請用此 Handle URI 來引用此文件:
http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/46473
標題: | 藉由抑制雜訊傳播路徑去除帶有系統級封裝之進階平面印刷電路板內雜訊的方法 Noise Suppression Methods by Eliminating Transfer Path on Advanced PCB with SiP Module |
作者: | Chung-Hsiang Huang 黃俊翔 |
指導教授: | 吳宗霖(Tzong-Lin Wu) |
關鍵字: | 保角屏蔽,接地連通柱,電磁能隙結構,電磁輻射,接地彈跳雜訊,耦合雜訊,電源完整度, conformal shielding,ground via,electromagnetic bandgap (EBG) structure,electromagnetic interference (EMI),ground bounce noise (GBN),coupling noise,power integrity (PI), |
出版年 : | 2010 |
學位: | 碩士 |
摘要: | 本論文針對帶有系統級封裝之進階平面印刷電路板內三種不同類型的雜訊個別提出相對應的雜訊抑制方法。第一種方法是保角屏蔽(conformal shielding)技術。實驗架設與測試板被提出來評估保角屏蔽技術的屏蔽效果。實驗架設是針對極小幅射利Giga赫茲橫向電磁波傳輸室(GTEM Cell)來提供低雜訊干擾與高敏感度。基於提出的流程一個有1微米鍍銅的測試板被實作出來,擁有大約36-50dB的屏蔽效果在1 GHz到6 GHz之間。
在平行的接地面中的耦合雜訊是第二種類型的雜訊。一個接地連通柱方法被提出來提供寬頻截止頻帶來抑制這種類型的雜訊。接地連通柱方法是利用周期性放置聯通柱來連結接地面。一個解析解被推導出來評估利用接地連通柱方法的截止頻帶,它可以被用來設計任意有興趣的截止頻段。利用連通柱方法來達到幅射與耦合的抑制將被呈現。 在電源層與接地層之中的接地彈跳雜訊(ground bounce noise)為第三種類型的雜訊,一個鑲嵌平面式電磁能隙結構(embedded planar EBG structure)被提出來抑制這種類型的雜訊。鑲嵌平面式電磁能隙結構是將平面式電磁能隙結構鑲嵌在接地面之間並於利用周期性的連通柱連接接地面,它可以被應用在多層式印刷式電路板或是封裝內的電源層。一個有效的二維理論被提出來精準的預測平面式電磁能隙結構的第一個電磁能隙,並擴展至預測鑲嵌平面式電磁能隙結構的第一個電磁能隙。鑲嵌平面式電磁能隙結構被製作在Fr4玻璃纖維板上來展示在電源雜訊與耦合雜訊的傑出表現。 Three noise suppression methods are presented to eliminate three different types of noise in advanced printed circuit board (PCB) with System-in-Package (SiP) module. The first one is the conformal shielding technique. A measurement setup and test vehicles are proposed to systematically evaluate the shielding effectiveness of the conformal shielding technique. The experiment setup using the Giga-hertz transverse electromagnetic (GTEM) cell is proposed for providing low noise floor and high sensitivity for measuring very small radiation. Based on the proposed procedures, 1 μm sputtering copper coating on the test vehicle is manufactured and has about 36-50 dB of shielding effectiveness from 1GHz to 6 GHz. For coupling noises between parallel ground planes is the second kind of noise. A ground via method is proposed to provide broad stopband to suppress this type noise. The ground via method is to put vias periodically to connect ground planes. An analytical solution is derived to estimate the bandgap for using the ground via method, and it can be used to design for arbitrary interested stopband. Emission suppression and coupling noise isolation by using ground via method is presented. The ground bounce noise (GBN) between power and ground planes is the third kind of noise, an embedded planar EBG structure is proposed to suppress this type noise. The embedded planar EBG is embedding planar type EBG structure between ground planes and periodically putting ground vias that connect to ground planes, and it can be applied to multi-layer PCB or SiP modules power planes. An efficient 2D theory is proposed to accurately estimate the 1st bandgap of the planar type EBG structures, and extend to predict the 1st bandgap of embedded planar type EBG structures. The equivalent problems are proposed to simplify the calculating procedures for the 1st bandgap. The embedded planar EBG structures are fabricated on FR4 to demonstrate the excellent performance of power noise and coupling noise isolation. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/46473 |
全文授權: | 有償授權 |
顯示於系所單位: | 電信工程學研究所 |
文件中的檔案:
檔案 | 大小 | 格式 | |
---|---|---|---|
ntu-99-1.pdf 目前未授權公開取用 | 4.94 MB | Adobe PDF |
系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。