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http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/42116Full metadata record
| ???org.dspace.app.webui.jsptag.ItemTag.dcfield??? | Value | Language |
|---|---|---|
| dc.contributor.advisor | 盧信嘉(Hsin-Chia Lu) | |
| dc.contributor.author | Chih-Wen Hsiao | en |
| dc.contributor.author | 蕭植文 | zh_TW |
| dc.date.accessioned | 2021-06-15T00:47:37Z | - |
| dc.date.available | 2009-08-22 | |
| dc.date.copyright | 2008-09-02 | |
| dc.date.issued | 2008 | |
| dc.date.submitted | 2008-08-22 | |
| dc.identifier.citation | [1] J. Kim, B. Jung, P. Cheung, and R. Harjani, “Novel CMOS low loss transmission line structure,” IEEE Radio and Wireless Conf., pp. 235-238, Sept. 2004.
[2] Jun-De Jin, Shawn S. H. Hsu1, Ming-Ta Yang, and Sally Liu, “Low-loss single and differential semi-coaxial interconnects in standard CMOS process,” 2006 IEEE Internet Symp. Dig., pp. 420-423, June 2006. [3] Tsung-Yi Chou, “4-Gbps on-chip interconnect circuit in TSMC 0.18 μm technology,” M.S. Thesis, National Taiwan University, Taipei, Taiwan, Jan. 2007. [4] Ying-Hsiung Hsieh, “The study of transmission line properties on BCB Process,” M.S. Thesis, National Taiwan University, Taipei, Taiwan, Jan. 2008. [5] Yukihisa Yoshida, Tamotsu Nishino, Jiwei Jiao, Sang-Seok Lee, Yoshiyuki Suehiro, Ken’ichi Miyapchi, Tatsuya Fukami, Masafumi Kimata and Osami Ishida, “A Novel Grounded Coplanar Waveguide With Cavity Structure,” 2003 IEEE The Sixteenth Annual International Conference on Micro Electro Mechanical Systems, pp. 140- 143, Jan. 2003. [6] Van Tuyen Vo, Lokesh Krishnamurthy, I Qing Sun, and Ali A. Rezazadeh, ”3-D low-loss coplanar waveguide transmission lines in multilayer MMICs,” IEEE Trans. Microwave Theory Tech., vol. 54, no. 6, pp. 2864- 2871, June 2006. [7] Luuk F. Tiemeijer, Ralf M. T. Pijper, Ramon J. Havens, and Olivier Hubert, ”Low-loss patterned ground shield interconnect transmission lines in advanced IC processes,” IEEE Trans. Microwave Theory Tech., vol. 55, no.3, pp. 561-570, March 2007. [8] David M. Pozar, Microwave Engineering, John Wiley & Sons, Inc., 2005. [9] SI9000, http://www.polarinstruments.com/ [10] V. Milanovic, M. Ozgur, D. C. DeGroot, J. A. Jargon, M. Gaitan, and M. E. Zaghloul, “Characterization of broadband transmission for coplanar waveguides on CMOS silicon substrates,” IEEE Trans. Microw. Theory Tech., vol. 46, no. 5, pp. 632–640, May 1998. [11] R. Lowther and S.-G. Lee, “On-chip interconnect lines with patterned ground shields,” IEEE Microw. Guided Wave Lett., vol. 10, no. 2, pp.49–51, Feb. 2000. [12] T. S. D. Cheung and J. R. Long, “Shielded passive devices for siliconbased monolithic microwave and millimeter-wave integrated circuits,” IEEE J. Solid-State Circuits, vol. 41, no. 5, pp. 1183–1200, May 2006. [13] R. D. Lutz, V. K. Tripathi, and A. Weisshaar, “Enhanced transmission characteristics of on-chip interconnects with orthogonal gridded shield,” IEEE Trans. Adv. Packag., vol. 24, no. 3, pp. 288–293, Aug. 2001. [14] P.Wang and E. C.-C. Kan, “High-speed interconnects with underlayer orthogonal metal grids,” IEEE Trans. Adv. Packag., vol. 27, no. 3, pp. 497–507, Aug. 2004. | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/42116 | - |
| dc.description.abstract | 本論文根據圖型式接地屏蔽的互聯傳輸線的優點，我們提出一個新的延伸性傳輸線架構-挖槽的半同軸纜線，並使用環苯丁烷和硫亞氨單體聚合物作為電介質材料。並同時與不同開槽寬度的半同軸纜線以及不同的複雜幾何圖形式接地屏蔽的挖槽半同軸纜線作比較，探討其單端時的損耗優劣及其他特性。模擬及量測結果的顯示，在維持與旁邊的地面等距以及維持相同阻抗的情況下，單端與差動對的開槽線均具有較低的損耗。 | zh_TW |
| dc.description.abstract | Based on low loss patterned ground shield interconnect transmission lines, we proposes a new structure of transmission line- slotted semi-coaxial line by using BCB and PI as the dielectric materials. We compared the attenuation constant and other properties of slotted semi-coaxial line and some different types of patterned ground shield slotted semi-coaxial line in single-ended with different slot widths. The proposed slotted semi-coaxial lines show lower attenuation constant by simulation under same spacing to side ground and same characteristic impedance. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-15T00:47:37Z (GMT). No. of bitstreams: 1 ntu-97-R95943095-1.pdf: 2282925 bytes, checksum: 4ed0468fda3e8ba0c5cf8e611aed6ce2 (MD5) Previous issue date: 2008 | en |
| dc.description.tableofcontents | Chapter 1 Introduction 1
1.1 Motivation 1 1.2 Integrated Passive Device (IPD) 1 1.3 Summary 5 Chapter 2 Literature survey on low loss transmission lines 7 2.1 Semi-circular line series 7 2.1.1 Semi-circular GCPW and V-shaped GCPW [1] 7 2.1.2 Semi-coaxial lines [2] 9 2.1.3 Slotted differential semi-coaxial line on CMOS processing [3] 11 2.1.4 Slotted semi-coaxial lines on BCB processing [4] 13 2.2 A grounded coplanar waveguide with air cavity on a silicon substrate [5] 15 2.3 3-D coplanar waveguide transmission line [6] 17 2.4 Patterned ground shield interconnect transmission lines [7] 19 2.5 Comparison on previous low loss transmission lines 21 Chapter 3 Foundation of Transmission Line 25 3.1 RLGC Model of Transmission Line [8] 25 3.2 Converting scattering matrix to RLGC parameters [8] 28 Chapter 4 Simulation Results of Transmission Line 33 4.1 Simulation results of single-ended transmission lines 33 4.1.1 Comparison of BCB and PI dielectric materials 33 4.1.2 Structure of single-ended transmission line on BCB 35 4.1.3 Simulation results of single-ended lines on BCB 37 4.1.4 Simulation results of single-ended lines on PI 43 4.1.5 Performance of Comparison 47 4.2 Effect of slot width 48 4.2.1 Dimension of the slot lines on BCB substrate 48 4.2.2 Simulation results of the slotted lines on BCB 49 4.2.3 Simulation results of the slot lines on PI 54 4.2.4 Performance of Comparison 58 4.3 Simulation results of the patterned ground lines 59 4.3.1 Dimension of the patterned ground lines 59 4.3.2 Simulation results of the patterned ground lines on BCB 61 4.3.3 Simulation results of the patterned ground lines on PI 66 4.3.4 Performance of Comparison 71 4.4 Effect of metal ground thickness for BCB and PI 71 4.5 Summery 76 4.6 Suggested design flow for type A transmission line 77 Chapter 5 Conclusion 79 Reference 81 | |
| dc.language.iso | en | |
| dc.subject | 圖型式接地屏蔽 | zh_TW |
| dc.subject | 廣域連結 | zh_TW |
| dc.subject | 內部連接傳輸線 | zh_TW |
| dc.subject | 積體被動元件 | zh_TW |
| dc.subject | Global interconnect | en |
| dc.subject | interconnect transmission lines | en |
| dc.subject | integrated passive device | en |
| dc.subject | patterned ground shielding | en |
| dc.title | IPD製程上之低損耗開槽傳輸線 | zh_TW |
| dc.title | Low-loss slotted transmission line on IPD process | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 96-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 盧奕璋,林坤佑,陳怡然 | |
| dc.subject.keyword | 廣域連結,內部連接傳輸線,積體被動元件,圖型式接地屏蔽, | zh_TW |
| dc.subject.keyword | Global interconnect,interconnect transmission lines,integrated passive device,patterned ground shielding, | en |
| dc.relation.page | 82 | |
| dc.rights.note | 有償授權 | |
| dc.date.accepted | 2008-08-25 | |
| dc.contributor.author-college | 電機資訊學院 | zh_TW |
| dc.contributor.author-dept | 電子工程學研究所 | zh_TW |
| Appears in Collections: | 電子工程學研究所 | |
Files in This Item:
| File | Size | Format | |
|---|---|---|---|
| ntu-97-1.pdf Restricted Access | 2.23 MB | Adobe PDF |
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