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| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 陳俊忠 | |
| dc.contributor.author | Wan-Chi Cheng | en |
| dc.contributor.author | 鄭宛綺 | zh_TW |
| dc.date.accessioned | 2021-06-16T17:23:14Z | - |
| dc.date.available | 2017-08-20 | |
| dc.date.copyright | 2012-08-20 | |
| dc.date.issued | 2012 | |
| dc.date.submitted | 2012-08-16 | |
| dc.identifier.citation | References
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'UML Distilled: Applying the Standard Object Modeling Language', Addison-Wesley, Reading, MA, 1998. 8) Ganguli, S. “Coopetition Models in the Context of Modern Business”, The Icfai Journal of Marketing Management, 2007, Vol.VI, No4. 9) Genieser, L. and Gollin, M. “Intellectual property issues in nanotechnology”, Journal of Commercial Biotechnology, May 2007, Vol.13, No.3, pg 195~198. 10) Ghemawat, P. “Distance Still Matters: The Hard Reality of Global Expansion”, Harvard Business Review, September 2001. 11) Gurrum, S.P., Student Member, IEEE; Suman, S.K., Joshi, Y.K., Senior Member, IEEE; and Fedorov, A.G. “Thermal Issues in Next-Generation Integrated Circuits”, IEEE Transactions on Device and Materials Reliability, December 2004, Vol.4, No. 4. 12) Hambrick, D.C. and Fredrickson, J.W. “Are you sure you have a strategy?”, Academy of Management Executive, 2001, Vol.15, No.4. 13) Ho, J.M. 'Air flow based optimal design for notebook computer heat sinks', Mater Thesis of Department of Mechanical Engineering of National Taiwan University of Science and Technology, 2002. 14) Johnson, M.W., Christensen, C.M. and Kagermann, H. “Reinventing Business Model,” Harvard Business Review, December 2008. 15) Kanter, R.M. “Innovation: The Classic Traps”, Harvard Business Review, November 2006. 16) Lado, A. A., Boyd, N.G. and Hanlon, S.C.” Competition, cooperation, and the search for economic rents: a syncretic model”, Academy of Management Review, 1997, 22, pg110~141. 17) Lee, Y.H. 'Optimum Design of Active Heat Sink Cooling System on the Notebook Personal Computer', Master Thesis of Department of Mechanical Engineering of National Chiao Tung University, 2001. 18) Lin, S.J. 'The Study of the Effect of the Gap Between Blower and Heat Exchanger in Notebook PC design', Master Thesis of Department of Mechanical Engineering of Chung Yuan Christian University, 2006. 19) Lindgardt, Z., Reeves, M., Stalk, G. and Deimler, M.S. “Business Model Innovation: When the Game Gets Tough, Change the Game”, The Boston Consulting Group, December 2009. 20) Lindqvist, M. and Ghazi, S.S. “Disrupt or become disrupted: A framework to identify and evaluate disruptive innovations”, Department of Technology Management and Economics Chalmers University of Technology, December 2005. 21) Markides, C.C. “To Diversify or Not to Diversify”, Harvard Business Review, November ~ December 1997. 22) Ogawa, S. and Piller, F.T. “Reducing the Risks of New Product Development,” MIT Sloan Management Review, Winter 2006. 23) Porter, M.E. “The Five Competitive Forces That Shape Strategy”, Harvard Business Review, January 2008. 24) Robertson, T.S. and Gatignon, H. “Development mode: A transaction cost conceptualization”, INSEAD Working Paper Series, 1995. 25) Sepehri, M. and Fayazbakhsh, K. “A quantitative examination of competition, coopetition and cooperation in supply chains”, South African Journal of Business Management, 2011. 26) Short, J.C. and Payne, G.T. “First Mover and Performance: Timing is Everything”, Academy of Management Review, 2008, Vol.33 No.1, pg. 267~270. 27) Sturgeon, T.J. and Kawakami, M. “Global Value Chains in the Electronic Industry: Was the Crisis a Window of Opportunity for Developing Countries?”, The World Bank, September 2010. 28) Ting, J.H. 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Websites 1) http://big5.hdcmr.com/142829.html 2) http://broadband02.ici.ro/program/klingenstein_3d.pdf 3) http://cens.com/cens/html/en/news/news_inner_38816.html 4) http://en.wikipedia.org/wiki/Thermal_management_of_electronic_devices_and_systems#Recent_developments 5) http://media01.24hrstech.com/PDFs/12B1-Nano-Thermo.pdf 6) http://pcdandf.com/cms/magazine/95/3704 7) http://unstats.un.org/unsd/trade/s_geneva2011/refdocs/RDs/GVC%20in%20Electronics%20Industry%20(Sturgeon%20-%20Sep%202010).pdf 8) http://www.appliednanotech.net/tech/CarbAl.php 9) http://www.bccresearch.com/report/top-ten-thermal-management-companies-smc075a.html 10) http://www.businessmodelgeneration.com 11) http://www.chalmers.se/mc2/EN/laboratories/bionano-systems/research/smit-center/nano-thermal/downloadFile/attachedFile_f0/2180260205.pdf?nocache=1260362286.99 12) http://www.digikey.com/purchasingpro/us/en/articles/supply-chain/revenue-for-contract-manufacturers-to-grow-85-percent-in-2011/1142 13) http://www.emasiamag.com/article-5268-unimicronacquiresphoenixtoaimforworldsno1pcbmaker-Asia.html 14) http://www.frostytech.com/top5heatsinks.cfm 15) http://www.ledinside.com/New_dawn_of_the_high_power_LED_lighting_industry_20081104 16) http://www.nec.co.jp/rd/en/innovative/bioplastics/03_4.html 17) http://www.stanford.edu/class/ee311/NOTES/TrendsSlides.pdf | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/63924 | - |
| dc.description.abstract | Heat dissipation is becoming an area of hot interest due to the demand of increase functionalities within electronics under more compact designs. To dissipate heat researchers and businesses have introduced many solutions. From different module designs, to adding cooling fans, to various packaging materials and even heat reducing chip level designs. Organizations, such as iNEMI and ITRS, have listed thermal management as a topic of priority on its roadmap. Thus the importance of heat dissipation to the future of electronic design is undeniable.
The market demand is present, yet even if a new product offering can meet the technical needs, what are the business aspects that need to be considered. How should a new market entrant position itself in the industry to gain a foot hold in the saturated market? Furthermore, how should a new entrant prepare itself against incumbent responses? What type of business model would be most beneficial to the new entrant? These would be the areas of exploration in this paper, which utilizes a company DBC as the case study company. In the highly competitive market of thermal solutions, what market entry strategy is most beneficial for DBC and how this would affect its business model. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-16T17:23:14Z (GMT). No. of bitstreams: 1 ntu-101-R99749010-1.pdf: 1572450 bytes, checksum: bf2966fa545f8bf9d2ccef4436e578b0 (MD5) Previous issue date: 2012 | en |
| dc.description.tableofcontents | Master Thesis Certification.....ii
Acknowledgement.....iii Abstract.....iv List of Figures.....vii List of Tables.....viii Chapter 1: Introduction.....1 1.1 Research Motive.....1 1.2 Research Issues.....2 Chapter 2: Literature Review and Methodology.....3 2.1 Business Model....4 2.2 Porter’s Five Forces.....5 2.3 Competitive Dynamics.....6 2.4 Co-Opetition.....7 2.5 Methodology.....10 Chapter 3: Thermal Industry Introduction and DBC Introduction.....11 3.1 Thermal Industry Introduction.....11 3.1.1 Thermal Management Background.....12 3.1.2 Current Thermal Management Solutions and Limitations.....15 3.1.3 Market Driving Forces.....20 3.1.4 Current Industry Structure.....23 3.1.5 Industry Prospect.....24 3.2 Current Market Structure and Business Model.....25 3.3 DBC Introduction.....30 3.3.1 Company Background.....31 3.3.2 Competitive Strength Assessment and Advantage.....32 3.3.3 Current Activity Configuration.....37 Chapter 4:Market Entry Strategies.....38 4.1 Market Commonality and Resource Similarity.....39 4.2 Market Timing and Expansion.....40 4.2.1 Key Materials/Resources and Processes.....44 4.3 New Business Model.....46 4.3.1 Customer Relationship.....50 4.3.2 Partners Relationship.....52 Chapter 5: Conclusion.....57 5.1 Industry Finding......57 5.2 Action Plan......58 5.3 Managerial Implication.....59 5.4 Paper Contributions.....60 5.5 Future Research.....61 | |
| dc.language.iso | en | |
| dc.subject | 奈米材料 | zh_TW |
| dc.subject | 散熱 | zh_TW |
| dc.subject | 創新 | zh_TW |
| dc.subject | 經營模式 | zh_TW |
| dc.subject | 新創企業 | zh_TW |
| dc.subject | Business Model | en |
| dc.subject | venture | en |
| dc.subject | Innovative | en |
| dc.subject | Thermal Cooling Nano Material | en |
| dc.title | 新創企業之經營模式分析－以創新散熱奈米材料為例 | zh_TW |
| dc.title | Business Model Design for New Venture - Case Analysis of Innovative Thermal Cooling Nano Material | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 100-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 謝明慧,郭佳瑋 | |
| dc.subject.keyword | 新創企業,經營模式,創新,散熱,奈米材料, | zh_TW |
| dc.subject.keyword | Business Model,venture,Innovative,Thermal Cooling Nano Material, | en |
| dc.relation.page | 66 | |
| dc.rights.note | 有償授權 | |
| dc.date.accepted | 2012-08-16 | |
| dc.contributor.author-college | 管理學院 | zh_TW |
| dc.contributor.author-dept | 企業管理碩士專班 | zh_TW |
| 顯示於系所單位： | 管理學院企業管理專班(Global MBA) | |
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| ntu-101-1.pdf 未授權公開取用 | 1.54 MB | Adobe PDF |
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