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| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 盧奕璋(Yi-Chang Lu) | |
| dc.contributor.author | Chin-Khai Tang | en |
| dc.contributor.author | 陳晉凱 | zh_TW |
| dc.date.accessioned | 2021-06-15T13:42:50Z | - |
| dc.date.available | 2016-02-15 | |
| dc.date.copyright | 2016-02-15 | |
| dc.date.issued | 2015 | |
| dc.date.submitted | 2015-12-25 | |
| dc.identifier.citation | [1] B. Lin, Optical Lithography: Here is Why, 1st ed, SPIE, Washington, USA, pages 95-132 and 323-441, 2009.
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| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/51649 | - |
| dc.description.abstract | The advances in optical projection lithography have ensured the steady continuation of Moore's law. However, the wavelength of light sources has reached the lowest limit of 193-nm, and optical diffraction has become a major problem. Thus, other cost effective solutions are urgently needed. Electron-beam maskless lithography is a powerful technology capable of very-high resolution writing. However, electron-beam maskless lithography suffers from slow electron-beam scanning process and low throughput. In recent years, new research on multiple electron-beam direct-write systems that use massively parallel electron-beam emitters to achieve fast scanning process and high WPH has gained popularity. In multiple electron-beam direct-write systems, one of the technical challenges is to transfer very large amounts of electron-beam layout data that controls electron-beam emitters from the data centers to multiple electron-beam direct-write systems. Furthermore, due to the enormous data transfer rates, a large number of hardware decoders are required in multiple electron-beam direct-write systems. Each hardware decoder must be able to decompress EBL data at high data rates, and the hardware resource requirements should be low so that the cost of implementing and operating the multiple electron-beam direct-write systems can be minimized.
In this dissertation, a lossless electron-beam layout data compression algorithm, LineDiff Entropy, and its low-complexity high-performance hardware decoder for multiple electron-beam direct-write lithography systems are proposed. The algorithm compares consecutive data scanlines and encodes the data based on the change/no-change of pixel values and the lengths of pixel sequences. Then, the compaction steps of data omission, merging, and encoding of consecutive long identical scanlines are applied. Then, custom prefix codes are assigned to data with high occurrence frequency. The hardware decoder is designed as three circuit blocks that perform entropy decoding, de-compaction, and electron-beam layout data generation through parallel outputs. The hardware decoder only requires minimum resource.The results demonstrate that our algorithm can achieve excellent compression performance and that the hardware decoder can decompress data at very high data rates. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-15T13:42:50Z (GMT). No. of bitstreams: 1 ntu-104-D98943039-1.pdf: 2160435 bytes, checksum: b6414f126d2c745b4a26267a48ca3b78 (MD5) Previous issue date: 2015 | en |
| dc.description.tableofcontents | Acknowledgements …………………….. vii
Abstract …………………….. ix List of Tables …………………….. xvi List of Figures …………………….. xviii Chapter 1. Introduction …………………….. 1 1.1 The Challenge of Optical Projection Lithography …………………….. 1 1.2 Electron-Beam Maskless Lithography …………………….................... 2 1.3 Overview of Dissertation ……………………………………………… 6 1.4 Organization of Dissertation …………………………………………... 7 Chapter 2. Multiple Electron-Beam Direct-Write Systems …………………….. 9 2.1 MAPPER ………………………………………………………………. 9 2.1.1 The Architecture of MAPPER ………………………………... 9 2.1.2 The Writing Method of MAPPER ……………………………. 10 2.1.3 The Data Transfer Rates of MAPPER ………………………... 12 2.2 Reflective Electron Beam Lithography (REBL) ………………………. 13 2.2.1 The Architecture of REBL ……………………………………. 13 2.2.2 The Writing Method of REBL ………………………………... 14 2.2.3 The Data Transfer Rates of REBL ……………………………. 16 2.3 Data Transfer Requirements of MEBDW Systems ……………………. 16 Chapter 3. Electron-Beam Layout Data …………………….. 19 3.1 Electron Proximity Effect ……………………………………………… 19 3.2 Proximity Effect Correction and Data Preparation ……………………. 21 3.3 Idealized Pixel Printing Model ………………………………………… 24 3.4 The Data Redundancy in EBL Data …………………………………… 25 Chapter 4. Electron-Beam Layout Data Compression Algorithms …………………….. 27 4.1 C4, BC4, BGC3, and BRGC3 …………………………………………. 28 4.1.1 Context-Based Bit-Level Prediction ………………………… 30 4.1.2 Context-Based Block-Level Prediction ……………………… 31 4.1.3 Block-Level Copy …………………………………………… 32 4.1.4 HCC ………………………………………………………….. 33 4.1.5 The Strengths and Weaknesses of BC4 ……………………… 34 4.2 Corner, Corner2, CornerGray, and Corner2-EPC ……………………... 35 4.2.1 Corner2-EPC Transformation ……………………………….. 36 4.2.2 Corner2-EPC Entropy Encoding …………………………….. 37 4.2.3 The Strengths and Weaknesses of Corner2-EPC ……………. 38 4.3 Compression Methods of MEBDW Systems ………………………….. 38 4.3.1 Instruction-Based Hybrid Method (IBHM) of TSMC ………. 38 4.3.2 REBL Compression Algorithm ……………………………… 39 4.4 Compression Algorithm and Hardware Decoder for MEBDW Systems 39 Chapter 5. The LineDiff Entropy Compression Algorithm …………………….. 41 5.1 LineDiff Encoding ……………………………………………………... 42 5.2 LineDiff Compaction ………………………………………………….. 43 5.3 Entropy Encoding ……………………………………………………… 46 5.4 Implementation and Performance of LineDiff Entropy Compression … 54 Chapter 6. The LineDiff Entropy Hardware Decoder …………………….. 60 6.1 The Design of LineDiff Entropy Hardware Decoder ………………….. 60 6.2 Entropy Decoder ………………………………………………………. 63 6.3 LineDiff De-compactor ………………………………………………... 64 6.4 LineDiff Decoder ……………………………………………………… 66 6.5 Analysis of LineDiff Entropy Hardware Decoder Performance ………. 72 Chapter 7. Benchmark Results …………………….. 74 7.1 FPGA Synthesis Results ……………………………………………….. 74 7.2 Benchmark Data ……………………………………………………….. 76 7.3 Compression Results …………………………………………………... 77 7.4 Decompression Results ………………………………………………... 80 Chapter 8. Concluding Remarks and Future Work …………………….. 87 8.1 Concluding Remarks …………………………………………………... 87 8.2 Future Work …………………………………………………………… 88 Bibliography …………………….. 92 Vita …………………….. 103 Publication List …………………….. 105 | |
| dc.language.iso | en | |
| dc.title | 用於多電子束直寫系統之佈局資料壓縮演算法與其硬體解碼器設計 | zh_TW |
| dc.title | Layout Data Compression Algorithm and Its Hardware Decoder Design for Multiple Electron-Beam Direct-Write Systems | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 104-1 | |
| dc.description.degree | 博士 | |
| dc.contributor.oralexamcommittee | 顏家鈺(Jia-Yush Yen),蔡坤諭(Kuen-Yu Tsai),丁建均(Jian-Jiun Ding),劉宗德(Tsung-Te Liu) | |
| dc.subject.keyword | 無光罩微影技術,電子束微影技術,電子束直寫,資料壓縮,硬體解碼器, | zh_TW |
| dc.subject.keyword | Maskless lithography,electron beam lithography,multiple electron-beam direct-write,data compression,hardware decoder, | en |
| dc.relation.page | 106 | |
| dc.rights.note | 有償授權 | |
| dc.date.accepted | 2015-12-25 | |
| dc.contributor.author-college | 電機資訊學院 | zh_TW |
| dc.contributor.author-dept | 電子工程學研究所 | zh_TW |
| 顯示於系所單位： | 電子工程學研究所 | |
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