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標題: | 光學式矽穿孔三維形貌量測系統與技術之研發 Development on an optical profile measuring system and technique for through silicon via (TSV) |
作者: | Hou-Yu Chen 陳厚佑 |
指導教授: | 陳亮嘉(Liang-Chia Chen) |
關鍵字: | 三維積體電路,矽穿孔,矽通道孔,粗糙度,全像術,雙曝光法, automated optical inspection (AOI),three-dimensional integrated circuits,through silicon via (TSV),roughness,holography,double exposure, |
出版年 : | 2015 |
學位: | 碩士 |
摘要: | 本研究主要為解決線上IC (integrated circuit)晶片檢測之需求,利用側壁產生之散射光與參考波間的干涉,重建矽穿孔(Through silicon via, TSV)之形貌。矽通道孔(Via)是連接各層的通道孔,而側壁的粗糙度不佳,將造成限制層的部分應力堆積所導致的破損。TSV的高深寬比造成量測上的困難,故本研究旨針對矽通道孔(Vias)的量測,利用全像術(Holography)結合雙曝光法(two-wavelength method),藉由紅外線穿透過矽穿孔所產生的散色光,與參考光互相干涉,產生干涉條紋,此干涉條紋帶有光強度分佈與兩道光之間的相位差。任一道光經由CCD接收後,就可將另一道光波之相位重建出來,藉此重建出矽穿孔之側壁形貌。 量測實際176.78 μm線寬,量測值為170.39 μm,經由30次相位跳動標準差為8.86 μm,由於重建影像難以判斷實際之邊緣位置,為其主要誤差來源。縱向資訊的依據為相位資訊,由於雙曝光法在分別取像期間,環境因子發生變化,則其量測結果會有誤差,目前量測結果具有物體形貌趨勢,但相位資訊多雜訊,目前仍難以進行量化量測。 The research focuses on the side wall profile measurement, especially for through silicon via (TSV) profile measurement. Via is critical to the electronic conductivity of 3-D IC (integrated circuits). Due to property of high aspect ratio of TSV, the measurement by vias is an easy task. The research applies the Holographic technique with the two-wavelength double exposure method to detect the side wall profile accurately. The methodology was proposed to employ infrared to penetrate the TSV and use scattered light to be interfered with the reference light for detecting the optical phase difference regarding to the via profile. In experiment, we used a grating target with a pitch of 176.78μm line width for measurement verification. The experimental results showed that the standard deviation was 8.86 μm in a 30 time repeatability measurement. The experimental results indicate that the developed method has not so far been effective to reconstruct the side wall profile of vias. More investigation has to be put into the research for the realization of the work. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/52034 |
全文授權: | 有償授權 |
顯示於系所單位: | 機械工程學系 |
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