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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 段維新(Wei-Hsing Tuan) | |
dc.contributor.author | Chun-Yu Lin | en |
dc.contributor.author | 林君郁 | zh_TW |
dc.date.accessioned | 2021-06-16T02:34:05Z | - |
dc.date.available | 2016-08-10 | |
dc.date.copyright | 2015-08-10 | |
dc.date.issued | 2014 | |
dc.date.submitted | 2015-07-28 | |
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dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/53940 | - |
dc.description.abstract | 直接接合鋁基板被廣泛運用在電子電路基板與能源模組上,然而鋁的氧化層在其與陶瓷基板接合時形成阻礙。本研究的研究目的是瞭解金屬鋁與氧化鋁接合界面的微結構、機械性質與導熱性。金屬鋁/氧化鋁界面的接合是藉由高於金屬鋁熔點(660C)之接合溫度使鋁與氧化鋁進行液態接合,接合過程在氮氣環境下進行以減少鋁的氧化,並嘗試不同的接合溫度來獲得接合良好的界面。
本研究對不同接合溫度下所得到之金屬鋁/氧化鋁的接合界面進行相分析與微結構觀察,並使用四點彎曲測試以及閃光法來評估接合後的性質。由於接合過程在金屬鋁層中產生大量的孔洞,因此本研究也探討了孔洞的形成機制以及孔洞對接合性質的影響。這些孔洞的存在會大幅降低界面的接合面積,因而降低了界面的接合強度與熱傳導性質。雖然較高的接合溫度才能得到接合良好的界面,但孔洞的面積也會隨接合溫度提高而增加。因此對於得到金屬鋁/氧化鋁的良好接合界面,接合溫度的選擇十分重要。 | zh_TW |
dc.description.abstract | Direct bonded aluminum (DBA) substrates can serve as carriers for power electronic components. However, the aluminum is easily oxidized. The oxide layer formed on the metallic aluminum surface prevents the formation of a strong bonding between aluminum and ceramic.
The aim of the present study provides a detailed characterization on the processing and interfacial characterization of Al/Al2O3 joints. The bonding process was held above the melting temperature of Al, so the Al could be bonded to Al2O3 at its liquid state. The microstructure observation and phase analysis were carried out on the interface between Al and Al2O3. The interfacial strength of Al/Al2O3 interfaces and the flexural strength of Al2O3/Al/Al2O3 joints were determined by a four-point bending test. The thermal conductivities of the bilayer and trilayer bonding specimens was measured by flash method. After bonding at elevated temperatures, many pores were observed at the interface. The presence of pores seriously damaged the properties of bonding specimens. The relationships between interfacial properties and mechanical properties or thermal conductivity are established and the mechanism for pore formation is proposed. | en |
dc.description.provenance | Made available in DSpace on 2021-06-16T02:34:05Z (GMT). No. of bitstreams: 1 ntu-103-R01527022-1.pdf: 12400090 bytes, checksum: dd7bd8ae5432ec7d4a13339cc64a3d2a (MD5) Previous issue date: 2014 | en |
dc.description.tableofcontents | 口試委員會審定書 #
誌謝 i 中文摘要 ii ABSTRACT iii CONTENTS v LIST OF FIGURES viii LIST OF TABLES xvi Chapter 1 Introduction 1 Chapter 2 Literature survey 3 2.1 Direct bonding 3 2.1.1 Direct bonding of metals to ceramics 3 2.1.2 Development of direct bonded aluminum. 4 2.2 Joining of Al2O3 to Al 7 2.2.1 Wetting of Al on Al2O3 7 2.2.2 Reactions in Al/Al2O3 system and morphology of Al/Al2O3 interface 11 2.3 Metal-ceramic interface 17 2.3.1 Adhesion strength 17 2.3.2 Fracture behavior of metal/oxide interface 18 2.3.3 Metal-oxide adhesion measurement 20 2.3.4 The load displacement curve in Al/Al2O3 system 25 2.3.5 Heat transfer 28 Chapter 3 Experimental Procedures 32 3.1 Starting Materials 32 3.1.1 Alumina substrate 32 3.1.2 Aluminum layer 32 3.2 Joining process 33 3.3 Four-point bending test 35 3.4 Thermal conductivity measurement 37 Chapter 4 Results 39 4.1 Raw materials 39 4.2 Bonding behavior 42 4.3 Weight change and thickness change 46 4.4 Microstructure observation on the joint 48 4.4.1 Interface morphology 48 4.4.2 Cross-section microstructure 56 4.5 Thermal diffusivity measurement 61 4.6 Four-point bending test 63 Chapter 5 Discussion 71 5.1 Formation of secondary phases 71 5.2 Mechanism of pore formation 75 5.3 Fracture behavior 82 5.3.1 Fracture process 82 5.3.2 Crack propagation 85 5.3.3 Adhesion strength 86 5.3.4 Joint strength 87 5.3.5 Possible error in steady-state energy release rate 88 5.4 Thermal conductivity 90 Chapter 6 Conclusions 93 REFERENCES 95 | |
dc.language.iso | en | |
dc.title | 鋁與氧化鋁接合與其界面性質之研究 | zh_TW |
dc.title | Joining of Alumina to Aluminum and Its Interfacial Properties | en |
dc.type | Thesis | |
dc.date.schoolyear | 103-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 薛人愷(Ren-Kae Shiue),薛承輝(Chun-Hway Hsueh),施劭儒(Shao-Ju Shih) | |
dc.subject.keyword | 鋁,氧化鋁,接合:鋁/氧化鋁界面,直接接合鋁,界面強度,熱傳導係數, | zh_TW |
dc.subject.keyword | Al,Al2O3,bonding,Al/Al2O3 interface,Direct bonded aluminum,Interfacial strength,Thermal conductivity, | en |
dc.relation.page | 103 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2015-07-28 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 材料科學與工程學研究所 | zh_TW |
顯示於系所單位: | 材料科學與工程學系 |
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