請用此 Handle URI 來引用此文件：
http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/45378完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 莊東漢 | |
| dc.contributor.author | Yu-Yun Shiue | en |
| dc.contributor.author | 薛淯勻 | zh_TW |
| dc.date.accessioned | 2021-06-15T04:16:59Z | - |
| dc.date.available | 2010-01-11 | |
| dc.date.copyright | 2010-01-11 | |
| dc.date.issued | 2009 | |
| dc.date.submitted | 2009-12-28 | |
| dc.identifier.citation | 1. C. Wu, D. Yu, C. Law, and L. Wang, “Properties of lead-free solder alloys with rare element additions”, Mater. Sci. Eng. R, 2004, vol. 44, p. 1.
2. X. Ma, Y. Qian, and F. Yoshida, “Effect of La on the Cu–Sn intermetallic compound (IMC) growth and solder joint reliability”, J. Alloys Compounds, 2002, vol. 334, pp. 224. 3. Z. Chen, Y. Shi, Z. Xia, and Y. Yan , “Properties of Lead-Free Solder SnAgCu Containing Minute Amounts of Rare Earth”, J. of Electron. Mater., 2003, vol. 32, n.4, pp. 235. 4. T. Chuang and S. Yen, “Abnormal Growth of Tin Whiskers in a Sn-3Ag-0.5Cu-0.5Ce Solder BGA Package”, J. of Electron. Mater., 2006, vol. 35, n. 8, pp. 1621. 5. T. Chuang, “Temperature Effects on the Whiskers in Rare-Earth Doped Sn-3Ag-0.5Cu-0.5Ce Solder Joints”, Metall. Mater. Trans., 2007, vol. 38A, pp. 1048. 6. T. H. Chuang and H. J. Lin, “ Size Effect of Rare-Earth Intermetallics in Sn-9Zn-0.5Ce and Sn-3Ag-0.5Cu-0.5Ce Solders of the Growth of Tin Whiskers”, 2008, Metall. Mater. Trans., vol. 39, pp. 2862. 7. T. Chuang and H. Lin, “Inhibition of Whisker Growth on the Surface of Sn-3Ag-0.5Cu-0.5Ce Solder Alloyed with Zn”, J. Electron. Mater., 2009, vol. 38, pp. 420. 8. Z. Mei and J. Morris Jr., “Characterization of Eutectic Sn-Bi Solder Joints”, J. Electron. Mater., 1999, vol. 21, pp. 599. 9. C. Giffels, R. Gashler, J. Morabito and K. Striny, AT&T Technical Journal, 1987, vol. 66, pp. 31. 10.M. Pinnel and W. Knausengerger, AT&T Technical Journal, 1987, vol. 66, pp. 66. 67 11. S. Kang and V. Ramachandran, “Growth kinetics of intermetallic phases at the liquid Sn and solid Ni interface”, Scripta Metall., 1980, vol. 14, pp. 421. 12.C. Kao, Mater. Sci. Eng. A, 1997, vol. 238, pp. 196. 13. E. Rideout, 1994 IEEE/CPMT Int. Elect. Manufact. Tech. Smp., 1994, pp. 388. 14. 謝坤龍and 王正全, “PCB無鉛表面處裡製程技術之介紹”, 工業材料雜誌, 2004, 207, pp. 159. 15.C. Lee, J. Yoon, Y. Kim, and S. Jung, “Interfacial reactions and joint reliability of Sn-9Zn solder on Cu or electrolytic Au/Ni/Cu BGA substrate”, Microelectron. Eng., 2005, vol. 82, pp. 561. 16. J. Yoon and S. Jung, “Solder Joint Reliability Evaluation of Sn-Zn/Au/Ni/Cu Ball-Grid-Array Package During Aging”, Mater. Sci. Eng. A, 2007, vol. 452, pp. 46. 17. S. Herat, “Green Electronics through Legislation and Lead Free Soldering”, Clean 2008, Vol. 36, iss. 2, pp. 145. 18.HDP User Group International Inc., “Lead Free Soldering”, 1999, Doc Number Projo32, Rev A. 19. “Eco-Technology 2000”, Japanese Printed Circuit Association Show 2000, Japan, 2000. 20. “Lead-Free Project Focuses on Electronics Assemblies”, Advanced Packaging, 2000. 21.C. Ernhart and S. Scarr, “New Directions in Child and Family Research”, ACYF Research Conference, 1991. 22.N. Lee, “Getting Ready for Lead-Free Solders”, Soldering & Surface Mount Technology, 1997, vol. 9, iss. 2, pp. 65. 23.C. Melton, “Alternative of Lead Bearing Solder Alloys”, Proceeding of the 1993 IEEE International Symposium on Electronics and the 68 Environment, Arlington, USA, 1993, pp. 94. 24.D. Suraski and K. Seelig, “The Current Status of Lead-Free Solder Alloys”, IEEE Transactions on Electronics Package Manufacturing, 2001, vol. 24, n. 4, pp. 244. 25.M. Abtew, G. Selvaduray, “Lead-Free Solders in Microelectronics”, Mater. Sci. and Eng.: R, 2000, vol. 27, iss. 5, pp. 95. 26.M. Chiu, S. Chang, Y. Tseng, Y. Chan, T. Chuang, “Characterization of Intermetallic Compounds Formed During the Interficial Reaction of Liquid Sn and Sn58Bi Solders with Ni Substrates”, Z. Metallkd, 2002, pp. 248. 27. P. Liu and J. Shang, “Interfacial Segregation of Bismuth in Copper/Tin-Bismuth Solder Interconnect”, Scripta Materials, 2001, pp. 1019. 28. P. Liu and J. Shang, “Interfacial Embrittlement by Bismuth Segregation in Copper/Tin-Bismuth Pb-Free Solder Interconnect”, J. of Mater. Research, 2001, vol. 16, n. 6, pp. 1651. 29. T. Chuang, H. Wu, M. Cheng, S. Chang, and S. Yen, “Mechanisms for Interfacial Reactions between Liquid Sn-3.5Ag Solders and Cu Substrates”, J. Electron. Mater., 2004, vol. 33, n. 1, pp. 22. 30.D. Yu, J. Zhao, and L. Wang, “Improvement on the Microstructure Stability, Mechanical and Wetting Properties of Sn-Ag-Cu Lead-Free Solder with the Addition of Rare-Earth Elements”, J. of Alloys and Compounds, 2004, vol. 376, pp. 170. 31.C. Law, C. Wu, D. Yu, L. Wang, and J. Lai, “Microstructure, Solderability, and Growth of Intermetallic Compounds of Sn-Ag-Cu-RE Lead-free Solder Alloys”, J. of Electron. Mater., 2006, vol. 35, n. 1, pp. 89. 32.C. Wu, D. Yu, C. Law, and L. Wang, “The properties of Sn-9Zn Lead-Free Solder Alloys Doped with Trace Rare Earth Elements”, J. 69 of Electron. Mater., 2002, vol. 31, n. 9, pp. 921. 33.C. Wu, C. Law, D. Yu, and L. Wang, “The Wettability and Microstructure of Sn-Zn-RE Alloys”, J. of Electron. Mater., 2003, vol. 32, n. 2, pp. 63. 34. L. Wang, D. Yu, J. Zhao, and M. Huang, “Improvement of Wettability and Tensile Property in Sn-Ag-RE Lead-Free Solder Alloy”, Materials Letters, 2002, vol. 56, pp. 1039. 35.C. Wu and Y. Wong, “Rare-Earth Additions to Lead-Free Electronic Solders”, J. of Mater. Sci.: Mater. in Electron., 2007, vol. 18, pp. 71. 36.C. Wu, D. Yu, C. Law, and L. Wang, “Improvements of Microstructure, Wettability, Tensile and Creep Strength of Eutectic Sn-Ag alloy by Doping with Rare-earth Elements”, J. of Mater. Research, 2002, vol. 17, n. 12, pp. 3146. 37.C. Law and C. Wu, “Microstructure Evolution and Shear Strength of Sn-3.5Ag-RE Lead-free BGA Solder Balls”, High Density Microsystem Design and Packaging and Component Failure Analysis, 2004 HDP Proceeding of the Sixth IEEE/CPMT Conference, 2004, pp. 60. 38. Z. Chen, Y. Shi, Z. Xia, and Y. Yan, “Study on the Microstructure of a Novel Lead-Free Solder Alloy SnAgCu-RE and Its Soldered Joints”, J. of Electron. Mater., 2002, vol. 31, n. 10, pp. 1122. 39. Z. Chen, Y. Shi, Z. Xia, and Y. Yan, “Properties of Lead-Free Solder SnAgCu Containing Minute Amounts of Rare Earth”, J. of Electron. Mater., 2003, vol. 32, n. 4, pp. 235. 40.C. Wu, D. Yu, C. Law, and L. Wang, “Microstructure and Mechanical Properties of New Lead-Free Sn-Cu-RE Solder Alloys”, J. of Electron. Mater., 2002, vol. 31, n. 9, pp. 928. 41. Z. Chen, Y. Shi, and Z. Xia, “Constitutive Relations on Creep for SnAgCuRE Lead-Free Solder Joints”, J. of Electron. Mater., 2004, 70 vol. 33, n. 9, pp. 964. 42.M. Dudek, R. Sidhu, N. Chawla, and M. Renavikar, “Microstructure and Mechanical Behavior of Novel Rare Earth Containing Pb-Free Solders”, J. Electron. Mater., 2006, vol. 35, n. 12, pp. 2088. 43.M. Dudek, R. Sidhu, and N. Chawla, “Novel Rare-earch-containing Lead-Free Solders with Enhanced Ductility”, J. of the Minerals, Metals and Materials Society, 2006, vol. 58, n. 6, pp. 57. 44.B. Li, Y. Shi, Y. Lei, F. Guo, Z. Xia, and B. Zong, “Effect of Rare Earth Element Addition on the Microstructure of Sn-Ag-Cu Solder Joint”, J. of Electron. Mater., 2005, vol. 34, n. 3, pp. 217. 45.G. Li, Y. Shi, H. Hao, Z. Hia, Y. Lei, F. Guo, and X. Li, “Effect of Rare Earth Addition on Shear Strength of SnAgCu Lead-free Solder Joints”, J. of Mater. Sci.: Mater. in Electron., 2008. 46.K. Ro Nka, F. Van Loo, and J. Kivilahti, “A Diffusion-Kinetic Model for Predicting Solder/Conductor Interactions in High Density Interconnections”, Metall. and Mater. Trans. A, vol. 29 A, pp. 1998. 47.C. Ho, S. Yang, and C. Kao, “Interfacial Reaction Issues for Lead-free Electonic Solders”, J. of Mater. Sci.: Mater. in Electon., 2007, vol. 18, n. 1, pp. 155. 48. J. Vanbeek, S. Stolk, and F. Vanloo, “Multiphase Diffusion in the Systems Fe-Sn and Si-Sn”, Zeitchrift Fur Metallkunde, 1982, vol. 73, n. 7, pp. 439. 49.W. Ellis, D. Gibbons, and R. Treuting, “Growth and Perfection of Crystals”, New York: John Wiley & Sons, 1958. 50. T. Chuang and S. Yen, “Abnormal Tin Whisker Growth in Rare-earth Element-Doped Sn3Ag0.5CuXCe Solder Joints”, Materials Science Forum, Supplement to THERMEC 2006 5th International Conference on PROCESSING and MANUFACTURING of ADVANCED MATERIALS, 2007, vol. 539, n. part 4, pp. 4019. 71 51. T. Chuang, “Temperature Effects on the Whiskers in Rare-earth Doped Sn-3Ag-0.5Cu-0.5Ce Solder Joints”, Metall. and Mater. Trans. A: Phy. Metall. and Mater. Sci., 2007, vol. 38A, n. 5, pp. 1048. 52. T. Chuang and S. Yen, “Abnormal Tin Whisker Growth in Rare Earth Element-Doped Sn-3Ag-0.5Cu Solder Joints”, Material Forum, in press, 2006. 53. T. Chuang, “Rapid Whisker Growth on the Surface of Sn-3Ag-0.5Cu-1.0Ce Solder Joints”, Scripta Mater., 2006, vol. 55, p. 983. 54.M. Schaeffer, W. Laub, R. Fournelle, and J. Liang, “Design and Reliability of Solders and Solder Interconnections”, Warrendale, PA: TMS, 1997, pp. 247. 55. S. Chada, R. Fournelle, W. Laub, and D. Shangguan, “Copper Substrate Dissolution in Eutectic Sn-Ag Solder and Its Effect on Microstructure”, J. Electron. Mater., 2000, vol. 29, pp. 1214. 56. F. Song, S. Lee, K. Newman, B. Sykes, and S. Clark, “Brittle Failure Mechanism of SnAgCu and SnPb Solder Balls during High Speed Ball Shear and Cold Ball Pull Tests”, IEEE Proc. of Electronic Components and Technology Conference, 2007, pp. 364. 57. F. Song, S. Lee, K. Newman, B. Sykes, and S. Clark, “High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed”, IEEE Proc. of Electronic Components and Technology Conference, 2007, pp. 1504. 58. S. Arnold, Electronic Components Conference, 1959, Philadelphia. 59. J. Osenbach, M. Delucca, B. Potteiger, A. Amin, and F. Baiocchi, “Sn-Whiskers: Truths and Myths”, J. Mater. Sci.: Mater. Electron, 2007, vol. 18, pp. 283. 60.C. Xu, Y. Zhang, C. Fan, and J. Abys, “Driving Force for the 72 Formation of Sn Whiskers: Compressive Stress-Pathways for its Elimination and Minimization”, IEEE Transactions on Electronics Packaging Manufacturing, 2005, vol. 28, n. 1, pp. 31. 61.K. Tu, C. Chen, and A. Wu, “Stress Analysis of Spontaneous Sn Whisker Growth”, J. Mater. Sci.: Mater. Electron, 2007, vol. 18, pp. 269. 62.K. Tu, “Cu/Sn Interfacial Reactions: Tin-Film Case Versus Bulk Case”, Mater. Chem. and Phys., 1996, vol. 46, n. 2, pp. 217. 63.B. Lee and D. Lee, “Spontaneous Growth Mechanism of Tin Whiskers”, Acta Materialia, 1998, vol. 46, n. 10, pp. 3701. 64.C. Xu, Y. Zhang, C. Fan, and J. Abys, “Understanding Whisker Phenomenon: The Driving Force for Whisker Formation”, CircuiTree, 2002, vol. 15, n. 15, pp. 10. 65.N. Lee, 1998先進電子封裝技術趨勢研討會講義, 新竹, 1998, pp. 81. | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/45378 | - |
| dc.description.abstract | 在Sn-58Bi合金成份中，添加重量百分比0.5％的La，會形成平板狀介金屬鑲嵌在銲錫基地中，且因形狀效應抑制含稀土介金屬錫鬚快速生長現象。經過迴銲，Sn-58Bi和Sn-58Bi-0.5La銲錫合金與化鎳金（ENIG）基板生成Ni3Sn4介金屬化合物，與有機保銲膜（OSP）基板生成Cu6Sn5介金屬化合物，且隨著在75℃和100℃時效處理的時間增加，介金屬化合物呈線性成長，且Sn-58Bi-0.5La合金系統界面介金屬相較Sn-58Bi合金系統薄許多。然而，Sn-58Bi-0.5La合金系統，稀土元素La活性大容易氧化，迴銲時氧化物被助銲劑帶出，在銲錫與基板之間產生孔洞，導致接合強度下降，相較於Sn-58Bi合金系統封裝強度為差。此外，Sn-58Bi和Sn-58Bi-0.5La銲錫的慢速（0.4 mm/s）及快速（2000 mm/s）推球試驗，破斷面都呈現脆性破壞。 | zh_TW |
| dc.description.abstract | Adding 0.5 wt.％ La into Sn-58Bi solder alloy forms plate-shaped intermetallic compound in solder matrix. And the fast tin whisker growth is alleviated by the shape effect on rare-earth element containing intermetallic compound. After reflowing, Sn-58Bi and Sn-58Bi-0.5La solder alloys form Ni3Sn4 interfacial intermetallic compound with ENIG pads and form Cu6Sn5 interfacial intermetallic compound with OSP pads. The thickness of interfacial intermetallic compounds linearly grows with aging time at both 75℃ and 100℃. And the thickness of interfacial intermetallic compound in Sn-58Bi-0.5La alloy is much thinner than the one in Sn-58Bi alloy. However, the rare-earth La in Sn-58Bi-0.5La alloy is very active and oxidizes easily which leads the oxidization to be brought out by the flux during reflowing. Then the holes form on the interface between solder and pad and result in lower bonding strength compared with Sn-58Bi alloy system. In addition, the cleavage of both ball shear test (0.4 mm/s) and high speed ball shear test (2000 mm/s) of Sn-58Bi and Sn-58Bi-0.5La solder alloys shows brittle fracture. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-15T04:16:59Z (GMT). No. of bitstreams: 1 ntu-98-R97527024-1.pdf: 21491667 bytes, checksum: 481e6c3f28b2dc6cc4b69cf7dd8a08f9 (MD5) Previous issue date: 2009 | en |
| dc.description.tableofcontents | 摘要................................................II
Abstract...........................................III 目錄 ...............................................IV 1. 前言......................................................................................................1 2. 理論與文獻回顧..................................................................................2 2.1 電子構裝技術發展....................................................................2 2.2 球格陣列構裝技術發展............................................................2 2.3 無鉛銲錫相關文獻回顧............................................................4 2.4 無鉛銲錫添加稀土元素研究....................................................6 2.5 界面反應動力學........................................................................9 2.6 推球試驗..................................................................................10 2.7 錫鬚理論..................................................................................11 3. 實驗方法............................................................................................16 3.1 銲錫合金製備..........................................................................16 3.2 X光繞射儀分析......................................................................16 3.3 示差掃描熱卡儀分析..............................................................16 3.4 拉伸試驗..................................................................................16 3.5 維克式微硬度分析..................................................................17 3.6 腐蝕電化學分析......................................................................17 3.7 錫鬚成長觀察..........................................................................17 3.8 球格陣列構裝之界面反應觀察..............................................18 IV 3.9 球格陣列構裝之推球強度試驗..............................................18 4. 結果與討論........................................................................................22 4.1 Sn-58Bi及Sn-58Bi-0.5La銲錫性質.......................................22 4.2 球格陣列構裝研究..................................................................35 5. 結論....................................................................................................64 6. 參考文獻............................................................................................66 Publication List.........................................................................................73 | |
| dc.language.iso | zh-TW | |
| dc.subject | 無鉛銲錫 | zh_TW |
| dc.subject | 介金屬化合物 | zh_TW |
| dc.subject | 界面反應 | zh_TW |
| dc.subject | 快速推球試驗 | zh_TW |
| dc.subject | 稀土元素 | zh_TW |
| dc.subject | interfacial reaction | en |
| dc.subject | high speed ball shear test | en |
| dc.subject | intermetallic compound | en |
| dc.subject | rare-earth element | en |
| dc.subject | lead-free solder | en |
| dc.title | 添加稀土元素La對Sn-58Bi無鉛銲錫球格陣列構裝界面反應與錫鬚之影響研究 | zh_TW |
| dc.title | Effects of La Addition on Interfacial Reactions and Tin Whisker Growth of Sn-58Bi Solder BGA Packages | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 98-1 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 施漢章,林招松,吳春森,張世穎 | |
| dc.subject.keyword | 無鉛銲錫,稀土元素,介金屬化合物,界面反應,快速推球試驗, | zh_TW |
| dc.subject.keyword | lead-free solder,rare-earth element,intermetallic compound,interfacial reaction,high speed ball shear test, | en |
| dc.relation.page | 73 | |
| dc.rights.note | 有償授權 | |
| dc.date.accepted | 2009-12-29 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 材料科學與工程學研究所 | zh_TW |
| 顯示於系所單位： | 材料科學與工程學系 | |
文件中的檔案：
| 檔案 | 大小 | 格式 | |
|---|---|---|---|
| ntu-98-1.pdf 未授權公開取用 | 20.99 MB | Adobe PDF |
系統中的文件，除了特別指名其著作權條款之外，均受到著作權保護，並且保留所有的權利。