應用壓電微幫浦於迴路式水循環系統之開發與應用

Abstract

隨著半導體製程技術逐漸進步，電子元件的發熱量也愈來愈高，而在高功率電子元件晶片表面的發熱量並不是均勻分布，甚至會有熱量聚集在一點的情形發生，稱之為熱點，此高度溫度分布不均的狀況，容易造成電子元件的損壞。 本研究利用微機電製程技術，成功的開發出一種新型迴路式水循環系統，其功能在於推動工作流體，將熱點的熱帶到晶片表面的其他位置，增加熱的擴散，如此可以使晶片表面的溫度分布更加均勻。本研究針對迴路式水循環系統設計五種不同的幾何形狀，並利用微粒子影像測速儀得到在不同操作電壓與頻率下的流量，在操作電壓40 V、操作頻率為0.9 kHz時，可以提供91.4 μl/min的流量。實驗結果也顯示此裝置確實可以增加電子元件熱的擴散。 本裝置並具有製程簡易及高整合性等優勢，更可與電子元件製程互相整合，實為未來發展高效能與高可靠度之電子元件所不可缺乏之關鍵系統。

With continuous progress of semiconductor technology not only are the total heat fluxes of electronic devices increasing, but also are the heat flux distribution highly non-uniform over the die area. The local area of high heat flux which referred to as so called a hot spot adversely affect the reliability, performance and yield of an electronic device. In this study, a novel closed-loop water system by using micro- pumps was successfully developed by MEMS technique. The working fluid was driven by two valveless micropumps to transport heat from hot spot to other locations of the device and enhance heat-spreading. As a result, the temperature distribution of the chip surface became more uniform. Five geometric designs of the closed-loop water system were used. The flow rates at various driving voltages and frequencies were measured by Micro-PIV technique. A maximum flow rate of 91.4 μl/min was observed at driving voltage of 40 V and frequency of 0.9 kHz. The results also demonstrated the device had an ability to enhance heat-spreading of an electronic device In summary, the advantages of the present closed-loop water system are easy fabrication and high integration ability. The fabrication processes could be integrated with other electronic devices. In the future, the present system has the potential to integrate with the other electronic devices and increases their reliability.