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| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 高振宏(C.Robert Kao) | |
| dc.contributor.author | Chih-Feng Chiang | en |
| dc.contributor.author | 蔣智峰 | zh_TW |
| dc.date.accessioned | 2021-06-15T01:50:30Z | - |
| dc.date.available | 2009-07-14 | |
| dc.date.copyright | 2009-07-14 | |
| dc.date.issued | 2009 | |
| dc.date.submitted | 2009-07-03 | |
| dc.identifier.citation | [1] 謝宗雍，”電子構裝技術簡介”，電子月刊第三卷第七期，1997年7月，p.57-p.76
[2] J.H. Lau, ”Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies”, McGraw-Hill, (2000) [3] 楊雅嵐，”覆晶封裝逆勢成長12吋凸塊設備為重點市場”，新電子科技雜誌222期，2004年9月 [4] J.H. Lau, ”Flip Chip Technologies”, McGraw-Hill, (1996) [5] Rao R. Tummala, president of the IEEE-CPMT Society, EP&P, 6/1/2003 [6] E.M. Davis, W.E. Harding, R.S. Schwartz, and J.J. Corning, ”Solid Logic Technology: Versatile High Performance Microelectronics”, IBM J. Res. Develop., 8(1964), pp.102. [7] 張琬君碩士論文，國立中央大學化材所，2004 [8] 白蓉生，”無鉛焊接的到來與因應”，電路板會刊22期，pp.5-27 (2003) [9] M.S. Lee, C.M. Liu and C.R. Kao, “ Interfacial Reactions between Ni Substrate and the Component Bi in Solders”, J. Electron. Mater., 28, p.57-62, 1999 [10] J.M. Song, H.Y. Chuang and T.X. Wen, “Thermal and Tensile Properties of Bi-Ag Alloys”, Metall. Mater. Trans. A, 36, p.1371-1375, 2007 [11] J.M. Song, H.Y. Chuang and Z.M. Wu, ”Substrate Dissolution and Shear Properties of the Joints between Bi-Ag Alloys and Cu Substrates for High-Temperature Soldering Applications”, J. Electron. Mater., 36, p.1516-1523, 2007 [12] J.N. Lalena, N.F. Dean and M.W. Weiser, ”Experimental Investigation of Ge-Doped Bi-11Ag as a New Pb-Free Solder Alloy for Power Die Attachment”, J. Electron. Mater., 31, p.1244-1249, 2002 [13] M. Rettenmayr, P. Lambracht, B. Kempf, M. Graff, “High Melting Pb-Free Solder Alloys for Die-Attach Applications”, Adv. Eng. Mater., 7, p.965-969, 2005 [14] J.M. Song, H.Y. Chuang and Z.M. Wu, ”Interfacial Reactions between Bi-Ag High-Temperature Solders and Metallic Substrates”, J. Electron. Mater., 35, p.1041-1049, 2006 [15] Y. Takaku, I. Ohnuma, R. Kainuma, Y. Yamada, Y. Yagi, Y. Nishibe and K. Ishida, “Development of Bi-Based High-Temperature Pb-Free Solders with Second-Phase Dispersion: Thermodynamic Calculation, Microstructure, and Interfacial Reaction”, J. Electron. Mater., 35, p.1926-1932, 2006 [16] Y. Yamada, Y. Takaku, Y. Yagi, Y. Nishibe, I. Ohnuma, K. Ishida, ”Novel Bi-based High-temperature Solder for Mounting Power Semiconductor Devices”, R&D Review of Toyota CRDL, 41, p.43-48, 2006 [17] Y. Yamada, Y. Takaku, Y. Yagi, Y. Nishibe, I. Ohnuma, Y. Sutou, R. Kainuma and K. Ishida, “Pb-free High Temperature Solders for Power Device Packaging”, Microelectr. Reliab., 46, p.1932-1937 ,2006 [18] J.Y. Tsai, C.W. Chang, Y.C. Shieh, Y .C. Hu and C.R. Kao, “Controlling the Microstructure from the Gold-Tin Reaction”, J. Electron. Mater., 34, p 182-187, 2005 [19] S. Anhock, H. Oppenrmanm, C.Kallmayer, R. Aschenbrenner, L Thomas and H. Reichl, ”Investigations of Au/Sn alloys on different end-metallizations for high temperature applications”, IEEE/CPMT Berlin int’l Electronics Manufacturing Technology Symposium p.156-165, 1998 [20] R. R. Chromik, D-N. Wang, L. Limata, M.R. Notis and R.P. Vinci, ”Mechanical properties of intermetallic compounds in the Au-Sn system”, J. Mater. Res., 20, p.2161-2172, 2005 [21] J.W. Yoon, H.S. Chun, H.J. Lee and S.B. Jung, ”Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging”, J. Mater. Res., 22, p.2817-2824, 2007 [22] J.Y. Tsai, C.W. Chang, C.E. Ho, Y.L. Lin and C.R. Kao, ”Microstructure Evolution of Gold-Tin Eutectic Solder on Cu and Ni Substrates”, J. Electron. Mater., 35, p.65-71, 2006 [23] J.W. Yoon, H.S. Chun and S.B. Jung, “Reliability analysis of Au-Sn flip-chip solder bump fabricated by co-electroplating”, J. Mater. Res., 22, p.1219-1229, 2007 [24] J.H. Kim, S.W. Jeong and H.M. Lee, “Thermodynamics-Aided Alloy Design and Evaluation of Pb-free Solders for High-Temperature Applications”, Mater. Trans., JIM, 43, p.1873-1878, 2002 [25] S.W. Chen, P.Y. Chen and C.H. Wang, “Lowering of Sn-Sb Alloy Melting Points Caused by Substrate Dissolution”, J. Electron. Mater., 35, p.1982-1985, 2006 [26] J.W. Jang, P.G. Kim and K.N. Tu, “High-temperature lead-free SnSb solders: Wetting reactions on Cu foils and phased-in Cu-Cr thin films”, J. Mater. Res., 14, p.3895-3900, 1999 [27] S.W. Chen, A.R. Zi, P.Y. Chen, H.J. Wu, Y.K. Chen and C.H. Wang, “Interfacial reactions in the Sn-Sb/Ag and Sn-Sb/Cu couples”, Mater. Chem. Phys., 111, p.17-19, 2008 [28] Y. Takaku, L. Felicia, I. Ohnuma, R. Kainuma and K. Ishida, ”Interfacial Reaction Between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders”, J. Electron. Mater., 37, p.314-323, 2008 [29] Y. Takaku, K. Makino, K. Watanabe, I. Ohnuma, R. Kainuma, Y. Yamada, Y. Yagi, I. Nakagawa, T. Atsumi and K. Ishida, “Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate”, J. Electron. Mater., 38, p.54-60, 2009 [30] M. Rettenmayr, P. Lambracht, B. Kempf and C. Tschudin, “Zn-Al Based Alloys as Pb-Free Solders for Die Attach”, J. Electron. Mater., 31, p.278-285, 2002 [31] T. Shimizu, H. Ishikawa, I. Ohnuma and K. Ishida, “Zn-Al-Mg-Ga Alloys as Pb-Free Solder for Die-Attaching Use”, J. Electron. Mater., 28, p.1172-1175, 1999 [32] S.J. Kim, K.S. Kim, S.S. Kim and K. Suganuma, “Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders”, J. Electron. Mater., 38, p.266-272, 2009 [33] J.N. Lalena, M.W. Weiser and N.F. Dean (Paper presented at the 131st TMS Annual Meeting, Seattle, WA, 19 February 2002) [34] 莊鑫毅碩士論文，國立東華大學材料所，2007 [35] J.E. Lee, K.S. Kim, K. Suganuma, J. Takenaka and K. Haigio, “Interfacial Properties of Zn-Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate”, Mater. Trans., JIM, 46, p.2413-2418, 2005 [36] T. B. Massalski “Binary Alloy Phase Diagrams”, Metals Park, Ohio : American Society for Metals, 1986 [37] S.K. Kang, M.G. Cho, P. Lauro and D.Y. Shih, “Critical Factors Affecting the Undercooling of Pb-free, Flip-Chip Solder Bumps and In-situ Observation of Solidification Process”, Electronic Components and Technology Conference, p.1597-1603, 2007 [38] P. Villars, A Prince and H.Okamoto, ”Handbook of Ternary Alloy Phase Diagrams”, ASM International, p.6142, 1995 [39] C.W. Huang, K.L. Lin, ”Interfacial reactions of lead-free Sn-Zn based solders on Cu and Cu plated electroless Ni-P/Au layer under aging at 150oC” , J. Mater. Res., 19, p.3560-3568, 2004 | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/43338 | - |
| dc.description.abstract | 歐盟於2006年7月1日開始實行了危害物質限用指令(ROHS, Restriction of Hazardous Substance)，此一法令限制了包含”鉛”等六種有害物質添加在電子產品之中，其中對於微電子封裝產業影響最大的就是含鉛銲料的禁止使用，目前各大工業聯盟以及廠商皆已使用無鉛銲料取代錫鉛銲料。而使用在儲存陣列、伺服系統、晶片接合、LED封裝以及覆晶封裝等屬於特殊用途的高溫高鉛銲料則因為其高可靠性，而可以使用到2010年。隨著時間逐步接近，關於此高溫銲料的無鉛候選材料仍然是將來需要解決的議題。
本研究依據二元相圖的固液相線區間選擇了四種可能的二元合金進行研究，分別是Bi-2.8Se、Bi-2.8Mn、Bi-1.8Mg以及Mg-51.3Zn四種二元合金，並將此四種合金銲料以DSC分析、維克氏硬度量測以及潤濕測試，並將銲料與Cu片做液態及固態反應。研究成果顯示此四種銲料的固液相線溫度區間在260oC~420oC之間，Mg-51.3Zn的硬度是Au-20Sn的0.7倍，Bi-2.8Se、Bi-2.8Mn及Bi-1.8Mg的硬度皆比Sn-10Sb銲料還低。Bi-2.8Mn潤濕性優於Bi-2.8Se，但兩者與Pb-10Sn以及Sn-3Ag-0.5Cu相比仍然有一些差距。 而在界面反應的情形，Bi-2.8Se與Cu基板反應並不會在界面上形成介金屬，只會在銲料生成塊狀的Cu2Se介金屬。時效時間達到2000小時後，Bi-2.8Se/Cu界面產生氧化情形。Bi-2.8Mn與Cu基板反應在界面上升成兩層介金屬，分別是Bi4Cu4Mn3以及BiMn溶Cu，當試片於200oC時效時，界面上轉變為Bi4Cu4Mn3單一層介金屬，而時效後的界面介金屬並不會因為時效時間拉長而有明顯的增厚。Bi-1.8Mg與Cu反應在銲料中發現了針狀Bi-Cu相，此相沒有在相圖中觀察到，需要藉由TEM獲知更多的訊息。 | zh_TW |
| dc.description.abstract | After 1 July 2006, the RoHS banned the use of Lead (Pb) and several other materials contained in electronic products. However, RoHS guidelines exempt the use of Pb internal to (at the first-level interconnect) flip-chip packages until 2010. A suitable Pb-free alternative to replace high Pb solder( e.g., 95Pb-5Sn, with a melting range from 308oC to 312oC) has not been found and the pressure to move to lead free will continue for the entire industry. In this study, three Bi-based solders, Bi-2.8Se, Bi-2.8Mn and Bi-1.8Mg, were used to observed the melting range, hardness and wetting behavior. Moreover, the interfacial reaction between Bi-based solders and Cu were also observed. Our result shows that the hardness of these three Bi-based solders are lower than Sn-10Sb. And the wetting behavior are worse than Pb-10Sn and Sn-3Ag-0.5Cu. There are no intermetallic compounds formation at Bi-1.8Mg/Cu and Bi-2.8Se/Cu interface. In addition, Se would encourage the consumption of Cu. Finally, two intermetallics, Bi4Cu4Mn3 and BiMn(Cu), formed between Bi-2.8Mn and Cu after reaction. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-15T01:50:30Z (GMT). No. of bitstreams: 1 ntu-98-R96527044-1.pdf: 10933897 bytes, checksum: af2ccbd5431f0873c54d4009f612d4a9 (MD5) Previous issue date: 2009 | en |
| dc.description.tableofcontents | 目錄
頁數 摘要................................................................Ⅰ 目錄................................................................Ⅲ 圖目錄..............................................................Ⅵ 表目錄..............................................................XI 第一章 緒論 1.1 研究背景......................................................1 1.1.1 電子構裝技術............................................2 1.1.2 覆晶封裝技術............................................5 1.1.3 無鉛銲料之發展..........................................7 1.2 研究目的......................................................8 第二章 文獻回顧 2.1 高溫無鉛銲料之發展............................................9 2.2 Bi-Ag系統銲料之回顧..........................................11 2.3 Au-Sn系統銲料之回顧..........................................16 2.4 Sn-Sb系統銲料之回顧..........................................26 2.5 BiCu-X系統銲料之回顧.........................................30 2.6 Bi+CuAlMn系統銲料之回顧.....................................31 2.7 Zn-Al-X系統銲料之回顧........................................33 2.8 Zn-Sn系統銲料之回顧..........................................37 第三章 實驗方法與步驟 3.1 固態Cu與液態合金銲料反應....................................41 3.1.1 合金銲料製備...........................................41 3.1.2 Cu與液態合金銲料之界面反應.............................42 3.2 固態Cu與固態合金銲料之界面反應..............................44 3.3 各種成分之銲料的材料性質實驗及分析...........................45 3.3.1 維克氏微硬度機分析.....................................45 3.3.2 示差掃描量熱儀(DSC)分析................................45 3.3.3 潤濕測試...............................................46 3.4 試片處理、觀察及分析.........................................47 3.4.1 試片金相處理...........................................47 3.4.2 金相觀察...............................................47 3.4.3 試片分析...............................................49 第四章 各成分銲料之材料性質實驗結果與討論 4.1 各種成分銲料之維克氏微硬度計分析結果與討論...................52 4.2 各種成分銲料之DSC分析實驗結果與討論........................54 4.3 各種成分銲料之潤濕性測試實驗結果與討論.......................64 第五章 各成分銲料界面反應之實驗結果與討論 5.1 Cu與Bi-2.8Se之界面反應.......................................66 5.1.1 Cu與液態Bi-2.8Se銲料之界面反應..........................66 5.1.2 Bi-2.8Se/Cu反應之介金屬生成物之XRD圖譜...............68 5.1.3 Cu與固態Bi-2.8Se銲料之界面反應..........................69 5.2 Cu與Bi-2.8Mn之界面反應......................................75 5.2.1 Cu與液態Bi-2.8Se銲料之界面反應..........................75 5.2.2 Bi-2.8Mn/Cu反應之介金屬生成物之XRD圖譜..............77 5.2.3 Cu與固態Bi-2.8Se銲料之界面反應..........................79 5.3 Cu與Bi-1.8Mg之界面反應......................................84 5.3.1 Cu與液態Bi-1.8Mg銲料之界面反應.........................84 5.3.2 Cu與固態Bi-1.8Mg銲料之界面反應.........................87 第六章 結論........................................................90 參考文獻............................................................91 | |
| dc.language.iso | zh-TW | |
| dc.subject | 界面反應 | zh_TW |
| dc.subject | 高溫無鉛銲料 | zh_TW |
| dc.subject | 潤濕測試 | zh_TW |
| dc.subject | 熱分析儀 | zh_TW |
| dc.subject | 硬度 | zh_TW |
| dc.subject | DSC | en |
| dc.subject | interfacial reaction | en |
| dc.subject | high temperature Pb-free solders | en |
| dc.subject | hardness. | en |
| dc.subject | wetting test | en |
| dc.title | 新型高溫無鉛銲料的材料性質與界面反應之研究 | zh_TW |
| dc.title | Material Properties and Interfacial Reactions of New High Temperature Lead-Free Solders | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 97-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 劉正毓(Cheng-Yi Liu),吳子嘉(Albert T. Wu) | |
| dc.subject.keyword | 高溫無鉛銲料,界面反應,熱分析儀,潤濕測試,硬度, | zh_TW |
| dc.subject.keyword | high temperature Pb-free solders,interfacial reaction,DSC,wetting test,hardness., | en |
| dc.relation.page | 94 | |
| dc.rights.note | 有償授權 | |
| dc.date.accepted | 2009-07-03 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 材料科學與工程學研究所 | zh_TW |
| 顯示於系所單位： | 材料科學與工程學系 | |
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