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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 林江珍(Jiang-Jen Lin) | |
dc.contributor.author | Rui-Xuan Dong | en |
dc.contributor.author | 董睿軒 | zh_TW |
dc.date.accessioned | 2021-06-15T07:08:03Z | - |
dc.date.available | 2015-11-30 | |
dc.date.copyright | 2010-11-15 | |
dc.date.issued | 2010 | |
dc.date.submitted | 2010-11-05 | |
dc.identifier.citation | Chapter 1:
(1) Cho, K. H.; Park, J. E.; Osaka, T.; Park, S. G. Electrochimica Acta 2005, 51, 956–960. (2) Sun, S.; Murray, C. B.; Weller, D.; Folks, L.; Moser, A. Science 2000, 287, 1989–1992. (3) Park, S. J.; T. Taton, A.; Mirkin, C. A. Science 2002, 295, 1503–1506. (4) Wang, J.; Gudiksen, M. S.; Duan, X.; Cui, Yi.; Lieber, C. M. Science 2001, 293, 1455–1457. (5) Jiang, H.; Manolache, S.; Wong, A. C. L.; Denes, F. S. J. Appl. Polym. Sci. 2004, 93, 1411–1422. (6) Hirano, S.; Wakasa, Y.; Saka, A.; Yoshizawa, S.; Oya-Seimiya, Y.; Hishinuma, Y.; Nishimura, A.; Matsumoto, A.; Kumakura, H. Physica C 2003, 392, 458–462. (7) Ren, X. L.; Tang, F. Q. Acta Chim. Sinica 2002, 60, 393–397. (8) Yeo, S. Y.; Lee, H. J.; Jeong, S. H. J. Mater. Sci. 2003, 38, 2143–2147, (9) Wang, H.; Qiao, X.; Chen, J.; Ding, S. Colloids and Surfaces A: Physicochem. Eng. Aspects, 2005, 256, 111–115. (10) Zhang, J.; Tanha, J.; Hirama, T.; To, N. H. K. R.; Tong-Sevinc, H.; Stone, E.; Brisson, J.; MacKenzie, C. R. J. Mol. Biol. 2004, 335, 49–56. (11) Chimentao, R. J.; Kirm, I.; Medina, F.; Rodriguez, X.; Cesteros, Y.; Salagre, P.; Sueiras, J. E. Chem. Commun. 2004, 7, 846–847. (12) He, B.; Tan, J. J.; Liew, K. Y.; Liu, H. J. Mol. Catal. A: Chem. 2004, 221, 121–126. (13) Wang, H.; Qiao, X.; Chen, J.; Ding, S. Colloids and Surfaces A: Physicochem. Eng. Aspects 2005, 256, 111–115. (14) Yang, S.; Cai, W.; Liu, G.; Zeng, H.; Liu, P. J. Phys. Chem. C 2009, 113, 6480–6484. (15) Wegner, K.; Walker, B.; Tsantilis, S.; Pratsinis, S. E. Chem. Eng. Sci. 2002, 57, 1753–1762. (16) Pillai, Z. S. ; Kamat, P. V. J. Phys. Chem. B, 2004, 108, 945–95. (17) Chou, K. S.; Ren, C. Y. Mater. Chem. Phys. 2000, 64, 241–246. (18) Sun, Y.; Mayers, B.; Herricks, T.; Xia, Y. Nano Lett. 2003, 3, 955–960. (19) Sun, Y.; Xia, Y. Science, 2002, 298, 2176–2179. (20) Chen, D. H.; Huang, Y. W. J. Colloid Interface Sci. 2002, 255, 299–302. (21) Wang, X.; Itoh, H.; Naka, K.; Chujo, Y. Langmuir, 2003, 19, 6242–6246. (22) Johans, C.; Clohessy, J.; Fantini, S.; Kontturi, K.; Cunnane, V. J. Electrochem. Commun. 2002, 4, 227–230. (23) Zhang, Y.; Chen, F.; Zhuang, J.; Tang, Y.; Wang, D.; Wang, Y.; Dong, A.; Ren, N. Chem. Commun. 2002, 24, 2814–2815. (24) Ma, H.; Yin, B.; Wang, S.; Jiao, Y.; Pan, W.; Huang, S.; Chen, S.; Meng, F. Chem. Phys.Chem. 2004, 24, 68–75. (25) Zhou, Y.; Yu, S. H.; Wang, C. Y.; Li, X. G.; Zhu, Y. R.; Chen, Z. Y. Adv. Mater. 1999, 11, 850–852. (26) Socol, Y.; Abramson, O.; Gedanken, A.; Meshorer, Y.; Berenstein, L.; Zaban, A. Langmuir, 2002, 18, 4736–4740. (27) Shchukin, D. G.; Radtchenko, I. L.; Sukhorukov, G. B. ChemPhysChem, 2003, 4, 1101–1103. (28) Jin, R.; Cao, Y. C.; Hao, E.; Metraux, G. S.; Schatz, G. C.; Mirkin, C. A. Nature, 2003, 425, 487–490. (29) Liu, F. K.; Huang, P. W.; Chang, Y. C.; Ko, F. H.; Chu, T. C. J. Mater. Res. 2004, 19, 469–473. (30) Komarneni, S.; Li, D.; Newalkar, B.; Katsuki, H.; Bhalla, A. S. Langmuir, 2002, 18, 5959–5962. (31) Yin, H.; Yamamoto, T.; Wada, Y.; Yanagida, S. Mater. Chem. Phys. 2004, 83, 66–70. (32) Hornebecq, V.; Antonietti, M.; Cardinal, T.; Treguer-Delapierre, M. Chem. Mater. 2003, 15, 1993–1999. (33) Choi, S. H.; Lee, S. H.; Hwang, Y. M.; Lee, K. P.; Kang, H. D. Radiat. Phys. Chem. 2003, 67, 517–521. (34) Tsuji, T.; Kakita, T;Tsuji, M. Appl. Surf. Sci. 2003, 206, 314–320. (35) Zheng, X.; Zhu, L.; Wang, X.; Yan, A. & Xie, Y. J. Cryst. Growth 2004, 260, 255–262. (36) Zhang, J.; Han, B.; Liu, M.; Liu, D.; Dong, Z.; Liu, J.; Li, D.; Wang, J.; Dong, B.; Zhao, H.; Rong, L. J. Phys.Chem. B 2003, 107, 3679–3683. (37) McLeod, M. C.; McHenry, R. S.; Beckman, E. J.; Roberts, C. B. J. Phys. Chem. B 2003, 107, 2693–2700. (38) Naik, R. R.; Stringer, S. J.; Agarwal, G.; Jones, S. E.; Stone, M. O. Nature 2002, 1, 169–172. (39) Kowshik, M.; Ashtaputre, S.; Kharrazi, S.; Vogel, W.; Urban, J.; Kulkarni, S. K.; Paknikar, K. M. Nanotechnology 2003, 14, 95–100. (40) Shankar, S. S.; Rai, A.; Ahmad, A.; Sastry, M. J. Colloid Interface Sci. 2004, 275, 496–502. (41) Sardar, R.; Park, J. W.; Shumaker-Parry, J. S. Langmuir 2007, 23, 11883–11889. (42) Longenberger, L.; Mills, G. J. Phys. Chem., 1995, 99, 475–478. (43) Sakai, T.; Alexandridis, P. Chem. Mater. 2006, 18, 2577–2583. (44) Pastoriza-Santos, I.; Liz-Marzan, L. M. Nano Lett. 2002, 2, 903–905. (45) Kurihara, L.K.; Chow, G. M.; Schoen, P. E. NanaShuchued Mater. 1995, 5, 607–613. (46) Sondi, I.; Goia, D. V.; Matijevic, E. J. Colloid Interface Sci. 2003, 260, 75–81. (47) Yin, Y.; Li, Z. Y.; Zhong, Z.; Gates, B.; Xia, Y.; Venkateswaran, S. J. Mater. Chem. 2002, 12, 522–527. (48) Ding, X.; Xu, R.; Liu, H.; Shi, W.; Liu, S.; Li, Y. Crystal Growth & Design, 2008, 8, 2982–2985. (49) Su, H. L.; Chou, C. C.; Hung, D. J.; Lin, S. H.; Pao, I. C.; Lin, J. H.; Huang, F. L.; Dong, R. X.; Lin, J. J. Biomaterials 2009, 30, 5979–5987. Chapter 2: (1) M. Aizawa and J. M. Buriak, Chem. Mater. 2007, 19, 5090. (2) J. Chen, B. Wiley, J. McLellan, Y. Xiong, Z. Y. Li and Y. Xia, Nano Lett. 2005, 5, 2058. (3) L. N. Lewis, Chem. Rev. 1994, 94, 857. (4) S. M. Magana, P. Quintana, D. H. Aguilar, J. A. Toledo, C. Angeles-Chavez, M. A. Cortes, L. Leon, Y. Freile-Pelegrin, T. Lopez and R. M. T. Sanchez, J. Mol. Catal. 2008, 281, 192. (5) A. Callegari, D. Tonti and M. Chergui, Nano Lett. 2003, 3, 1565. (6) G. Nesher, G. Marom and D. Avnir, Chem. Mater. 2008, 20, 4425. (7) K. Niesz, M. Grass and G. A. Somorjai, Nano Lett. 2005, 5, 2238. (8) C. J. Murphy and N. R. Jana, Adv. Mater. 2002, 14, 80.. (9) J. Zhang, H. Liu, P. Zhan, Z. Wang and N. Ming, Adv. Funct. Mater. 2007, 17, 1558. (10) B. Yin, H. Ma, S. Wang and S. Chen, J. Phys. Chem. B 2003, 107, 8898. (11) B. Jose, J. H. Ryu, Y. J. Kim, H. Kim, Y. S. Kang, S. D. Lee and H. S. Kim, Chem. Mater. 2002, 14, 2134. (12) L. B. Luo, S. H. Yu, H. S. Qian and T. Zhou, J. Am. Chem. Soc. 2005, 127, 2822. (13) D. H. Chen and Y. W. Huang, J. Colloid Interface Sci. 2002, 255, 299. (14) T. Sakai and P. Alexandridis, Langmuir 2005, 21, 8019. (15) T. Sakai and P. Alexandridis, J. Phys. Chem. B 2005, 109, 7766. (16) A. Podlipensky, A. Abdolvand, G. Seifert, H. Graener, O. Deparis and G. P. Kazansky, J. Phys. Chem. B 2004, 108, 17699. (17) N. Kakuta, N. Goto, H. Ohkita and T. Mizushima, J. Phys. Chem. B 1999, 103, 5917. (18) K.–i. Shimizu, S.–i. Komai, T. Kojima, S. Satokawa and A. Satsuma, J. Phys. Chem. C 2007, 111, 3480. (19) K.–i. Shimizu, A. Satsuma, Appl. Catal. B 2007, 77, 202. (20) J. Shibata, K.–i. Shimizu, Y. Takada, A. Shichi, H. Yoshida, S. Satokawa, A. Satsuma and T. Hattori, J. Catal. 2004, 227, 367. (21) N. Aihara, K. Torigoe and K. Esumi, Langmuir 1998, 14, 4945. (22) J. Liu, J. B. Lee, D. H. Kim and Y. Kim, Colloids Surf. A 2007, 302, 276. (23) Y. C. Chang, C. C. Chou and J. J. Lin, Langmuir 2005, 21, 7023. (24) J. J. Lin, Y. C. Hsu and K. L. Wei, Macromolecules 2007, 40, 1579. (25) N. Yang, K. Aoki and H. Nagasawa, J. Phys. Chem. B 2004, 108, 15027. (26) H. Jiang, K. Moon, F. Hua and C. P. Wong, Chem. Mater. 2007, 19, 4482. (27) K. S. Moon, H. Dong, R. Maric, S. Pothukuchi, A. Hunt, Y. Li, C. P. Wong, J. Electron. Mater. 2005, 34, 2. (28) X. Ding, R. Xu, H. Liu, W. Shi, S. Liu, Y. Li, Crystal Growth & Design, 2008, 8, 2982. (29) H. Van Olphen, Determination of Surface Areas of Clays-Evaluation of Methods, In International Symposium on Surface Area Determination, D. H. Everett and R. H. Eds. Ottewill, Butterworth: London, 1969. (30) (a) E. J. M. Hensen and B. Smit, J. Phys. Chem. B 2002, 106, 12664; (b) D. Porter, E. Metcalfe and M. J. K. Thomas, Fire Mater. 2000, 24, 45; (c) E. P. Giannelis, Adv. Mater. 1996, 8, 29. (31) E. S. H. Leach, A. Hopkinson, K. Franklin and J. S. Van Duijneveldt, Langmuir 2005, 21, 3821. (32) A. Usuki, N. Hasegawa, H. Kadoura and T. Okamoto, Nano. Lett. 2001, 1, 271. (33) J. J. Lin and Y. M. Chen, Langmuir 2004, 20, 4261. (34) H. Van Olphen, Clay Colloid Chemistry, 2nd ed., John Wiley & Sons: New York, 1997. (35) A. Top and S. Ulku, Appl. Clay Sci. 2004, 27, 13. (36) R. Jin, Y. W. Cao, C. A. Mirkin, K. L. Kelly, G.. C. Schatz and J. G. Zheng, Science 2001, 294, 1901. (37) S. M. Heard, F. Grieser, C. G. Barraclough and J. V. Sanders, J. Colloid Interface Sci. 1983, 93, 545. Chapter 3: (1) Ajayan, P. M. Chem. Rev. 1999, 99, 1787−1799. (2) Ajayan, P. M.; Ebbesen, T. W. Rep. Prog. Phys. 1997, 60, 1025−1062. (3) Ajayan, P. M.; Stephan, O.; Colliex, C.; Trauth, D. Science 1994, 265, 1212−1214. (4) Ng, H. T.; Foo, M. L.; Fang, A.; Li, J.; Xu, G.; Jaenicke, S.; Chan, L.; Li, S. F. Y. Langmuir 2002, 18, 1−5. (5) O’Connell, M. J.; Bachilo, S. M.; Huffman, C. B.; Moore, V. C.; Strano, M. S.; Haroz, E. H.; Rialon, K. L.; Boul, P. J.; Noon, W. H.; Kittrell, C.; Ma, J.; Hauge, R. H.; Weisman, R. B.; Smalley, R. E. Science 2002, 297, 593−596. (6) Wang, F.; Dukovic, G.; Brus, L. E.; Heinz, T. F. Science 2005, 308, 838−841. (7) Wang, Z.; Liu, Q.; Zhu, H.; Liu, H.; Chen, Y.; Yang, M. Carbon 2007, 45, 285−292. (8) Bandow, S.; Rao, A. M.; Williams, K. A.; Thess, A.; Smalley, R. E.; Eklund, P. C. J. Phys. Chem. B 1997, 101, 8839−8842. (9) Banerjee, S.; Hemraj-Benny, T.; Wong, S. S. Adv. Mater. 2005, 17, 17−29. (10) Qin, Y.; Liu, L.; Shi, J.; Wu, W.; Zhang, J.; Guo, Z. X.; Li, Y.; Zhu, D. Chem. Mater. 2003, 15, 3256−3260. (11) Sun, Y. P.; Huang, W.; Lin, Y.;Fu, K.; Kitaygorodskiy, A.; Riddle, L. A.; Yu, Y. J.; Carroll, D. L. Chem. Mater. 2001, 13, 2864−2869. (12) Barraza, H. J.; Pompeo, F.; O’Rear, E. A.; Resasco, D. E. Nano Lett. 2002, 2, 797−802. (13) Viswanathan, G.; Chakrapani, N.; Yang, H.; Wei, B.; Chung, H.; Cho, K.; Ryu, C. Y.; Ajayan, P. M. J. Am. Chem. Soc. 2003, 125, 9258−9259. (14) Yao, Z.; Braidy, N.; Botton, G. A.; Adronov, A. J. Am. Chem. Soc. 2003, 125, 16015−16024. (15) Kang, Y. K.; Lee, O. S.; Deria, P.; Kim, S. H.; Park, T. H.; Bonnell, D. A.; Saven, J. G.; Therien, M. J. Nano Lett. 2009, 9, 1414−1418. (16) Kang, Y.; Taton, T. A. J. Am. Chem. Soc. 2003, 125, 5650−5651. (17) Choi, H. C.; Shim, M; Bangsaruntip, S.; Dai, H. J. Am. Chem. Soc. 2002, 124, 9058−9059. (18) Dong, K.; Zhou, G.; Liu, X.; Yao, X. ; Zhang, S. J. Phys. Chem. C 2009, 113, 10013−10020. (19) Tang, C.; Xiang, L.; Su, J.; Wang, K.; Yang, C.; Zhang, Q.; Fu, Q. J. Phys. Chem. B 2008, 112, 3876−3881. (20) Lan, Y. F.; Lin, J. J. J. Phys. Chem. A 2009, 113, 8654−8659. (21) Wildgoose, G. G.; Banks, C. E.; Compton, R. G. Small 2006, 2, 182−193. (22) Kim, H. S.; Lee, H.; Han, K. S.; Kim, J. H.; Song, M. S.; Park, M. S.; Lee, J. Y.; Kang, J. K. J. Phys. Chem. B 2005, 109, 8983−8986. (23) Untereker, D.; Lyu, S.; Schley, J.; Martinez, G.; Lohstrster, L. ACS Appl. Mater. Interfaces 2009, 1, 97−101. (24) Guo, D. J.; Li, H. L. Carbon 2005, 43, 1259−1264. (25) Ma, P. C.; Tang, B. Z.; Kim, J. K. Carbon 2008, 46, 1497−1505. (26) Chin, K. C.; Gohel, A.; Chen, W. Z.; Elim, H. I.; Ji, W.; Chong, G. L.; Sow, C. H.; Wee, A. T. S. Chem. Phys. Lett. 2005, 409, 85−88. (27) Bale, S. S.; Asuri, P.; Karajanagi, S. S.; Dordick, J. S. Adv. Mater. 2007, 19, 3167−3170. (28) Ugarte, D.; Chatelain, A.; De Heer, W. A. Science 1996, 274, 1897−1899. (29) Xue, B.; Chen, P.; Hong, Q.; Lin, J.; Tan, K. L. J. Mater. Chem. 2001, 11, 2378−2381. (30) Liu, Y.; Tang, J.; Chen, X.; Chen, W.; Pang, G. K. H.; Xin, J. H. Carbon 2006, 44, 381−392. (31) Oh, S. D.; So, B. K.; Choi, S. H.; Gopalan, A.; Lee, K. P.; Yoon, K. R.; Choi, I. S. Mater. Lett. 2005, 59, 1121−1124. (32) Baskaran, D.; Mays, J. W.; Bratcher, M. S. Chem. Mater. 2005, 17, 3389−3397. (33) Nesher, G.; Marom, G.; Avnir, D. Chem. Mater. 2008, 20, 4425−4432. (34) Sano, M.; Kamino, A.; Okamura, J.; Shinkai, S. Langmuir 2001, 17, 5125−5128. (35) Lin, J. J.; Shau, S. M.; Wei, K. M. Polym. Degrad. Stab. 2000, 70, 171. (36) Pastoriza-Santos, I.; Liz-Marzan, L. Nano. Lett. 2002, 2, 903. Chapter 4: (1) Wang, Y.; Tran, H. D.; Liao, L.; Duan, X.; Kaner, R. B. J. Am. Chem. Soc. 2010, 132, 10365. (2) Al-Saleh, M. H.; Sundararaj, U. Carbon 2009, 47, 2. (3) Mendez, J. D.; Weder, C. Polym. Chem. 2010, 1, 1237. (4) McEuen, P. L.; Fuhrer, M. S.; Park, H. IEEE Trans. Nanotech. 2002, 1, 78. (5) Badaire, S.; Poulin, P.; Maugey, M.; Zakri, C. Langmuir 2004, 20, 10367. (6) Hennrich, F.; Krupke, R.; Arnold, K.; Rojas Stutz, J. A.; Lebedkin, S.; Koch, T.; Schimmel, T.; Kappes, M. M. J. Phys. Chem. B 2007, 111, 1932. (7) Dresselhaus, M. S.; Dresselhaus, G.; Eklund, P. C. Science of Fullerenes and Carbon Nanotubes, Academic, London 1996. (8) Blanch, A. J.; Lenehan, C. E.; Quinton, J. S. J. Phys. Chem. B 2010, 114, 9805. (9) Islam, M. F.; Rojas, E.; Bergey, D. M.; Johnson, A. T.; Yodh, A. G. Nano Lett. 2003, 3, 269. (10) Campbell, J. F.; Tessmer, I.; Thorp, H. H.; Erie, D. A. J. Am. Chem. Soc. 2008, 130, 10648. (11) Wu, Z.; Zhen, Z.; Jiang, J. H.; Shen, G. L.; Yu, R. Q. J. Am. Chem. Soc. 2009, 131, 12325. (12) Simmons, T. J.; Bult, J.; Hashim, D. P.; Linhardt, R. J.; Ajayan, P. M. ACS nano 2009, 3, 865. (13) Yao, Q.; Chen, L.; Zhang, W.; Liufu, S.; Chen, X. ACS nano 2010, 4, 2445. (14) Cotiuga, I.; Picchioni, F.; Agarwal, U. S.; Wouter, D.; Loos, J.; Lemstra, P. Macromol. Rapid Commun. 2006, 27, 1073. (15) Baykal, B.; Ibrahimova, V.; Er, G.; Bengu, E.; Tuncel, D. Chem. Commun. 2010, 46, 6762. (16) Tang, B. Z.; Xu, H. Y. Macromolecules 1999, 32, 2569. (17) Star, A.; Gabriel, J. C. P.; Bradley, K.; Gruner, G. Nano Lett. 2003, 3, 459. (18) Freitag, M.; Martin, Y.; Misewich, J. A.; Martel, R.; Avouris, P. H. Nano Lett. 2003, 3, 1067. (19) Sandler, J. K. W.; Kirk, J. E.; Shaffer, M. S. P.; Windle, A. H. Polymer 2003, 44, 5893. (20) Bryning, M. B.; Islam, M. F.; Kikkawa, J. M.; Yodth, A. C. Adv. Mater. 2005, 17, 1186. (21) Grossiord, N.; Loos, J.; Regev, O.; Koning, C. E. Chem. Mater. 2006, 18, 1089. (22) Winey, K. I.; Kashiwagi, T.; Mu, M. MRS Bull. 2007, 32, 348. (23) Stauffer, D.; Aharony, A. Introduction to Percolation Theory, Taylor and Francis, London 1992. (24) Arnold, A.; Hennrich, F.; Krupke, R.; Lebedkin, S.; Kappes, M. M. Phys. Status Solidi B 2006, 243, 3073. (25) Wang, Z.; Liu, Q.; Liu, H.; Chen, Y.; Yang, M. Carbon, 2007, 45, 285. (26) Benoit, J. –M.; Corraze, B.; Lefrant, S.; Blau, W. J.; Bernier, P.; Chauvet, O. Synth. Met. 2001, 121, 1215. (27) Kymakis, E.; Amaratunga, G. A. J. J. Appl. Phys. 2006, 99, 084302. (28) Marsh, D. H.; Rance, G. A.; Whitby, R. J.; Giustiniano, F.; Khlobystov, A. N. J. Mater. Chem. 2008, 18, 2249. (29) Ma, P. C.; Tang, B. Z.; Kim, J. K. Carbon 2008, 46, 1497. (30) Guo, D. J.; Li, H. L. Carbon 2005, 43, 1259. (31) Su, H. L.; Chou, C. C.; Hung, D. J.; Lin S. H.; Pao, I. C.; Lin, J. H.; Huang, F. L.; Dong, R. X.; Lin, J. J. Biomaterials 2009, 30, 5979. (32) Untereker, D.; Lyu, S.; Schley, J.; Martinez, G.; Lohstreter, L. ACS Appl. Mater. Interfaces 2009, 1, 97. (33) Yang, N.; Aoki, K.; Nagasawa, H. J. Phys. Chem. B 2004, 108, 15027. (34) Ding, X.; Xu, R.; Liu, H.; Shi, W.; Liu, S.; Li, Y. Crystal Growth & Design 2008, 8, 2982. (35) Dong, R. X.; Chou, C. C.; Lin, J. J. J Mater. Chem. 2009, 19, 2184. (36) Dong, R. X.; Wang, Y. C.; Lin, J. J. Polyimide Dispersants for De-Bundling Multiwalled Carbon Nanotube and Associating Silver Nanoparticles. Submitted for publication in Acs Applied Materials & Interfaces. (37) Qi, S.; Wu, Z.; Wu, D.; Wang, W.; Jin, R. Chem. Mater. 2007, 19, 393. | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/48679 | - |
dc.description.abstract | 製造具自我排列特性的奈米材料,其分散技術為製程中之關鍵。於此,我們利用離子交換反應以及非共價鍵方式製造奈米混摻材料,如:將奈米銀粒子修飾在矽酸鹽黏土與奈米碳管上。這篇論文將分成三部份,分別探討奈米材料之分散性、粒徑大小、粒徑分佈及其電性探討。
第一部分 此部分是探討利用無機矽酸鹽黏土噹分散劑,可合成窄小尺寸分佈及具低熔點之奈米銀粒子。由於天然黏土是片狀幾何形狀,可提供其高表面積固定奈米銀粒子,使其尺寸維持在粒徑大小17−88 nm的範圍。當銀離子/黏土的離子交換當量比為1/1時,可透過掃描式電子顯微鏡及可見光吸收觀察生成之銀粒子具窄小分佈的尺寸(polydispersity of Dw/Dn = 1.2 at 26 nm)及波長為420nm時,有一特徵吸收峰。在無有機分散劑存在下,膠狀之黏土仍可和銀離子嵌合並穩定生成之銀粒子。由於那層間距離僅微小的擴張 (12.0 A versus 13.9 A),銀粒子是穩定生成在黏土之表面。在經過80 的乾燥並再分散回水中後,銀粒子仍穩定且例子大小均一;更進一步藉由掃描式電子顯微鏡觀察得知,那黏土表面上之奈米銀粒子具有一低熔點 (110)性質。這類銀奈米粒子在低溫下製造銀導線及導管是有其潛在之應用性。 第二部分 經由將銀離子溶於DMF/water溶劑中,並以poly(oxyethylene)-imide (POE-imide)當為分散劑可將銀粒子修飾於碳管表面,而此高分子(POE-imide)可使碳管及銀粒子不會聚集於溶液之中並可將銀離子還原為銀粒子。由此法製備而成的奈米銀粒子其粒徑分佈為8−30nm並且經由TEM觀察可看到有部分的銀粒子會貼附於碳管表面之上。 若無此高分子幫助穩定及還原銀離子,硝酸銀藉由DMF還原過程中,產生銀鏡現象且附著在反應容器之壁上。可以利用紫外光/可見光光譜儀於波長為550nm及420nm分別觀察碳管及奈米銀粒子的特徵吸收峰變化情形。經由水洗將分散劑與自由奈米銀粒子去除後可得奈米銀粒子(20-30nm)之單一多壁奈米碳管。從未經修飾之多壁奈米碳管,此有機分散劑的合成提供了簡單的方法來製備Ag/MWNT奈米混掺材料。 第三部分 我們呈現一種直接合成poly(oxyethylene)-imide (POE-imide)複合奈米銀粒子/多壁奈米碳管方式,並利用加熱方法探討其混成薄膜之電性。藉由簡單塗層Ag/MWNT/POE-imide混合液於聚醯亞胺基材上並加熱至160 oC,奈米銀粒子遷移至表面且聚集成直徑為100−150 nm,當溫度增加至170 oC時,那複合薄膜外觀轉變成呈現乳白色,其片電阻值也大幅降低為2.2 x 10-1 Ohm/sq,當溫度持續加熱至350 oC時,此時複合膜顯示為白色之表面且具有最佳之片電阻值(2.7 x 10-2 Ohm/sq)。電性之提升是由於奈米銀粒子催化高分子降解並進而熔融,此機制可由掃描式電子顯微鏡(FE-SEM)、熱重分析儀(TGA)及廣角X-ray繞射(WAXRD)等儀器鑑定得知。就我們所知,於此低溫度下所測量之Ag/MWNT薄膜片電阻值是最低的且目前文獻上沒有報導。 | zh_TW |
dc.description.abstract | “Dispersion technology” is considered as the key step in Bottom-Up process, for self-assemblies and fabricating nanomaterial devices. Herein, nanohybrid materials, including silver nanoparticles decorated on the silicate clay and carbon nanotube, were fabricated by ionic excharge reaction and non-covalent method. These materials were investigated on dispersing ability, particle size and distribution, and electrical behavior. The thesis is divided into three parts:
Part 1. Silver nanoparticles (AgNPs) of narrow size distribution and low melting point were synthesized from the reduction of silver nitrate in the presence of inorganic silicate clays. The natural clays with a lamellar geometric shape provided a high surface area for immobilizing AgNPs with nanometer diameter in the range of 17-88 nm. At a 1/1 equivalent ratio of Ag+ to clay counter ions, the generated particles had a narrow size distribution (polydispersity of Dw/Dn = 1.2 at 26 nm Dn by SEM) and a UV absorption at 420 cm-1. Without organic dispersants, the colloidal clays could complex with Ag+ in the initial stage of mixing and subsequently stabilized the generated Ag0 particles. It seems that the high surface area stabilizes the clay rather than the Ag metal intercalation into the layered structure since the basal spacing was only slightly enlarged (12.0 A versus 13.9 A by XRD). The resulting AgNPs were highly stable and maintained their particle size after several cycles of drying at 80 oC and re-dispersion in water. Moreover, the AgNPs on the clay surface melted at a low temperature (110 oC), observed by SEM. Such AgNPs may have potential applications for fabricating silver arrays or conductors at low temperature. Part 2. Nanohybrids of silver nanoparticles (AgNPs) decorated on the surface of multiwalled carbon nanotubes (Ag/MWNT) were synthesized via the in situ reduction of AgNO3 in N,N-dimethylformamide (DMF) and water mixtrues. The process required the presence of a poly(oxyethylene)-backboned oligoimide (POE-imide), which stabilized the dispersion of MWNTs and AgNO3 initially, and subsequently the reduced Ag0 nanoparticles. AgNPs in the range of 8–30 nm diameter were generated and some of these were directly attached to the MWNT surfaces, as observed by transmission electron microscopy (TEM). Without the presence of POE-imide, AgNO3 can only be reduced into Ag0 mirror by DMF slowly and deposits on the side of the reactor wall. The kinetic formation of these nanohybrids was characterized by UV-visible (UV-vis) absorption for MWNTs at 550 nm and AgNPs at 420 nm. The single MWNT tubes of decorated with AgNPs (20–30 nm) were isolated by washing off the dispersant and free AgNPs. The synthesis involving an organic dispersant provides a convenient and facile method for preparing Ag/MWNT nanohybrids from the unmodified MWNTs. Part 3. We fabricate a flexible and surface conductive films by hybridizing silver nanoparticles on multi-walled carbon nanotubes (Ag/CNT) via an in situ silver nitrate reduction in poly(oxyethylene)-imide (POE-imide) dispersion. The POE-imide copolymers provided dual functions for homogenizing CNT dispersion in DMF/H2O mixture and subsequently stabilizing the Ag/CNT nanohybrids during the solvent evaporation into films. By simple coating on polyimide substrate and heating to 160 oC, the generated silver nanoparticles (AgNPs) migrated to surface and aggregated to larger size of 100−150 nm. Continuing heating at 170 oC and 350 oC, the film surface appeared to have color changes from golden to milky-white with lower sheet resistance of 2.2 x 10-1 Ohm/sq and 2.7 x 10-2 Ohm/sq, respectively. The enhancement of surface electrical conductivity was attributed to the AgNPs migration through CNT network and melt into silver granule connection while simultaneously annealing at the preferable temperature of 350 oC. The mechanistic aspects were elucidated by surface observation on a scanning electronic microscope, measurement of organic degradable temperature by thermal gravimetric analyzer and silver characterization by wide-angle X-ray diffraction. The synthesis is viable for making flexible polyimide film exhibiting an unprecedented high conductivity that easily lighting a light-emitting diode lamps. | en |
dc.description.provenance | Made available in DSpace on 2021-06-15T07:08:03Z (GMT). No. of bitstreams: 1 ntu-99-D95549013-1.pdf: 27920893 bytes, checksum: 89d6e0fa07e636bf95c794eb51fb919a (MD5) Previous issue date: 2010 | en |
dc.description.tableofcontents | List of Tables.…………………………………………...…………………....…….…..iv
List of Schemes…………………………………………………………………………v List of Figures………………………………………………………………….....…....vi 摘 要………...…………………………………………......................……..….......…..ix Abstract…………………………….…………………………………………...….... xiii Chapter 1. Introduction and Literature Review 1.1. Background………………...……………………….…………………...….…1 1.2. Synthesis of silver nanoparticles (AgNPs)….…………...………………..…..2 1.2.1. Conventional syntheses and stabilization of AgNPs in solution…………...2 1.2.2. Chemical method—reduction of silver salts……….……………..………..7 1.2.3. Preparation of AgNPs in the presence of inorganic supports…..……….….8 1.3. Potential application for silver nanoparticles (AgNPs)……………………....11 1.3.1. AgNPs with a low-temperature melting property………………………....11 1.3.2. Antimicrobial properties of AgNPs/clay……….……………..…………...12 1.4. Outline of the Thesis………………………………………………………....14 Chapter 2. Synthesis of Immobilized Silver Nanoparticles on Ionic Silicate Clay and Observed Low-Temperature Melting 2.1. Introduction………………...……………………….……………………..…15 2.2. Experimental Section……………………………..…………...…………..…18 2.2.1. Materials……………………………………………...…………………...18 2.2.2. Preparation of AgNP/Clay dispersion in water……….………………...…18 2.2.3. Measurements and Analyses…..…………………………………………..19 2.3. Results and Discussion……………………………………………....….…....20 2.3.1. AgNO3 Reduction in the Presence of Clay as Supports...............................20 2.3.2. AgNP Size Variation on Clay Surface..........................................................21 2.3.3. Stability of AgNPs on Clay without Organic Dispersants…………….…...27 2.3.4. Low Temperature Melting………………………………………………....30 2.4. Conclusion………………………………..….…………………………….....31 Chapter 3. Polyimide Dispersants for De-Bundling Multiwalled Carbon Nanotube and Associating Silver Nanoparticles 3.1. Introduction……………………………………………………………….….33 3.2. Experimental Section………………………………………………………...36 3.2.1. Materials…………………………………………………………………..37 3.2.2. Preparation of poly(oxyethylene)-backbone oligoimide (POE-imide)…....37 3.2.3. Preparation of POE-imide nanohybrids with Ag/MWNT……...…...…….37 3.2.4. Measurements and Analyses…………………………………………..…..38 3.3. Results and Discussion……………………………………………………....39 3.3.1. Preparation of POE-imide dispersant consisting of POE-backbone and aromatic imide functionalities……………………………………………..39 3.3.2. Dispersing Ability of POE-imide for MWNTs…………………………....41 3.3.3. Reduction of AgNO3 to AgNPs in the presence of the POE-imide and mechanism of forming Ag/MWNT nanohybrids……………………….…44 3.3.4. Further isolation of the Ag/MWNT…………………………………….…48 3.3.5. Mechanism of formation of Ag/MWNT……………………………….….50 3.4. Conclusion.…………………………………………………………………..51 Chapter 4. Fabrication of Flexible and Highly Conductive Films by Silver-CNT-Dispersant Solution Coating 4.1. Introduction……………………………………………………………....…..53 4.2. Experimental Section……………………………………………………...…57 4.2.1. Preparation of AgNP/CNT/POE-imide (Ag/CNT) nanohybrids……….....57 4.2.2. Preparation of conductive films…………………………………...………57 4.2.3. Characterization of nanocomposite films……………...………………….58 4.3. Results and Discussion…………………………………...………………….59 4.3.1. AgNP migration is temperature dependent in the Presence of MWNT as Supports……………………………………………………….…………..59 4.3.2. Observing silver melting by FE-SEM and TM-AFM……………………..62 4.3.3. Thermal property of POE-imide composite with AgNP and MWNT……..65 4.3.4. Mechanism of forming flexible and conductive Ag/MWNT film………....67 4.4. Conclusion.…………………………………………………………………...70 Chapter 5. Summary…………………………………………………………....…...71 Chapter 6. Curriculum Vitae ….…………………………………………….....…...73 List of Tables Table 1.1. Various methods for preparing silver structures with different morphologies………………………………………………………………………….....5 Table 1.2. Common reducing agents for converting silver salts to nanoparticles….8 Table 2.1. Particle Size Distribution and Clay Spacing of AgNP/Clay Hybrids….24 Table 3.1. Solubility or dispersion ability of the POE-imide copolymer.................41 Table 4.1. Sheet resistance of carbon nanotube and their nanohybrid materials….61 List of Schemes Scheme 1.1. Illustration of the AgNP/Clay synthesis and interaction with a bacterium: AgNPs are fabricated on the surface of platelet clay and electrostatic attraction to a bacterial cell wall.………………………….…………………………………………...13 Scheme 3.1. General synthetic scheme for the poly(oxyethylene)-backboned oligoimide dispersant………………………………………………..…………………40 List of Figures Figure 1.1. UV-vis absorption of AgNPs as the function of NaBH4 to AgNO3 molar ratios at (a) 1/2, (b) 2, (c) 5, and (d) 10………………………………....……………...10 Figure 1.2. TEM of AgNPs prepared with various NaBH4 to AgNO3 molar ratios at (a) 1/2, (b) 2, (c) 5, and (d) 10. Reproduced with permission from……………….…...10 Figure 1.3. Morphology of the hydrothermal products at 165 oC for different times of (A) 20, (B) 30, and (C) 40 h………………………………………………..……….12 Figure 1.4. Ostwald Ripening of Small Ag crystals with Surface Passivated by HPG to Form Tubes………………………………………………………..………………...12 Figure 1.5. AgNP/Clay inhibited bacterial proliferation. FE-SEM images showed the untreated (A) and the AgNP/Clay-encapsulated S. aureus (B). In contrast to the proliferative E. coli on clay…………...………………………………………………..13 Figure 2.1. Photographical images of (a) silver mirror formation by heating AgNO3 in water without dispersant, (b) clay (1.0 wt-%) swelling in water, (c) AgNPs generated in the clay solution, in concentrations of 650 ppm, (d) 100 ppm, and (e) 10 ppm…......22 Figure 2.2. UV-Vis spectra of AgNPs during the reduction of Ag+ ions to Ag0 particles at (a) 0 h at room temperature, (b) 3 h at 80 oC, (c) 7 h at 80 oC (inserted, the corresponding color changes in solution)………………..…………………………......23 Figure 2.3. FE-SEM micrographs of AgNP/clay (Bentonite) at Ag+/CEC of (a) 0.2/1.0, (b) 2.0/1.0, (c) 8.0/1.0, by methanol reduction (d) 1.0/1.0 by NaBH4 reduction, and (e) AgNP/clay (Mica) (Ag+/CEC = 1.0/1.0), all prepared at 80 oC and dried at 80 oC on glass. (Some representative particles with the estimated sizes are shown)…….…...25 Figure 2.4. TEM images of AgNPs in water from the reduction of silver nitrate over (a) 3 h, (b) 7 h at 80 oC……………………...……………………………………...…..27 Figure 2.5. Particle size and composition of AgNPs on clay using various Ag+/CEC ionic ratio in the preparation……………………………………………………………29 Figure 2.6. Photographical images of (a) powder of AgNP/clay after removing water, (b) powder dispersed in water at the concentration of 250 ppm (A) and 10 ppm (B)….29 Figure 2.7. FE-SEM micrographs of (a) the Bentonite clay, (b) AgNP/clay (Ag+/CEC = 1.0/1.0), prepared at 80 oC in methanol/water solution and dried at 80 oC on glass, (c) prepared at 100 oC and dried at 80 oC and (d) prepared at 80 oC and dried at 110 oC…31 Figure 3.1. The interfacial tension between water and toluene for various concentrations of POE-imide aqueous solutions……………………………………….41 Figure 3.2. Comparison of TEM micrographs of (a) and (b) MWNTs solution (sonication), (c) and (d) MWNT/POE-imide solution………………………………….43 Figure 3.3. MWNTs dispersion analysis, (a) MWNT/POE-imide, (b) MWNTs (sonication), and (c) MWNTs without sonication.…………………………………......44 Figure 3.4. Generating nanohybrids by different mixing procedures: (a) and (b) in situ reduction of AgNO3 into AgNPs in the presence of MWNT/POE-imide; fine dispersion appeared on glass wall and TEM micrographs; (c) and (d) separated formation of AgNPs in POE-imide with NaBH4 and then added to MWNTs in DMF ; aggregates on glass wall, and larger AgNP particles along with entangled MWNTs…..…………………………………………………………………………….47 Figure 3.5. UV-vis absorption of AgNPs during the reduction of AgNO3 in MWNT/POE-imide……………………………………………………………….........47 Figure 3.6. UV-vis absorption of POE-imide nanohybrid with (a) AgNPs/MWNT in solution and (b) AgNPs without MWNT………..…………………………….……….48 Figure 3.7. TEM micrographs of AgNPs attached to the MWNTs……...…...…….49 Figure 3.8. Consecutive steps of forming free AgNPs and the AgNP-decorated MWNTs in organic dispersant………….……………………………………………...51 Figure 4.1. Photographs of melting AgNPs on the surface of polyimide film during the heating treatment……………………………………………………………....…...61 Figure 4.2. Demo of conductive application by Ag/CNT films which were heated at (a) 160 oC, (b) 170 oC and (c) 350 oC, individually…………………………………....62 Figure 4.3. FE-SEM micrographs of (a) the pristine MWNT, (b) MWNT:POE-imide hybrids with a weight ratio of 1:20, dried at 170 oC (c) MWNT:AgNO3:POE-imide hybrids with a weight ratio of 1:20:20, dried at 160 oC, (d) 170 oC and (e) 350 oC on polyimide substrate. (f) The composition of these samples was examined by WAXRD………………………………………………………………………………..64 Figure 4.4. TM-AFM micrographs of the Ag/MWNT hybrid film of (a) topographical, (b) phase micrographs and (c) 3D micrographs, dried at 170 oC, and (d) topographical, (e) phase micrographs and (f) 3D micrographs, dried at 350 oC on polyimide substrate…………………………………………………………………….65 Figure 4.5. Relative thermo-oxidative stability by TGA in air: (a) pristine MWNT, (b) POE-imide (organic dispersant), (c) 5 wt% MWNT in POE-imide matrix, (d) POE-imide nanocomposite with AgNP/MWNT (MWNT:AgNO3:POE-imide weight fraction of 1:20:20), and (e) AgNP/POE-imide (AgNO3:POE-imide weight fraction of 1:1)……………………………………………………………………………………...66 Figure 4.6. Fabrication process of polymer dispersed CNT and AgNPs nanohybrid and coating/heating to flexible films…………………………………………………...69 Figure 4-7. FE-SEM on the cross-section view of the MWNT:AgNO3:POE-imide hybrids with a weight ratio of 1:20:20, dried at (a) 160 oC, (b) 170 oC and (c) 350 oC (insert the energy dispersive X-ray spectrometry (EDS) analysis of melting AgNPs)…………………………………………………………………………………69 | |
dc.language.iso | zh-TW | |
dc.title | 黏土、奈米碳管及奈米銀粒子之混成材料及其導電性探討 | zh_TW |
dc.title | Synthesis of Nanohybrids Involving Silicate Clays, Carbon Nanotubes and Silver Nanoparticles, and their Conductivity Studies | en |
dc.type | Thesis | |
dc.date.schoolyear | 99-1 | |
dc.description.degree | 博士 | |
dc.contributor.oralexamcommittee | 謝國煌,蔣見超,邱文英,李榮和 | |
dc.subject.keyword | 矽酸鹽黏土,奈米銀粒子,分散性,奈米碳管,非共價鍵鍵結,奈米材料,銀熔融,低電阻,催化熱降解, | zh_TW |
dc.subject.keyword | silicate clay,silver nanoparticles,dispersion,carbon nanotubes,noncovalent interactions,nanomaterials,silver melt,low resistance,catalytic thermal degradation, | en |
dc.relation.page | 83 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2010-11-05 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 高分子科學與工程學研究所 | zh_TW |
顯示於系所單位: | 高分子科學與工程學研究所 |
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