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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 張家歐 | |
dc.contributor.author | Po-Chao Tsai | en |
dc.contributor.author | 蔡博釗 | zh_TW |
dc.date.accessioned | 2021-06-15T02:35:41Z | - |
dc.date.available | 2016-08-22 | |
dc.date.copyright | 2011-08-22 | |
dc.date.issued | 2011 | |
dc.date.submitted | 2011-08-16 | |
dc.identifier.citation | [1] 楊龍杰, “認識微機電,”滄海出版社,2001.
[2] M. Bao and W. Wang, “Future of Microelectromechanical Systems (MEMS),” Ssensors and Actuators A56, pp.135-141 , 1996. [3] M.A. LEMKIN et al, “A 3-axis force balanced accelerometer using a single proof-mass,” Solid State Sensors and Actuators, Vol. 2, pp.1185-1188, 1997. [4] Analog Device ADXL210 accelerometer datasheet. http://www.analog.com/pdf/ADXL202_10_b.pdf. [5] Navid Yazdi,Farrokh Ayazi, and Khalil Najafi, “ Micromachined Inertial sensor,” in Proc. of the IEEE, Aug. 1998 ,pp1640-1659 [6] Analog Devices, “ ADXL-Monolithic Accelerometer with signal conditioning, ” Datasheet, One Technology Way, Norwood, MA02062,1993. [7] N. Wongkomet, ”Position sensing for Electrostatic Micropositioners,” EECS Department, University of California, Berkeley ,1998. [8] B. E. Boser and R. T. Howe, “Surface Micromachined Accelerometer,” IEEE Journal of Solid-State Circuits, Vol. 31, No. 3,1996. [9] Bernhard E. Boser, ”Capacitive Position Sense Circuit”, EECS Department, University of California, Berkeley ,1996. [10] Bernhard E. Boser, ”Electronics for Micromachined Inertial Sensor, ” EECS Department, University of California, Berkeley ,1997 [11] Zsolt Kádár, “ Integrated Resonant Magnetic Field Sensor,” EE Department , Delft University of Technology, 1997. [12] 鍾啟晨, “The design of micro-capacitive sensing circuit for inertial sensor,” 國立清華大學微機電系統工程研究所,碩士論文,2003. [13] 毛志強, “The Design, Simulation and Fabrication of Differential Capacitive Sensing Circuits of Micro Gyroscope,” 國立交通大學電機與控制工程研究所,碩士論文,2004. [14] 陳世昌, “位移電容感測器之研究設計,”國立台灣大學應用力學研究所, 碩士論文, 2006. [15] 王毓斌,“非等向性矽材環式振動陀螺儀之研製,”國立台灣大學應用力學研究所, 碩士論文, 2007. [16] Farrokh Ayazi, Khalil Najafi, “ A HARPSS Polysilicon Vibrating Ring yroscope, ”IEEE Journal of MEMS, Vol. 10, No. 2, Jun 2001. [17] 張家歐,周傳心,張簡文添, “微型陀螺儀研製(二),” 中山科學研究院委託合作研究計畫期末報告,2004. [18] CIC訓練課程 , “Full-Custom IC Design Concepts , ” 國研院國家片系統設計中心. [19] Alan Hastings, “The Art of Analog Layout, ” Pearson International. [20] Behzad Razavi, “Design of Analog CMOS Integrated Circuits, ” McGraw-Hill. [21] Paul Horowitz, Winfield Hill, “The Art of Electronics, ”Cambridge University Press. [22] 黃韋皓,“電容感測電路之設計模擬與佈線, ”國立台灣大學應用力學研究所,碩士論文, 2007. | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/43998 | - |
dc.description.abstract | 本論文之目的旨在探討環形振動式陀螺儀的感測電路設計與實現。環形振動式陀螺儀是利用微機電製程所製造的微小結構,透過振動時結構的改變所產生的電容值變化,來推算角速度的變化量。而這個電容值的變化非常微小,通常在fF等級,因此若使用打線將訊號外接到電路板上會造成訊號太小雜訊過大而無法觀測到理想的訊號。因此本論文將感測電路積體化,藉此減少打線的距離以及電路的雜訊,提升訊號的靈敏度。
由於整體電路為電容感測架構,所以感測訊號的速度將受限於電容充放電時間的限制。因此本論文另設計不同工作週期的載波,來增加感測的時間,提升整體晶片效能。 本論文使用國家晶片系統設計中心(NSC Chip Implementation Center, CIC)所提供的台灣積體電路(TSMC)0.35μm Mixed-Signal 2P4M Polycide 3.3/5V的製程,並使用Synopsys 公司所出的Hspice電路模擬軟體與Cadence公司的Virtuoso軟體進行模擬及佈線。 | zh_TW |
dc.description.abstract | Probing into design of the capacitance detecting circuit for the ring type gyroscope is the purpose of this thesis. Ring type gyroscope is a small structure made with MEMS process. The sensing signal of this gyroscope due to the gap changes while the angular velocity variation , then the capacitive value between the gap changes too. The capacitive value is very small and usually of fF grade. If we connect this signal to the sensing circuit on PCB , this signal can not be examined out because the signal/noise ratio is too small. So in this thesis , we design and fabrication the capacitance sensing circuit in integrated circuit technology in order to reduce the noise of the sensing circuit.
For our capacitive displacement sensing circuit, the work efficiency is limited by the capacitor charge and discharge times. Therefore, we use the different duty cycle carrier to increase the sensing time and the overall structure performance. This dissertation is applying 0.35μm Mixed-Signal 2P4M Polycide 3.3/5V manufacture process of TSMC which is provided by NSC Chip Implementation Center. Finally, using Hspice software designed by Synopsys co. to simulate and Virtuoso software designed by Candence co. to layout. | en |
dc.description.provenance | Made available in DSpace on 2021-06-15T02:35:41Z (GMT). No. of bitstreams: 1 ntu-100-R98543042-1.pdf: 4169897 bytes, checksum: 17d35741e8c5bba6d713b4565049f2e7 (MD5) Previous issue date: 2011 | en |
dc.description.tableofcontents | 口試委員審定書 I
致謝 II 摘要 III Abstract IV 目錄 V 圖目錄 VII 表目錄 XII 第一章 導論 1 1.1 研究背景 1 1.2 研究動機與目的 3 1.3 文獻回顧 3 1.4 本文目的與章節摘要 9 第二章 振動式陀螺儀之作動原理與分析 11 2.1 環形振動式陀螺儀之作動原理 12 2.2 環形振動式陀螺儀之感測原理 13 2.3 陀螺儀架構與電容值計算 14 2.4 本論文架構之電容值的估算 15 第三章 晶片設計與佈局簡介 17 3.1 前言 17 3.2 晶片設計與佈局流程說明 17 3.3 元件佈局方式 19 3.4 佈局設計之考量要素 27 第四章 電路架構與運算放大器之設計 28 4.1 全電路架構之設計概念 28 4.2 摺疊疊接式運算放大器 30 4.3 摺疊疊接式運算放大器佈局 31 4.4 寬振幅常數轉導偏壓電路 32 4.5 摺疊疊接式放大器的特性模擬 34 第五章 離散元件的佈局與模擬 41 5.1 取樣與保存電路 41 5.2 無穩態多諧振盪器 43 5.3 緩衝器 47 5.4 MOS電阻的設計 48 5.5 S/H之時脈設計 50 5.6 65% duty cycle 載波訊號設計 53 5.7 靜電防護PAD 55 第六章 全電路佈局模擬與量測 58 6.1 全電路系統架構 58 6.2 感測電路之後模擬結果 59 6.3 差動電路之後模擬結果 62 6.4 外加測試訊號 64 6.5 65% duty cycle 全電路佈局與模擬 66 6.6 晶片量測結果與檢討 72 第七章 結論與未來展望 77 參考文獻 78 附錄A 80 附錄B 86 附錄C 92 附錄D 93 | |
dc.language.iso | zh-TW | |
dc.title | CMOS差動式微位移感測電路研製 | zh_TW |
dc.title | Design and Fabrication of CMOS Differential Circuit for Micro-Displacement Sensing | en |
dc.type | Thesis | |
dc.date.schoolyear | 99-2 | |
dc.description.degree | 碩士 | |
dc.contributor.coadvisor | 謝發華 | |
dc.contributor.oralexamcommittee | 張簡文添,陳柏志 | |
dc.subject.keyword | 電容感測器,類比積體電路,折疊疊接放大器,IC設計,佈局, | zh_TW |
dc.subject.keyword | capacitive sensor,analog integrated circuit,folded cascode amplifier,IC design,layout, | en |
dc.relation.page | 93 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2011-08-17 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 應用力學研究所 | zh_TW |
顯示於系所單位: | 應用力學研究所 |
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