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| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 鍾添東(Tien-Tung Chung) | |
| dc.contributor.author | Chung-Yun Lee | en |
| dc.contributor.author | 李重鋆 | zh_TW |
| dc.date.accessioned | 2021-06-15T05:44:46Z | - |
| dc.date.available | 2012-08-20 | |
| dc.date.copyright | 2010-08-20 | |
| dc.date.issued | 2010 | |
| dc.date.submitted | 2010-08-19 | |
| dc.identifier.citation | 參考文獻
[1] C. H. Tung, Y. S. Kuo, S. M. Chang, “Tape automated bonding inner lead bonded devices (TAB/ILB) failure analysis,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 16, no. 3, pp. 304-310, 1993 [2] J. H. Lau, D. W. Rice, C. G. Harkins, “Thermal stress analysis of tape automated bonding packages and interconnections,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 13, no. 1, pp. 182-187, 1990 [3] K. D. Cluff, “Analysis of TAB inner lead fatigue in thermal cycle environments,” IEEE Transactions on Components, Package, and Manufacturing Technology, vol. 18, no. 1, pp. 101-107, 1994 [4] J. K. L. Lai, M. C. Loo, K. Y. Cheng, “Effects of bond temperature and pressure on microstructures of tape automated bonding (TAB) inner lead bonds (ILB) with thin tape metallization,” Electrionic Components and Technology Conference, pp. 819-826, 1995 [5] M. J. Yim, Y. D. Jeon, K. W. Paik, “Reduced thermal strain in flip chip assembly on organic substrate using low CTE anisotropic conductive film,” IEEE Transactions on Electronics Packaging Manufacturing, vol. 23, no. 2, pp. 171-176, 2000 [6] V. A. Chiriac, Y. T. Lee, “Transient thermal analysis of an ACF package assembly process,” IEEE Transactions on Components and Packaging Technology, vol. 24, no. 4, pp. 673-681, 2001 [7] C. Y. Yin, H. Lu, C. Bailey, Y. C. Chan, “Experimental and modeling analysis of the reliability of the anisotropic conductive films,” Electronics Components and Technology Conference, pp. 698-702, 2003 [8] 葉楚榆, “覆晶在熱壓合製程中之結構分析及性能改善,” 逢甲大學機械工程所碩士論文, 2005 [9] 陳宏成, “內引腳壓合成形過程之參數最佳化,” 逢甲大學材料與製造所碩士論文, 2006 [10] J. Li, Y. R. Wang, H. Zhang, “New passive compensating mechanism for athermalisation,” Infrared and Laser Engineering, vol. 35, no. 4, pp. 476-480, 2006 [11] P. Brackell, “Achieving Interconnection with Pulse-Heated Bonding,” Circuits Assembly, pp. 46-50, 2000 [12] 林紅, “解決熱膨脹對不同材料構件配合影響的方法,” 蘭州工業學報, 1997 [13] L. Su, X. D. Wang, C. Liu, “The mechanism design of RYJ-II hot embossing machine for polymer micro-fabrication,” Development and Innovation of Machinery and Electrical Products, vol. 19, no. 6, pp. 34-36, 2006 [14] E. M. Miao, “A study on the influence of the geometrical parameter on the thermal expansion of mechanical parts,” Journal of Applied Sciences, vol. 21, no. 2, pp. 217-220, 2003 [15] J. C. Chen and G. J. Sheu, “Structure and method of thermal stress compensation,” R.O.C. Patent No. I249470, 2005 [16] C. H. Li, C. W. Yu, F. M. Chen and S. W. Hsu, “Hot press head structure for plasma display panel,” R.O.C. Patent No. 563890, 2002 [17] H. Y. Chen, “Bonder with flatness adjustment,” R.O.C. Patent No. I272990, 2005 [18] C. S. Liao, “Liquid crystal display device and bump head for improving the bonding of chip on glass,” R.O.C. Patent No. I245945, 2003 [19] P. S. Huang, “Bonding apparatus and method,” R.O.C. Patent No. I232165, 2004 [20] L. W. Kang, “Chip on glass process, thermal compression process and device thereof,” R.O.C. Patent No. I306532, 2004 [21] M. J. O’Brien and W. B. Smith, “Method and apparatus for combined active and passive athermalization of an optical assembly,” U.S. Patent No. 5313333, 1994. [22] D. R. McCrary, “Passive thermal compensation method and apparatus,” U.S. Patent No. 5557474, 1996 [23] C. L. Pan, H. L. Ting and W. J. Jang, “Device for a passive module of optical gratings and communication,” U.S. Patent No. 0169577, 2005 [24] J. B. Moler, A. Dickey and K. Thornhill, “Integral thermal compensation for an electro-mechanical actuator,” U.S. Patent No. 7126259, 2006 [25] A. Gelman and E. Maliah, “Mechanism for passive thermal compensation in harsh environment,” Proc. of SPIE, vol. 6715, pp. 1-12, 2007 [26] A. Yunus, Heat transfer - a practical approach, pp. 466-475, McGraw-Hill, 1997 [27] J. M. Gere, Mechanics of materials-fifth edition, pp. 271-302, Brooks/Cole, 2001 | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/46990 | - |
| dc.description.abstract | 本文主要探討製作TFT-LCD面板的PCB壓合機台在加熱過程中，其壓合模組受到溫度效應影響而造成壓合頭的熱變形行為。首先以商業用3D繪圖軟體建立壓合模組之實體模型，之後將建立的模型匯入有限元素軟體ANSYS建立網格，然後分析壓合模組在加熱的過程中，溫度分佈的情況與其所造成的熱變形行為。模擬分析的結果顯示壓合模組會因為各元件之間的熱膨脹係數值不同與溫度差值的不同，而產生熱膨脹變形行為。基於此情況，本文將提出ㄧ針對壓合模組之熱補償機制來改善壓合模組之熱膨脹變形行為，在壓合頭的材料選用SKD61模具鋼，調整座的材料選用SUS303不銹鋼以及夾持元件的材料選用6061-T6鋁合金之條件下可有效的減小壓合模組所產生的熱膨脹變形。另外，本文也調整了調整座與壓合頭間的螺絲間距，在適當的螺絲間距下，可以讓壓合模組之刀具面維持在平整的狀態。最後透過整合型最佳設計程式設定壓合模組之6組加熱棒為設計變數，並進行功率最佳化設計之調整，其結果顯示當壓合模組之加熱棒功率分別調整至最佳值時，壓合模組的溫度分佈會有更為均勻的現象。 | zh_TW |
| dc.description.abstract | This paper investigates the thermal behaviors of PCB bonding modules for TFT-LCD panel under non-uniform temperature distribution caused by the heating process. Firstly, solid models of the PCB bonding modules are generated by commercial CAD software and then imported into commercial finite element analysis software for producing finite element meshes. The non-uniform temperature distribution and its thermal deformation in the heating process are analyzed. The results show that the PCB bonding modules would have the thermal deformation because of materials with different coefficients of thermal expansion. Next, this paper proposes a thermal compensated mechanism for the PCB bonding modules. When the SKD61 material is chosen as the bonding head, SUS303 as the parallel head, and Aluminum 6061-T6 as the clipping parts, the thermal deformation would be decreased effectively. Also, this paper adjusts the gap between parallel head and bonding head to decrease the thermal deformation. With a properly chosen gap value, the surface of the PCB bonding modules would be kept on a flat condition. Finally, an integrated optimum design program will be applied to search the best structural design for the PCB bonding modules with heating powers of the six specific locations chosen as design variables. The optimum design result shows that the PCB bonding modules with special designed heaters has more uniformly temperature distribution. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-15T05:44:46Z (GMT). No. of bitstreams: 1 ntu-99-R96522603-1.pdf: 7054341 bytes, checksum: 879f8c590b4123a3131642131d8a1578 (MD5) Previous issue date: 2010 | en |
| dc.description.tableofcontents | 目錄
誌謝 I 摘要 III Abstract V 目錄 VII 圖目錄 IX 表目錄 XI 符號表 XIII 第一章 前言 1 1.1 研究背景 1 1.2 文獻回顧 4 1.2.1 壓合應力與壓合溫度對壓合模組之影響 4 1.2.2 壓合模組之被動式熱補償機制 5 1.3 研究目的與動機 11 1.4 研究的策略與方法 11 1.5 論文大綱介紹 13 第二章 PCB壓合機台結構概述與相關理論分析 15 2.1 PCB壓合製程與設備簡介 15 2.2熱產生與空氣熱對流係數之評估 17 2.3熱變形產生之評估 20 第三章 壓合模組之熱分析 25 3.1 壓合模組之模型建立與FEA之分析流程 25 3.2 壓合模組之溫度分佈分析 28 3.2.1 上壓合模組與下支持模組之溫度分佈分析 28 3.3.2 上壓合模組之溫度分佈分析 32 3.3 上壓合模組之熱變形分析 39 第四章 熱補償機制與結構最佳化設計 41 4.1 上壓合模組之熱補償機制分析 41 4.2 上壓合模組之結構最佳化設計分析 56 4.3 上壓合模組之熱變形計算與驗證 60 4.4 上壓合模組之熱補償設計結果 67 第五章 結論與建議 69 5.1 結論 69 5.2 建議 71 參考文獻 73 附錄A 壓合模組之熱分析相關係數計算 75 A.1 熱負載係數計算 76 A.2 自然對流係數計算 76 A.3 強制對流係數計算 81 附錄B 結構最佳化設計程式使用手冊 83 B.1 結構最佳化程式說明 83 B.2 最佳化問題設定 84 B.3 連結有限元素分析 88 B.4 有限元素分析巨集命令的介紹 90 B.5 最佳化程式之執行與檢視 93 作者簡歷 95 | |
| dc.language.iso | zh-TW | |
| dc.title | PCB壓合模組之熱分析與結構最佳化設計 | zh_TW |
| dc.title | Thermal Analysis and Structural Optimum Design of PCB Bonding Modules | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 98-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 林陽泰(Yang-Tai Lin),史建中(Chien-Jong Shih) | |
| dc.subject.keyword | PCB壓合機台,有限元素分析,熱分析,熱補償機制,結構最佳化設計, | zh_TW |
| dc.subject.keyword | PCB bonding module,finite element analysis,thermal analysis,thermal compensated mechanism,structural optimum design, | en |
| dc.relation.page | 95 | |
| dc.rights.note | 有償授權 | |
| dc.date.accepted | 2010-08-19 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
| 顯示於系所單位： | 機械工程學系 | |
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|---|---|---|---|
| ntu-99-1.pdf 目前未授權公開取用 | 6.89 MB | Adobe PDF |
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