-6 熱管(Heat Pipe, HP)與迴路式熱管(Loop Heat Pipe, LHP) 6 1-2 文獻回顧 8 1-2-1 迴路式熱管文獻回顧 8 1-2-2 複合式二相迴路文獻回顧 9 1-2-3 資料中心散熱文獻回顧 10 1-3 研究目的 11 第2章 複合式迴路式熱管之運作原理與理論分析 13 2-1 複合式迴路式熱管的基本原理 13 2-2 複合式迴路式熱管的操作限制 15 2-2-1 毛細限制 15 2-2-2 啟動限制 16 2-2-3 液體過冷限制 17 2-3 工質填充量與儲存槽尺寸 18 2-3-1 工質填充量 18 2-3-2 儲存槽尺寸 19 2-4 複合式迴路式熱管之熱阻分析 19 2-4-1 蒸發器熱阻 20 2-4-2 蒸氣段熱阻 20 2-4-3 冷凝器熱阻 21 第3章 實驗儀器設備與方法 22 3-1 實驗材料與製造設備 22 3-1-1 金屬鎳毛細結構 22 3-1-2 製造設備 23 3-2 毛細結構燒結製程 24 3-3 毛細結構之參數量測 25 3-3-1 孔隙度(Porosity, ε) 25 3-3-2 有效孔徑(Effective radius of capillary pore, rc) 26 3-3-3 滲透度(Permeability) 27 3-4 複合式迴路式熱管之實驗設備與測試步驟 29 3-4-1 實驗設備 29 3-4-2 複合式迴路式熱管之安裝步驟 33 3-4-3 複合式迴路式熱管之實驗步驟 33 3-4-4 性能評估 34 3-5 誤差分析 34 3-6 複合式迴路式熱管之系統參數 35 第4章 結果與討論 36 4-1 毛細結構參數 36 4-2 複合式迴路式熱管之熱傳性能表現 37 4-3 總路徑長與抗重力能力 41 第5章 結論與建議 46 5-1 結論 46 5-1-1 長傳輸距離 46 5-1-2 抗重力能力 46 5-1-3 複合式迴路式熱管之熱傳性能增強效益 47 5-2 建議 47 參考文獻 48 附錄 53 附錄A 量測不準度分析 53 附錄B 熱電耦校正曲線 58 | |
dc.language.iso | zh-TW | |
dc.title | 應用於資料中心散熱之節能複合式迴路式熱管 | zh_TW |
dc.title | Energy-Saving Hybrid Loop Heat Pipe Applied to Data Center Cooling | en |
dc.type | Thesis | |
dc.date.schoolyear | 105-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 劉君愷,吳聖俊 | |
dc.subject.keyword | 迴路式熱管,複合式迴路式熱管,氣冷,資料中心散熱系統,抗重力, | zh_TW |
dc.subject.keyword | loop heat pipe (LHP),hybrid loop heat pipe (HLHP),air-cooling,cooling system of data center,anti-gravity, | en |
dc.relation.page | 59 | |
dc.identifier.doi | 10.6342/NTU201701614 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2017-07-21 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
顯示於系所單位: | 機械工程學系 |
文件中的檔案:
檔案 | 大小 | 格式 | |
---|---|---|---|
ntu-106-1.pdf 目前未授權公開取用 | 3.57 MB | Adobe PDF |
系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。