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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 駱尚廉(Shang-Lien Lo) | |
dc.contributor.author | Meng-Wei Pan | en |
dc.contributor.author | 潘孟暐 | zh_TW |
dc.date.accessioned | 2021-06-15T11:17:12Z | - |
dc.date.available | 2021-08-23 | |
dc.date.copyright | 2016-08-23 | |
dc.date.issued | 2016 | |
dc.date.submitted | 2016-08-19 | |
dc.identifier.citation | Al-Harahsheh, M., Kingman, S.W., 2004. “Microwave-assisted leaching—a review.” Hydrometallurgy 73, 189-203.
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dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/49141 | - |
dc.description.abstract | 根據ICP-OES的分析,本實驗使用之廢棄印刷電路板中,金的濃度可達20ppmw以上;相較於金礦中,濃度只要達0.5ppmw即有開採價值,高出百倍有餘。此外,亦含有銀、鉑、鈀等貴金屬,銅的含量更是佔總重的一半以上。因此,若能有效的回收這些金屬資源,將城市當成一座礦場,除了可以減少開採礦石時對環境造成的衝擊,亦可以達到物質循環再利用的目的。本研究利用微波是由內而外加熱的特性,裂解廢棄之印刷電路板,使電路板層與層之間產生分離,進而提升金屬回收的效率;除此之外,亦可以減少傳統機械破碎法中粉塵散逸以及質量損失的問題。根據熱重分析的結果,印刷電路板的最大失重峰發生在350℃左右,可視為裂解反應主要發生的溫度;而三百瓦的微波功率可達到這個效果。經裂解之後的印刷電路板,經過三階段的冶金程序溶出金屬:前兩階段利用硫酸,輔以過氧化氫,溶解銅、錫等賤金屬,以減少後續對貴金屬所造成的屏蔽效應;之後,利用硫脲將金、銀等貴金屬溶出,達到金屬分別回收的目的。本研究旨在提供一個快速、設備成本低廉、低環境衝擊,且能夠有效的回收金屬資源的廢棄印刷電路板處理技術。 | zh_TW |
dc.description.abstract | The concentration of gold in waste printed circuit board (WPCB) used in this study can be up to 20 ppmw, whereas it is only 0.5 ppmw in the gold ore. Moreover, it also contains other precious metals such as silver, platinum, and palladium. Therefore, as one of the most important branches of the waste electrical and electronic equipment (WEEE) stream, if WPCBs can be recycled properly, the city will be an abundant vein of various metals. Besides, urban mining not only achieves materials recycling but also diminishes environmental impact from ore mining. The aim of this study is to provide a simple, high efficiency, and low environment impact technique to recover the metals in WPCBs. By microwave-enhanced pyrolysis (MEP), the inner layers of WPCBs separated, and thus metal recovery efficiency was enhanced. The maximum weight loss in thermogravimetric analysis (TGA) occurred at 350 °C, which was also achieved by MEP at 300W. Afterwards, the pyrolyzed WPCB was treated by a three-step hydrometallurgical process to recover metals separately. The first two steps are sulfuric acid leaching to dissolve copper and tin. The final stage is the leaching of gold, palladium, and silver by using thiourea and ferric ion. | en |
dc.description.provenance | Made available in DSpace on 2021-06-15T11:17:12Z (GMT). No. of bitstreams: 1 ntu-105-R03541124-1.pdf: 3111809 bytes, checksum: 9c45d103c056c9d7298c2c1e3e2c230f (MD5) Previous issue date: 2016 | en |
dc.description.tableofcontents | 目 錄
中文摘要 i 英文摘要 ii 目錄 iii 表目錄 v 圖目錄 vi 第一章 緒論 1 1.1. 研究背景與動機 1 1.2. 研究目的 2 1.3. 研究內容 3 第二章 文獻回顧 4 2.1. 印刷電路板 4 2.1.1. 印刷電路板的組成 4 2.1.2. 印刷電路板的種類與製程 5 2.2. 廢棄印刷電路板回收意義 13 2.3. 廢棄印刷電路板資源化技術 16 2.2.1. 機械物理技術 16 2.2.2. 熱處理技術 18 2.2.3. 濕法冶金技術 21 2.4. 微波裂解技術應用於廢棄電路板的處理 24 2.3.1. 微波加熱反應 24 2.3.2. 微波增進裂解WPCBs 26 第三章 材料與方法 27 3.1. 研究架構 27 3.2. 研究流程與設備 29 3.2.1. PCB物理性質及成分分析 29 3.2.1.1. 元素分析 29 3.2.1.2. 近似分析與熱重分析 30 3.2.1.3. 以微波消化法調查組成元素 31 3.2.2. 微波裂解設備 32 3.2.3. 金屬溶出實驗 35 第四章 結果與討論 37 4.1. 印刷電路板之基本性質 37 4.1.1. 元素分析與近似分析 38 4.1.2. 印刷電路板之熱重分析 39 4.1.3. 組成元素分析 40 4.2. 微波誘發裂解印刷電路板 44 4.2.1. 不同微波功率之升溫情形 44 4.2.2. 微波功率與升溫速率、最高溫度的關係 47 4.2.3. 微波時間與印刷電路板減量之變化 48 4.3. 金屬溶出效率比較 50 4.3.1. 銅 50 4.3.2. 鋁 52 4.3.3. 金 54 第五章 結論與建議 55 5.1. 結論 55 5.2. 建議 56 參考文獻 57 | |
dc.language.iso | zh-TW | |
dc.title | 微波增進裂解廢棄印刷電路板 | zh_TW |
dc.title | Microwave-Enhanced Pyrolysis of
Waste Printed Circuit Board | en |
dc.type | Thesis | |
dc.date.schoolyear | 104-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 闕蓓德(Pei-Te Chiueh),胡景堯(Ching-Yao Hu) | |
dc.subject.keyword | 電子廢棄物,廢棄印刷電路板,微波增進裂解,金屬回收,硫?冶金, | zh_TW |
dc.subject.keyword | Metal Recovery,Microwave-Enhanced Pyrolysis,Thiourea Leaching,Waste Electrical and Electronic Equipment,Waste Printed Circuit Boards, | en |
dc.relation.page | 68 | |
dc.identifier.doi | 10.6342/NTU201603089 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2016-08-20 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 環境工程學研究所 | zh_TW |
顯示於系所單位: | 環境工程學研究所 |
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