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  1. NTU Theses and Dissertations Repository
  2. 工學院
  3. 機械工程學系
請用此 Handle URI 來引用此文件: http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/59964
完整後設資料紀錄
DC 欄位值語言
dc.contributor.advisor吳文方(Wen-Fang Wu)
dc.contributor.authorCheng-Hua Wangen
dc.contributor.author王成驊zh_TW
dc.date.accessioned2021-06-16T09:47:40Z-
dc.date.available2019-02-16
dc.date.copyright2017-02-16
dc.date.issued2017
dc.date.submitted2017-01-22
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10.M. –H. Chang, D. Das and M. Pecht, “Interconnect Reliability Assessment of High Power Light Emitting Diodes (LEDs) through Simulation,” 2nd International Conference on Reliability, Safety and Hazard: Risk-Based Technology and Physics-of-Failure Methods, pp. 418-424, Mumbai, December 2010.
11.謝明伸,高功率LED路燈散熱設計之模擬與實驗整合研究,國立臺灣科技大學機械工程學系碩士論文,臺灣,2011年7月。
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15.Y. Deshayes, L. Bechou, F. Verdier and Y. Danto, “Long-term Reliability Prediction of 935nm LEDs Using Failure Laws and Low Acceleration Factor Ageing Tests,” Quality and Reliability Engineering International, Vol. 21, pp. 571-594, 2005.
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dc.identifier.urihttp://tdr.lib.ntu.edu.tw/jspui/handle/123456789/59964-
dc.description.abstract當今世界環保意識提升,高功率發光二極體大量被應用於照明產業,臺灣也提出並積極推動將傳統路燈汰換為高功率發光二極體的政策。就此,本研究提出一套路燈用高功率發光二極體組件於臺灣熱環境下之壽命分佈與可靠度分析評估流程,並探討組件與其封裝元件壽命與可靠度之關係。本研究首先未考慮環境因素之不確定性,以有限元素分析,獲得高功率發光二極體封裝元件在熱環境下之接面溫度,據以評估封裝元件壽命;而後,考慮特定街道路段與規範需求,估算需要之光通量,據以設計發光二極體組件之電路配置。本研究後半段考慮熱環境之不確定性,以蒙地卡羅法模擬同一樣本下之不同熱環境因素,而後依據前半段之分析模型,以及k-out-of-n redundancy之可靠度模型,分析、評估組件與封裝元件之壽命分佈與可靠度。本研究結果顯示,提高熱環境因素變異程度會使封裝元件與組件之壽命分佈變得分散,也發現組件的平均失效時間較封裝元件短,但組件壽命分佈比封裝元件壽命分佈集中。本研究結果可以提供路燈廠商做為參考以利投資決策與維護策略規劃。zh_TW
dc.description.abstractWith enhancing environmental awareness in recent years, high-power light emitting diodes (HPLED) have been applied extensively in lighting industry. The government of Taiwan also promotes and advocates the replacement of traditional street lights by HPLEDs. Owing to the above situations, this thesis proposes a procedure for analyzing and estimating the lifetime distribution and reliability of a typical HPLED assembly of street light under thermal environments in Taiwan. Furthermore, the relation of lifetime and reliability between the assembly and its package components is investigated. In the first part of thesis, it is done by finding the junction temperature of a single HPLED package component under a canonical thermal environment through finite element analysis without considering uncertainties of the environmental factors. The lifetime of the package component is estimated after the junction temperature is obtained. In the second part of thesis, the design of circuit configuration is addressed and discussed from the viewpoint of a assembly and its components.. The code requires luminous flux for a local street is considered as an illustrated example. To reflect real situation, the uncertainty of thermal environments is considered as well by assuming the mixed convection heat transfer coefficient a random variable. Under these assumptions, a mathematical model of k-out-of-n redundancy is established for the lifetime distribution and reliability estimation of the HPLED package components and their assembly used as a street light. Through numerical calculation, it is found that the more of the uncertainty of thermal environments does makes the lifetime distributions of the assembly and its package components more dispersed. However, the lifetime distribution of the assembly is more concentrated than that of its package components. The mean time to failure of assembly is shorter than that of its package components. It is asserted that the results of this thesis can provide information for a street-light contractor to decide its investment as well as plan an appropriate maintenance strategy in advance.en
dc.description.provenanceMade available in DSpace on 2021-06-16T09:47:40Z (GMT). No. of bitstreams: 1
ntu-106-R03522509-1.pdf: 5037589 bytes, checksum: 3cc5352c2f5fca76804dd6dd29e7b22f (MD5)
Previous issue date: 2017
en
dc.description.tableofcontents口試委員會審定書
誌謝 I
摘要 II
ABSTRACT III
目錄 IV
圖目錄 VII
表目錄 XI
符號說明 XII
第一章 緒論 1
1-1 研究動機與目的 1
1-2 文獻回顧 2
1-3 研究方法與流程 6
1-4 本文架構 7
第二章 基本觀念應用概述 9
2-1 傳導原理簡介 9
2-1-2 熱傳導原理 9
2-1-3 熱對流原理 10
2-1-4 熱輻射原理 11
2-2 可靠度與機率函數觀念 13
2-2-1 可靠度定義 13
2-2-2 連續機率分佈模型 14
2-2-3 系統可靠度模型 18
2-3 機率圖紙法 19
2-4 蒙地卡羅法 20
2-5 光學原理簡介 21
2-5-1 光通量 21
2-5-2 照度 21
第三章 封裝元件及組件模型建立 31
3-1 有限元素熱傳分析 31
3-1-1 有限元素法概述 31
3-1-2 有限元素分析軟體介紹 31
3-1-3 有限元素分析流程 32
3-2 封裝元件有限元素模型 33
3-2-1 封裝元件標的簡介 33
3-2-2 結構幾何尺寸 34
3-2-3 材料參數 34
3-2-4 分析作業設定 35
3-2-5 交互作用定義 35
3-2-6 模型假設、負載與邊界條件 36
3-2-7 網格生成 36
3-2-8 封裝元件接面溫度 36
3-3 封裝元件使用壽命與接面溫度關係模型 37
3-3-1 數學模型 37
3-3-2 封裝元件使用壽命預測 38
3-4 組件配置建立 38
3-4-1 光源需求規格 38
3-4-2 電路配置 39
第四章 封裝元件及組件壽命分佈與可靠度分析 51
4-1 考量熱環境因素不確定性 51
4-2 封裝元件使用壽命分佈與可靠度 52
4-2-1 有限元素模型分析 52
4-2-2 封裝元件使用壽命分佈與可靠度分析結果 52
4-3 組件壽命分佈與可靠度 53
4-3-1 組件可靠度數學模型 53
4-3-2 案例分析與組件壽命分佈結果 54
4-4 結果討論 55
4-4-1 封裝元件使用壽命分佈與可靠度分析討論 55
4-4-2 組件壽命分佈與可靠度分析討論 56
第五章 結論 79
參考文獻 81
dc.language.isozh-TW
dc.subject可靠度zh_TW
dc.subject高功率發光二極體zh_TW
dc.subject路燈zh_TW
dc.subject熱環境zh_TW
dc.subject不確定性zh_TW
dc.subject壽命分佈zh_TW
dc.subjectk-out-of-n redundancy系統zh_TW
dc.subjecthigh-power light emitting diodesen
dc.subjectreliabilityen
dc.subjectk-out-of-n redundancyen
dc.subjectlifetime distributionen
dc.subjectuncertaintyen
dc.subjectthermal environmentsen
dc.subjectstreet lighten
dc.title路燈用高功率發光二極體組件於臺灣熱環境下之壽命分佈與可靠度分析zh_TW
dc.titleLifetime Distribution and Reliability Analysis of High-Power LED Assembly of Street Light under Thermal Environments in Taiwanen
dc.typeThesis
dc.date.schoolyear105-1
dc.description.degree碩士
dc.contributor.oralexamcommittee陳希立,詹魁元
dc.subject.keyword高功率發光二極體,路燈,熱環境,不確定性,壽命分佈,k-out-of-n redundancy系統,可靠度,zh_TW
dc.subject.keywordhigh-power light emitting diodes,street light,thermal environments,uncertainty,lifetime distribution,k-out-of-n redundancy,reliability,en
dc.relation.page84
dc.identifier.doi10.6342/NTU201700168
dc.rights.note有償授權
dc.date.accepted2017-01-23
dc.contributor.author-college工學院zh_TW
dc.contributor.author-dept機械工程學研究所zh_TW
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