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標題: | 薄膜熱電致冷元件之熱傳及熱應力分析 The Analysis of the Heat Transfer and Thermal Stresses in Thermoelectric Cooler |
作者: | Po-Kuei Chou 周柏圭 |
指導教授: | 黃美嬌(Mei-Jiau Huang) |
關鍵字: | 湯姆生效應,熱電致冷元件,熱應力, Thermoelectric cooler,thermal stress,Thomson effect, |
出版年 : | 2004 |
學位: | 碩士 |
摘要: | 熱應力攸關薄膜熱電致冷元件的製作成敗。本文內容主要在建立一個簡易一維薄膜熱電元件通用之分析模型,並且和二維ANSYS薄膜熱電元件的熱應力分析比較。從分析中得知,一維分析在分布趨勢上可以和二維分析相似,但因為少考慮了z方向位移,故在應力值會小許多,且無法察覺出接腳處的應力。
此外,一般在熱電之相關書籍或論文中常會忽略湯姆生效應,而本文將其納入討論之中,目的在於能更廣泛的分析熱電元件的溫度及應力分布。由理論分析結果中發現湯姆生係數之值愈大,對於致冷能力之效果提升愈顯著,但是熱電元件所承受的正向應力也越大,層與層之間的剪應力也越大。此部份之結果可作為熱電材料發展之參考方向。而一維分析僅能提供一個初步的估算;若接腳問題能另有可靠製程解決,則一維分析也不失為一個快速提供有效數據的方法。 The thermal stress is a critical issue to the success of a thin-film thermoelectric cooler. The main purpose of this thesis is to establish a simple 1-D model for a thermal stress analysis of a thin-film thermoelectric element. Numerical computations in use of the software ANSYS are also performed for a comparison. This study shows that 1-D results share similar trends to those observed from computations, but the stress magnitudes are smaller. The reason is because in 1-D analysis, the potential effect on the stresses of the Z-direction displacement is ignored. Moreover, junction stresses can not be correctly captured in the 1-D model. Furthermore, Thomson effect is also taken into consideration while it is usually ignored in the literatures. Taking advantage of this effect, a better cooling ability can be attained, although also resulted are bigger thermal stresses. This 1-D model can thus offer a primary estimation for the design of novel thermoelectric cooler without deep consideration of junction stress. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/39388 |
全文授權: | 有償授權 |
顯示於系所單位: | 機械工程學系 |
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