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標題: | 殘餘應力效應對離型取下的影響 Effect of Residual Stresses on De-bonding Problems for Flexible Electric Devices |
作者: | Ming-Shan Fan 范鳴珊 |
指導教授: | 張正憲(Jeng-Shian Chang),趙聖德(Sheng-Der Chao) |
關鍵字: | 離型取下,殘餘應力,脫層現象,黏著元素,應變能釋放率, FlexUP,residual stress,delamination,cohesive element,energy release rate, |
出版年 : | 2014 |
學位: | 碩士 |
摘要: | 本文首先介紹主動矩陣式有機發光二極體(AMOLED)取下技術,內容涵蓋業界使用的方法,以及工研院(ITRI)所提出之離型取下,再來說明離型取下技術所遇到的問題,如脫層、捲曲、折角現象等,且由於離型取下技術即是透過破壞離型層以取下面板,故研究離型層的力學行為是本研究的主要研究項目之一。
本研究的目的在於研究殘餘應力對於離型取下的影響,利用兩個理論相互驗證,其中理論一將殘餘應力的效應考慮進應變能釋放率中,而理論二可以求得殘餘應力沿厚度方向的分布,而此兩理論需搭配實驗獲得之數據,捲曲試片之撓度與曲率半徑或曲率。 以有限元素模擬軟體Abaqus建立離型取下模型,使用黏著元素來分析離型層的力學行為,透過其牽引力-位移關係的破壞機制來實現,利用位移控制來模擬取下過程,最後由結果中發現考慮殘餘應力並不會影響剝離力量的峰值,且雖然可以透過改變影響殘餘應力的參數進而降低開始剝離後的剝離力量,但要降低峰值只能透過改變結構,而在層間剪應力的分析中,發現有考慮殘餘應力其層間剪應力會低於沒有考慮的,原因為殘餘張應力與彎曲造成的壓應力抵銷,反之若殘餘應力為壓應力,層間剪應力會增加。 This research gives an introduction on AMOLED peeling technique. It includes the methods commonly used by the industry, and the FlexUP technique introduced by the ITRI. Through the introduction, it helps explain the technical difficulties associated with the FlexUP technique. This includes: delimitation, curl and corner phenomenon. Furthermore, FlexUP is a technique solely rely on breaking the de-bonding layers (DBL) in order to peel off the AMOLED, this leads to the mechanical behavior of de-bonding layers become one of the major focus in this research. The research exams the effect of residual stresses on FlexUP technique by using two different theories for mutual authentication. Theory one includes the effect of residual stresses in the energy release rate, while theory two provides the distribution of residual stresses along the thickness of the specimen. Both theories require information of the deflection of the cured specimen and the radius of curvature or curvature through the experimental measurements. The research establishes the FlexUP model through finite element simulation software Abaqus, and uses the cohesive element to analyze the mechanical behavior of the de-bonding layer (DBL). The traction separation law is used to realize the damage of the DBL. In additional to that, displacement control is used to simulate the peeling process. By following the above procedures, we can conclude the residual stresses do not affect the peak value of the peel force. Besides, we can discuss the effect of parameters on the energy release rate and the influence of the residual stresses on the interlaminar stresses. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/5476 |
全文授權: | 同意授權(全球公開) |
顯示於系所單位: | 應用力學研究所 |
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