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http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/47360完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 莊東漢 | |
| dc.contributor.author | Chieh-Wei Hsu | en |
| dc.contributor.author | 許倢瑋 | zh_TW |
| dc.date.accessioned | 2021-06-15T05:56:29Z | - |
| dc.date.available | 2010-08-19 | |
| dc.date.copyright | 2010-08-19 | |
| dc.date.issued | 2010 | |
| dc.date.submitted | 2010-08-17 | |
| dc.identifier.citation | 6. 參考文獻
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Chuang,”Interfacial Reactions between Liquid Indium and Nickel Substrate” 60. A.D. Poming Jr. F.C. Yost, and P.F. Hlava.,”Intermetallic Layer Growth in Cu/Sn-In Solder Joints”, Microbeam Analysis-1984 Failure Analysis in Microelectronics 61. S.K. Kang and V. Ramachandran,”Growth Kinetics of Intermetallic Phases at the Liquid Sn and Solid Ni Interface”, Scripta Metallurgica, v.14(1980), pp.421-424 62. Thomas Beck, Sven Lamprecht, Hans-Juergen Schreier and Christian Sebald,”Evaluation of Pb-Free BGA Solder Joint Reliability on Ni-Based Surface Finished Using Alternative Shear and Pull Metrologies” 63. F. Song, S.W. Ricky Lee, Keith Newman, Bob Sykes, Stephen Clark”Brittle Failure Mechanism of SnAgCu and SnPb Solder Balls during High Speed Ball Shear and Cold Ball Pull Tests”, Electronic Components and Technology Conference, 2007 64. F. Song, S. Lee, K. Newman, B. Sykes, and S. Clark,”High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests： Correlation of Failure Mode and Loading Speed”, IEEE Proc. Of Electronic Components and Technology Conference, 2007, p1504 65. D.Q. Yu, J. Zhao and L. Wang,”Improvement on the Microstructure Stability, Mechanical and Wetting Properties of Sn-Ag-Cu Lead-Free Solder with the Addition of Rare Earth Elements”, Journal of Alloys and Compounds, v.376(2004), n.1-2, pp.170-175 | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/47360 | - |
| dc.description.abstract | 在In-49Sn銲錫合金中，各添加0.5wt.%的Nd和Lu，分別會在銲錫基地內形成Nd(Sn0.6In0.4)3及 Lu(Sn0.5In0.5)3介金屬化合物。經過迴銲完，In-49Sn、In-49Sn-0.5Nd和In-49Sn-0.5Lu三種銲錫與化鎳金(ENIG)基板界面會生成Ni3(In,Sn)4介金屬層，與有機保銲膜(OSP)基板界面則會生成Cu6(In,Sn)5介金屬層。介金屬層的厚度隨著時效溫度與時效時間的增加而呈線性增加，當中添加稀土元素會抑制界面介金屬層的成長，尤其以In-49Sn-0.5Nd抑制效果較好。
強度測試方面，無論是推球、拉球或是快速推球試驗，破斷都發生在銲錫球內部，為延性破斷。添加稀土元素會提升銲錫的抗拉強度，但快速推球強度反而會下降，這是由於稀土元素活性大易氧化，迴銲時氧化物被助銲劑帶出在銲錫與基板界面間產生孔洞，同時快速推球會使破斷面轉而發生在銲錫接近界面處，導致接點強度下降。 | zh_TW |
| dc.description.abstract | Adding 0.5wt.% Nd and Lu into In-49Sn solder alloy form Nd(Sn0.6In0.4)3 and Lu(Sn0.5In0.5)3 intermetallic compounds in solder matrix. After reflowing, In-49Sn、In-49Sn-0.5Nd and In-49Sn-0.5Lu solder alloys form Ni3(In,Sn)4 interfacial intermetallic compound with ENIG pads and form Cu6(In,Sn)5 interfacial intermetallic compound with OSP pads. The thickness of interfacial intermetallic compound grows linearly with aging temperature and aging time. Within the three solder alloys, addingrare-earth elements will suppress the thickness of interfacialintermetallic compound, especially In-49Sn-0.5Nd.
As to the bonding strength tests which are ball shear tests, pull tests and high speed shear tests, all cleavages occur in the solder balls and show ductile fracture. Adding rare-earth elements results in the higher tensile strength, but high speed ball shear strength declines. The reason is that the rare-earth elements are very active and oxidize easily which leads the oxidation to be brought out by the flux during reflowing and then voids formed on the interface between solder and pad. Meanwhile, high speed shear test will make the fracture occur in the solder near the interface and result in the lower bonding strength. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-15T05:56:29Z (GMT). No. of bitstreams: 1 ntu-99-R97527059-1.pdf: 14242917 bytes, checksum: c0496db6e5e55defe3035085405ead6a (MD5) Previous issue date: 2010 | en |
| dc.description.tableofcontents | 目錄
1. 前言............................................................1 2. 理論與文獻回顧..................................................2 2.1 無鉛銲錫特性…………………………………………………………… 2 2.1.1. 無鉛銲錫文獻回顧……………………………………………… 4 2.1.2. 添加稀土元素對銲錫影響………………………………………11 2.2 錫鬚成長…………………………………………………………………13 2.2.1. 錫鬚成長機制……………………………………………………13 2.2.2. 含稀土元素對錫鬚成長影響……………………………………14 2.3 界面成長動力學…………………………………………………………15 3. 實驗方法……………………………………………………………………… 17 3.1 研究簡介…………………………………………………………………17 3.2 無鉛銲錫銲料本身的特性研究…………………………………………17 3.2.1. 無鉛銲錫材料製備………………………………………………17 3.2.2. 熱示差掃描分析儀 (Differential Scanning Calorimeter，DSC)………………17 3.2.3. 銲錫微結構觀察…………………………………………………17 3.2.4. 拉伸試驗…………………………………………………………18 3.2.5. 微硬度試驗………………………………………………………18 3.2.6. 電化學腐蝕試驗…………………………………………………18 3.3 無鉛銲錫球格陣列與化金基板/OSP的界面反應與接點強度的觀察與 測試………………………………………………………………………19 3.3.1. 製作銲錫圓錠……………………………………………………19 3.3.2. 使用的電路板 ………………………………………………… 19 3.3.3. BGA球格陣列構裝……………………………………………… 19 3.3.4. 溫度時效試驗……………………………………………………21 3.3.5. SEM觀察界面反應……………………………………………… 21 3.3.6. 接點強度試驗 ………………………………………………… 21 4. 結果與討論…………………………………………………………………… 24 4.1 銲錫材料特性研究………………………………………………………24 4.2 球格陣列構裝研究………………………………………………………33 4.2.1. 銲錫與基板之界面反應…………………………………………33 4.2.2. 銲錫接點強度試驗………………………………………………46 4.2.2.1. 銲錫接點推球試驗……………………………………46 4.2.2.2. 銲錫接點拉球試驗……………………………………55 4.2.2.3. 銲錫接點快速推球試驗………………………………65 5. 結論………………………………………………………………………………74 6. 參考文獻……………………………………………………………………… 76 圖目錄 圖2-1： 240℃下Sn-Cu-Ni三元等溫相圖…………………………………………5 圖3-1： 拉伸試片規格…………………………………………………………… 18 圖3-2： 迴銲溫度曲線…………………………………………………………… 20 圖3-3： 推球試驗方式…………………………………………………………… 21 圖3-4： 拉球破斷模式…………………………………………………………… 22 圖3-5： 快速推球破斷模式……………………………………………………… 22 圖4-1： 銲錫合金DSC分析曲線：(a)In-49Sn、(b)In-49Sn-0.5Nd、 (c)In-49Sn-0.5Lu……………………………………………………… 27 圖4-2： In-49Sn-0.5Nd銲錫經研磨拋光後，在室溫下不同時間的表面型態觀察 (a)as cast、(b)8小時、(c)519小時………………………………… 28 圖4-3： In-49Sn-0.5Lu銲錫經研磨拋光後，在室溫下不同時間的表面型態觀察 (a)as cast、(b)8小時、(c)519小時………………………………… 29 圖4-4： 銲錫合金拉伸曲線：(a)In-49Sn-0.5Nd、(b)In-49Sn-0.5Lu……… 30 圖4-5： 銲錫合金電化學腐蝕曲線：(a)In-49Sn、(b)In-49Sn-0.5Nd、 (c)In-49Sn-0.5Lu………………………………………………………32 圖4-6： In-49Sn-0.5Nd銲錫與化鎳金基板(ENIG)迴銲後，在75℃時效下不同 時間界面介金屬金相：(a)初迴銲後、(b)100小時、(c)300小時、(d)500 小時、(e)700小時、(f)1000小時。…………………………………36 圖4-7： In-49Sn-0.5Nd銲錫與化鎳金基板(ENIG)迴銲後，在100℃時效下不同 時間界面介金屬金相：(a)初迴銲後、(b)100小時、(c)300小時、(d)500 小時、(e)700小時、(f)1000小時。…………………………………37 圖4-8： In-49Sn-0.5Lu銲錫與化鎳金基板(ENIG)迴銲後，在75℃時效下不同 時間界面介金屬金相：(a)初迴銲後、(b)100小時、(c)300小時、(d)500 小時、(e)700小時、(f)1000小時。…………………………………38 圖4-9： In-49Sn-0.5Lu銲錫與化鎳金基板(ENIG)迴銲後，在100℃時效下不同 時間界面介金屬金相：(a)初迴銲後、(b)100小時、(c)300小時、(d)500 小時、(e)700小時、(f)1000小時。…………………………………39 圖4-10： In-49Sn、In-49Sn-0.5Nd、In-49Sn-0.5Lu與化鎳金基板(ENIG)迴銲 後，不同溫度不同時間界面介金屬厚度與時效時間根號關係圖……40 圖4-11： In-49Sn-0.5Nd銲錫與有機保銲膜基板(OSP)迴銲後，在75℃時效下 不同時間界面介金屬金相：(a)初迴銲後、(b)100小時、(c)300小時、 (d)500小時、(e)700小時、(f)1000小時。…………………………41 圖4-12： In-49Sn-0.5Nd銲錫與有機保銲膜基板(OSP)迴銲後，在100℃時效下 不同時間界面介金屬金相：(a)初迴銲後、(b)100小時、(c)300小時、 (d)500小時、(e)700小時、(f)1000小時。…………………………42 圖4-13： In-49Sn-0.5Lu銲錫與有機保銲膜基板(OSP)迴銲後，在75℃時效下 不同時間界面介金屬金相：(a)初迴銲後、(b)100小時、(c)300小時、 (d)500小時、(e)700小時、(f)1000小時。…………………………43 圖4-14： In-49Sn-0.5Lu銲錫與有機保銲膜基板(OSP)迴銲後，在100℃時效下 不同時間界面介金屬金相：(a)初迴銲後、(b)100小時、(c)300小時、 (d)500小時、(e)700小時、(f)1000小時。…………………………44 圖4-15： In-49Sn、In-49Sn-0.5Nd、In-49Sn-0.5Lu與有機保銲膜基板(OSP) 迴銲後，不同溫度不同時間界面介金屬厚度與時效時間根號 關係…………………………………………………………………… 45 圖4-16： In-49Sn銲錫與化鎳金基板(ENIG)迴銲後，不同溫度與不同時間條件 下的慢速推球(0.4mm/s)破斷面：(a)(b)初迴銲後、(c)(d)75℃，1000 小時、(e)(f) 100℃，1000小時。……………………………………47 圖4-17： In-49Sn-0.5Nd銲錫與化鎳金基板(ENIG)迴銲後，不同溫度與不同時 間條件下的慢速推球(0.4mm/s)破斷面：(a)(b)初迴銲後、(c)(d)75 ℃，1000小時、(e)(f) 100℃，1000小時。……………………… 48 圖4-18： In-49Sn-0.5Lu銲錫與化鎳金基板(ENIG)迴銲後，不同溫度與不同時 間條件下的慢速推球(0.4mm/s)破斷面：(a)(b)初迴銲後、(c)(d)75 ℃，1000小時、(e)(f) 100℃，1000小時。…………………………49 圖4-19： In-49Sn、In-49Sn-0.5Nd和In-49Sn-0.5Lu銲錫與化鎳金基板(ENIG) 迴銲後，不同溫度與不同時間條件下的慢速推球(0.4mm/s) 強度。…………………………………………………………………… 50 圖4-20： In-49Sn銲錫與有機保銲膜基板(OSP)迴銲後，不同溫度與不同 時間條件下的慢速推球(0.4mm/s)破斷面：(a)(b)初迴銲後、(c)(d)75 ℃，1000小時、(e)(f) 100℃，1000小時。…………………………51 圖4-21： In-49Sn-0.5Nd銲錫與有機保銲膜基板(OSP)迴銲後，不同溫度與不同 時間條件下的慢速推球(0.4mm/s)破斷面：(a)(b)初迴銲後、(c)(d)75 ℃，1000小時、(e)(f) 100℃，1000小時。…………………………52 圖4-22： In-49Sn-0.5Lu銲錫與有機保銲膜基板(OSP)迴銲後，不同溫度與不同 時間條件下的慢速推球(0.4mm/s)破斷面：(a)(b)初迴銲後、(c)(d)75 ℃，1000小時、(e)(f) 100℃，1000小時。…………………………53 圖4-23： In-49Sn、In-49Sn-0.5Nd和In-49Sn-0.5Lu銲錫與有機保銲膜基板 (OSP)迴銲後，不同溫度與不同時間條件下的慢速推球(0.4mm/s) 強度。……………………………………………………………………54 圖4-24： In-49Sn銲錫與化鎳金基板(ENIG)迴銲後，不同溫度與不同時 間條件下的拉球破斷面：(a)(b)初迴銲後、(c)(d)75℃，1000小時、 (e)(f) 100℃，1000小時。……………………………………………57 圖4-25： In-49Sn-0.5Nd銲錫與化鎳金基板(ENIG)迴銲後，不同溫度與不同時 間條件下的拉球破斷面：(a)(b)初迴銲後、(c)(d)75℃，1000小時、 (e)(f) 100℃，1000小時。……………………………………………58 圖4-26： In-49Sn-0.5Lu銲錫與化鎳金基板(ENIG)迴銲後，不同溫度與不同時 間條件下的拉球破斷面：(a)(b)初迴銲後、(c)(d)75℃，1000小時、 (e)(f) 100℃，1000小時。……………………………………………59 圖4-27： In-49Sn、In-49Sn-0.5Nd和In-49Sn-0.5Lu銲錫與化鎳金基板(ENIG) 迴銲後，不同溫度與不同時間條件下的拉球強度。…………………60 圖4-28： In-49Sn銲錫與有機保銲膜基板(OSP)迴銲後，不同溫度與不同 時間條件下的拉球破斷面：(a)(b)初迴銲後、(c)(d)75℃，1000小時、 (e)(f) 100℃，1000小時。……………………………………………61 圖4-29： In-49Sn-0.5Nd銲錫與有機保銲膜基板(OSP)迴銲後，不同溫度與不同 時間條件下的拉球破斷面：(a)(b)初迴銲後、(c)(d)75℃，1000小時、 (e)(f) 100℃，1000小時。……………………………………………62 圖4-30： In-49Sn-0.5Lu銲錫與有機保銲膜基板(OSP)迴銲後，不同溫度與不同 時間條件下的拉球破斷面：(a)(b)初迴銲後、(c)(d)75℃，1000小時、 (e)(f) 100℃，1000小時。……………………………………………63 圖4-31： In-49Sn、In-49Sn-0.5Nd和In-49Sn-0.5Lu銲錫與有機保銲膜基板 (OSP)迴銲後，不同溫度與不同時間條件下的拉球強度。………… 64 圖4-32： In-49Sn銲錫與化鎳金基板(ENIG)迴銲後，不同溫度與不同時 間條件下的快速推球(2000mm/s)破斷面：(a)(b)初迴銲後、(c)(d)75 ℃，1000小時、(e)(f) 100℃，1000小時。………………………… 66 圖4-33： In-49Sn-0.5Nd銲錫與化鎳金基板(ENIG)迴銲後，不同溫度與不同時 間條件下的快速推球(2000mm/s)破斷面：(a)(b)初迴銲後、(c)(d)75 ℃，1000小時、(e)(f) 100℃，1000小時。………………………… 67 圖4-34： In-49Sn-0.5Lu銲錫與化鎳金基板(ENIG)迴銲後，不同溫度與不同時 間條件下的快速推球(2000mm/s)破斷面：(a)(b)初迴銲後、(c)(d)75 ℃，1000小時、(e)(f) 100℃，1000小時。…………………………68 圖4-35： In-49Sn、In-49Sn-0.5Nd和In-49Sn-0.5Lu銲錫與化鎳金基板(ENIG) 迴銲後，不同溫度與不同時間條件下的快速推球(2000mm/s) 強度。……………………………………………………………………69 圖4-36： In-49Sn銲錫與有機保銲膜基板(OSP)迴銲後，不同溫度與不同 時間條件下的快速推球(2000mm/s)破斷面：(a)(b)初迴銲後、(c)(d)75 ℃，1000小時、(e)(f) 100℃，1000小時。…………………………70 圖4-37： In-49Sn-0.5Nd銲錫與有機保銲膜基板(OSP)迴銲後，不同溫度與不同 時間條件下的快速推球(2000mm/s)破斷面：(a)(b)初迴銲後、(c)(d)75 ℃，1000小時、(e)(f) 100℃，1000小時。…………………………71 圖4-38： In-49Sn-0.5Lu銲錫與有機保銲膜基板(OSP)迴銲後，不同溫度與不同 時間條件下的快速推球(2000mm/s)破斷面：(a)(b)初迴銲後、(c)(d)75 ℃，1000小時、(e)(f) 100℃，1000小時。…………………………72 圖4-39： In-49Sn、In-49Sn-0.5Nd和In-49Sn-0.5Lu銲錫與有機保銲膜基板 (OSP)迴銲後，不同溫度與不同時間條件下的快速推球(2000mm/s)強 度。………………………………………………………………………73 表目錄 表2-1： 列出被添加於錫銲料中的各種低熔點元素………………………………2 表2-2： 列出近年來探討的各種無鉛銲錫合金……………………………………3 表4-1： In49Sn、In49Sn0.5Nd與In49Sn0.5Lu的腐蝕電位及腐蝕電流 密度………………………………………………………………………32 | |
| dc.language.iso | zh-TW | |
| dc.subject | 稀土元素 | zh_TW |
| dc.subject | 無鉛銲錫 | zh_TW |
| dc.subject | 介金屬化合物 | zh_TW |
| dc.subject | 界面反應 | zh_TW |
| dc.subject | 快速推球試驗 | zh_TW |
| dc.subject | Intermetallic compound | en |
| dc.subject | Pb-free solder | en |
| dc.subject | rare-earth element | en |
| dc.subject | High speed ball shear test | en |
| dc.subject | interfacial reaction | en |
| dc.title | 添加Nd及Lu對共晶銦錫銲錫之特性影響研究 | zh_TW |
| dc.title | The Effect of Neodymium and Lutetium Additions On the Properties of In-49Sn Solder | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 98-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 王彰盟,傅耀賢,鄭智元 | |
| dc.subject.keyword | 無鉛銲錫,稀土元素,介金屬化合物,界面反應,快速推球試驗, | zh_TW |
| dc.subject.keyword | Pb-free solder,rare-earth element,Intermetallic compound,interfacial reaction,High speed ball shear test, | en |
| dc.relation.page | 81 | |
| dc.rights.note | 有償授權 | |
| dc.date.accepted | 2010-08-18 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 材料科學與工程學研究所 | zh_TW |
| 顯示於系所單位： | 材料科學與工程學系 | |
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