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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 李吉仁 | |
dc.contributor.author | Chi-Hui Lin | en |
dc.contributor.author | 林其輝 | zh_TW |
dc.date.accessioned | 2021-06-17T01:09:24Z | - |
dc.date.available | 2020-02-17 | |
dc.date.copyright | 2020-02-17 | |
dc.date.issued | 2020 | |
dc.date.submitted | 2020-01-18 | |
dc.identifier.citation | 中文文獻
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dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/66844 | - |
dc.description.abstract | 當器件尺寸微縮之後,生產所需原料減少,容易大量的批次製造,因而可以大幅降低生產成本。從功能上來說,微縮尺寸還能提高器件的精度、產生新的元件特性、容易整合各種元件而衍生出複雜系統,產生前所未見的新奇功能。微機電系統(以下簡稱MEMS)是半導體產業之外,另一個基於「尺寸微縮」而發展出來的重大產業。如同IC產品一樣,MEMS產品充斥在我們日常生活與工作環境中,為我們提供多樣化的便利性,並且提升開發未來的能力。
從技術的觀點來看,這兩種產業有很多相似的地方,然而,MEMS產業的發展卻不如半導體產業,至今MEMS市場總值不到半導體總產值的3%。這當中顯然有些根本的因素,導致產生如此巨大差異的商業結果。因此,本研究擬針對此一議題進行系統性的探討。 本研究首先進行MEMS的基本結構和製程技術分析,並且比較MEMS與IC的差異。我們發現高度的多樣性和複雜性,是導致MEMS產業發展遠遠落後IC產業的原因之一。接著,本研究根據次級資料,整理出MEMS產業所經歷的三波產業發展熱潮,最終形成快速變化與競爭的產業型態。在超競爭的產業環境中,增加產品附加價值是MEMS供應商提升競爭能力的重要策略,供應商需要擁有多種技術以及高度整合能力。透過購併可以縮短取得新能力的時間,因此併購成為MEMS供應商迅速發展技術、業務能力的重要途徑。為求在變動快速的環境中維持競爭優勢,成功的MEMS供應商分別採取不同的策略,包括:技術創新、差異化、垂直整合和首動者優勢。 晶圓代工模式所產生專業化與規模化的效益,是助長半導體產業蓬勃發展的主要原因之一,然而,專業分工的模式並沒有成功地被複製到MEMS產業,關鍵原因在於MEMS產業沒有標準製程。缺乏標準製程使得MEMS代工業者面對製程技術不容易形成規模經濟,製造成本沒有足夠數量的廠商可以共同分攤的困境,因此在MEMS產業無法形成完整而有效率的垂直分工模式。 | zh_TW |
dc.description.abstract | When the size of the device is reduced, the first benefit is that the volume of the required raw materials for production is reduced, therefore it is easy for mass-production in batch, thereby greatly reducing the production cost. Furthermore, from a functionality viewpoint, miniaturization increases accuracy of the device, generates new characteristics, and easily integrates various components to create a complex system that produce unprecedented novelty. In addition to the semiconductor industry, Micro-Electro-Mechanical-System (MEMS, hereafter) is the major industry based on miniaturization technology. There are lots of similarities between these two technologies and hence industries. However, the MEMS industry hasn’t developed and grown as prosperous as the semiconductor industry. The total revenue of the MEMS industry is less than 3% of semiconductor industry nowadays. Obviously, there are some fundamental factors leading to such huge differences of business results, an interesting issue which motivates the present thesis work.
This study first analyzed the basic structures and process technology of MEMS, and compared the differences between MEMS and IC. It was found that high degree of diversity and complexity is one of the reasons why the development of the MEMS industry is far behind the IC industry. Then, based on the marketing data and research reports of the past 20 years, this study identified three waves of industrial development boom experienced by the MEMS industry and found that the MEMS industry finally became rapidly changing and strongly competing. In such a hypercompetitive environment, increasing added value of products was an important strategy for MEMS suppliers to enhance their competitiveness. Suppliers therefore needed to have multiple technologies and strong capability of integration. M&A was one of the important ways for MEMS suppliers to rapidly develop their technical and business capabilities. We also found that several successful MEMS suppliers took different strategies from technology innovation, differentiation, vertical integration and first-mover advantage, among others. However, not like the foundry model established in the semiconductor industry, MEMS industry did not occur the same effect. The heterogeneity of the development and manufacturing processes, i.e., “One Product, One Process”, may explain such a deviation. The lack of standard processes made it difficult to reach economy of scale for MEMS foundry and therefore the manufacturing costs could not be lowered effectively through vertical dis-integration model, like the industry landscape occurring in the semiconductor industry. Implications of our research results and suggestions for future research are also discussed. | en |
dc.description.provenance | Made available in DSpace on 2021-06-17T01:09:24Z (GMT). No. of bitstreams: 1 ntu-109-P04750020-1.pdf: 8255625 bytes, checksum: 43e879fc9446a2fe5ab2acd6507ee055 (MD5) Previous issue date: 2020 | en |
dc.description.tableofcontents | 目錄
口試委員會審定書 I 誌謝 II 中文摘要 III THESIS ABSTRACT IV 目錄VI 圖目錄 VIII 表目錄 X 第一章 緒論 1 第一節 研究動機 1 第二節 研究問題與目的 2 第三節 研究方法 3 第四節 論文結構 4 第二章 文獻探討 5 第一節 熊彼得的破壞性創造觀點 5 第二節 以資源和能力建構策略 5 第三節 競爭優勢的本質與來源 6 第四節 產業演化與策略改變 10 第五節 技術密集產業與創新管理 11 第六節 成熟產業中的競爭優勢 14 第七節 垂直整合與廠商範疇 15 第三章 MEMS產業結構分析與未來發展 18 第一節 什麼是微機電系統? 18 第二節 早期MEMS商業化過程 23 第三節 車用MEMS市場 27 第四節 MEMS市場現況與展望 36 第五節 結論 40 第四章 MEMS供應商的競爭策略 42 第一節 MEMS是快速演化的產業 42 第二節 MEMS產業面對的挑戰與商品演化趨勢 43 第三節 MEMS廠商的競爭策略 47 第五章 垂直整合與分工模式探討 55 第一節 MEMS供應商的種類 55 第二節 MEMS代工業務的表現 57 第三節 MEMS代工產業的困境 62 第六章 結論與建議 66 第一節 研究結論 66 第二節 研究建議 67 參考文獻 69 附錄:MEMS簡介 76 第一節 MEMS的發展歷史 76 第二節 重要的幾種MEMS元件與其應用 78 第三節 MEMS製程技術 92 圖目錄 圖 三.1 MEMS的多樣化應用 19 圖 三.2在電子顯微鏡下MEMS加速度計的懸臂結構影像 20 圖 三.3 MEMS麥克風的圓型收音薄膜 21 圖 三.4(a)Texas Instruments DMD 微鏡片結構圖(b)電子顯微鏡下單軸MEMS光學掃描鏡 21 圖 三.5微流道的照片 22 圖 三.6(a)1980年代Stanford大學開發的體型微加工MEMS加速度計(b)1990年代ADI公司面型微加工MEMS加速度計 24 圖 三.7 ADI公司的MEMS陀螺儀(左)架構俯視圖,包括控制電路和MEMS感測結構(右)MEMS感測結構 25 圖 三.8 TI以及幾大噴墨印表頭供應商囊括2006年整體MEMS市場營收排名前幾名 26 圖 三.9預估未來MEMS的應用市場 27 圖 三.10車用MEMS供應商排名(2013-2014) 31 圖 三.11消費性MEMS市場成長率在2010年達到27%之後,2011年增長37% 32 圖 三.12消費性MEMS市場預估 32 圖 三.13手機上各種MEMS的應用的示意圖 33 圖 三.14消費性MEMS市場預估 34 圖 三.15 以元件分類的MEMS市場預估 34 圖 三.16 2017~2023年全球MEMS市場規模 37 圖 三.17 2017年前30大MEMS廠商及其營收數字 38 圖 三.18 2017年前18大MEMS代工廠商及其營收數字 39 圖 三.19各種MEMS元件的複合成長率(2017~2023) 40 圖 四.1 MEMS平均銷售價格的快速下跌 43 圖 四.2(a)控制IC和MEMS晶片並排整合在一起。兩者透過導線連接。 (b)Colyibrys公司MS9000加速度計的照片。封裝體的尺寸是8.9 x8.9x3.2mm3 44 圖 四.3(a)控制IC和MEMS晶片堆疊整合在一起。兩者透過導線連接。 (b)STMicroelectronics 公司LIS331DLH 3軸加速度計的照片。 封裝體的尺寸是3x3x1mm3 44 圖 四.4(a)控制IC和MEMS晶片堆疊整合在一起。兩者透過覆晶 (flip-chip)方式直接連接。(b)VTI公司3軸加速度計的照片。 封裝體的尺寸是2x2x1mm3 44 圖 四.5三軸MEMS加速度計尺寸微縮的趨勢 45 圖 四.6 Invensense和Sensordynamics 在2009年引領著市場發展IMU,STMicroelectronics和 Robert Bosch跟隨在後,日漸成為重要的產品。 46 圖 四.7 2000~2009中的購併案件,總計超過100起 47 圖 四.8各公司BAW濾波器的市佔率變化(2006-2014) 50 圖 四.9前10大MEMS麥克風供應商 53 圖 五.1七種不同的MEMS商業模式 56 表目錄 表 三 1美國、歐盟和日本強制汽車使用ADAS的種類、規定方法與時間 29 表 三 2各種MEMS 元件在汽車上的應用 30 表 三 3消費性MEMS元件以及其應用 35 表 三 4消費性MEMS供應商營收排名以元件分類的MEMS市場預估 36 表 四 1比較2017年排名前10大MEMS供應商分別在2010年以及2017年的營收 51 表 五 1 2004成長最快的MEMS公司 58 表 五 2 2006~2017 MEMS代工業務和整體MEMS營收的比較 59 表 五 3 2006~2017 MEMS代工業者的排名變化 60 表 五 4 2003~2017 MEMS供應商(包括代工)的排名變化 62 | |
dc.language.iso | zh-TW | |
dc.title | 微機電系統產業發展歷程與廠商競爭優勢之探析 | zh_TW |
dc.title | A Study on the Industry Evolution and Players’ Competitive Advantages of Micro-Electro-Mechanical-System Industry | en |
dc.type | Thesis | |
dc.date.schoolyear | 108-1 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 洪劍峭,陳超,陳俊忠 | |
dc.subject.keyword | 微機電系統,競爭優勢,晶圓代工,垂直分工, | zh_TW |
dc.subject.keyword | MEMS,Competitive Advantage,Foundry,Vertical Dis-integration, | en |
dc.relation.page | 99 | |
dc.identifier.doi | 10.6342/NTU202000061 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2020-01-20 | |
dc.contributor.author-college | 管理學院 | zh_TW |
dc.contributor.author-dept | 臺大-復旦EMBA境外專班 | zh_TW |
顯示於系所單位: | 臺大-復旦EMBA境外專班 |
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