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  1. NTU Theses and Dissertations Repository
  2. 工學院
  3. 應用力學研究所
請用此 Handle URI 來引用此文件: http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/39307
完整後設資料紀錄
DC 欄位值語言
dc.contributor.advisor楊照彥
dc.contributor.authorChia-Li Huen
dc.contributor.author胡家莉zh_TW
dc.date.accessioned2021-06-13T17:25:45Z-
dc.date.available2011-07-25
dc.date.copyright2011-07-25
dc.date.issued2011
dc.date.submitted2011-07-13
dc.identifier.citation[1] Bird, G. A., (1994) Molecular Gas Dynamics and the Direct Simulation of Gas Flows, Clarendon Press Oxford.
[2] Capinski, W. S., and Maris, H. J., (1996) “Thermal conductivity of GaAs/AlAs superlattices,” Physica B, 219, pp. 699-701.
[3] Chen, G., (1997) “Size and Interface Effects on Thermal Conductivity of Superlattices and Periodic Thin-Film Structures, ASME Journal of Heat Transfer,” 119, pp. 220-229.
[4] Chen, G., (1998) “Thermal Conductivity and Ballistic-Phonon Transport in the Cross-Plane Direction of Superlattices”, Physical Review B, 57, pp. 14958-14973.
[5] Chen, G., (2001) “Ballistic-Diffusive Heat-Conduction Equation,” Physical Review Letters, 86, pp. 2297-2300.
[6] Chen, G., Tien, C. L., Wu, X., and Smith, J. S., (1994) “Thermal Diffusivity Measurement of GaAs/AlGaAs Thin-Film Structures,” ASME Journal of Heat Transfer, 116, pp. 325-331.
[7] Chen, G., and Neagu, M., (2001) “Thermal Conductivity and Heat Transfer in Superlattices,” Applied Physics Letters, 71, pp. 2761-2763.
[8] Chen, H., Chen, S., and Matthaeus, W. H., (1992) “Recovery of the Navier-Stokes Equation Using a Lattice Boltzmann Method,” Physical Review A, 45, pp. 5339-5342.
[9] Chen, S., Martinez, D., and Mei, R., (1996) “On Boundary Conditions in Lattice Boltzmann Methods,” Physics of Fluids, 8, 2527.
[10] Damian Terris, Karl Joulain, Denis Lemonnier,(2009) “Modeling semiconductor nanostructures thermal properties: The dispersion role,” Physics, 105, 073516.
[11] Escobar, R. A., Ghai, S. S., Jhon M. S., and Amon C. H., (2006) “Multi-length and Time Scale Thermal Transport Using the Lattice Boltzmann Method with Application to Electronics Cooling.” International Journal of Heat and Mass Transfer, 49, pp. 97–107.
[12] Escobar, R., Smith B., and Amon C., (2006) “Lattice Boltzmann Modeling of Subcontinuum Energy Transport in Crystalline and Amorphous Microelectronic Devices,” ASME Journal of Electronic Packaging, 128, pp. 115-124.
[13] Flik, M. I., (1990) “Size Effect on Thermal Conductivity of High-Tc Thin-Film Superconductors,” ASME Journal of Heat Transfer, 112, pp. 872-880.
[14] Higuera, F., and Jimenez, J., (1989) “Boltzmann Approach to Lattice Gas Simulation,” Europhysics Letters, 9, pp. 663-668.
[15] Hsieh, T. Y., Yang, J. Y., and Hong, Z. C., (2009) “Thermal Conductivity Modeling of Compacted Type Nanocomposites,” Journal of Applied Physics ,106, pp. 023528.
[16] Hyldgaard, P., and Mahan, G. D., (1997) “Phonon superlattice transport,” Physical Review B, 56, pp. 10754-10757.
[17] Klitsner, J. E., Vancleve, J. E., Fischer, H. E. & Phol, R. Q., (1988) “Phonon Radiative Heat Transfer and Surface Scattering,” Physical Review B, 38, pp. 7576-7594.
[18] Majumdar, A., (1993) “Microscale Heat Conduction in Dielectric Thin Film,” ASME Journal of Heat Transfer, 115, pp. 7-16.
[19] McNamara, G., and Zanetti, G., (1988) “Use of the Boltzmann Equation to Simulate Lattice-Gas Automata,” Physical Review, 61, pp.2332-2335.
[20] Niu, X. D., Shu. C., and Chew Y.T., (2006) “A thermal lattice Boltzmann model with diffuse scattering boundary condition for micro thermal flows,” Computers & Fluids, 36, pp.273–281.
[21] Qian, T. H., D’Humieres, D., and Lallemand, P., (1992) “Lattice BGK Models for Navier-Stokes Equation,” Europhysics Letters 17, pp. 479-484.
[22] Shan, X., Yuan, X.-F., and Chen, H., (2006) “Kinetic Theory Representation of Hydrodynamics: A Way Beyond the Navier-Stokes Equation,” Journal of Fluid Mechanics, 550, pp. 413-441.
[23] Srinivasan, S., Miller, R. S., and Marotta, E., (2004) “Parallel Computation of the Boltzamnn Transport Equation for Microscale Heat Transfer in Multilayered Thin Films,” Numerical Heat Transfer, Part B, 46, pp. 31-58.
[24] Swartz, E. T., and Pohl, R. O., (1989) “Thermal Boundary Resistance.” Reviews of Modern Physics, 61, pp. 605-668.
[25] Yang, J. Y., and Hung L. H., (2009) “Lattice Uehling-Uhlenbeck Boltzmann-Bhatnagar-Gross-Krook Hydrodynamics of Quantum Gases.” Physical Review E, 79, pp. 056708.
[26] R. Venkatasubramanian, E. Siivola, T. Colpitts, B. O'Quinn, (2001) “Thin-film thermoelectric devices with high room-temperature figures of merit.” Nature, 413, 597-602.
[27] T. C. Harman, P. J. Taylor, M. P. Walsh, and B. E.Laforge, (2002) “Quantum dot superlattice thermoelectric materials.” Science, 297, 2229-2232.
[28] Yang, R., and Chen, G., (2004) “Thermal Conductivity Modeling of Periodic Two-Dimensional Nanocomposites,” Physical Review B, 69, pp. 195316.
[29] 王鎮雄、朱朝煌、李世榮、劉傳仁、蔡豐欽 (2006) 熱傳遞學,高立圖書。
[30] 何雅玲、王勇、李慶 (2009) 格子Boltzmann方法的原理及應用(Lattice Boltzmann Method: Theory and Applications),科學出版社。
[31] 沈青 (2003) 稀薄氣體動力學(Rarefied Gas Dynamics),國防工業出版社。
[32] 郭照立、鄭楚光 (2009) 格子Boltzmann方法的原理及應用(Theory and Applications of Lattice Boltzmann Method),科學出版社。
[33] 謝澤揚 (2007) 聲子熱傳輸與理想量子氣體動力學之高解析算則,國立台灣大學工學院應用力學所博士論文,台北。
[34] 陳俊道 (2010) 利用晶格波茲曼法之奈米尺度聲子熱傳模擬,國立台灣大學工學院應用力學所碩士論文,台北。
dc.identifier.urihttp://tdr.lib.ntu.edu.tw/jspui/handle/123456789/39307-
dc.description.abstract隨著科技日新月異的進步,近年來製程技術的迅速發展,半導體產業、光電產業及微機電系統的需求,使微型化成為趨勢,當流體之特徵長度與分子之平均自由徑 (Mean free path) 逐漸接近,尺寸效應已不能再忽略,用於研究巨觀熱傳現象之主導方程式 Fourier Law 將不適用。其中原因為在巨觀下,分子可視為連續體,然而在微尺度下描述聲子分布狀態之主導方程為Boltzmann 傳輸方程(Boltzmann transport equation, BTE)。
在本文的研究中,應用三維聲子晶格Boltzmann-BGK模擬微尺度熱傳問題,藉由Hermite多項式的展開,得到Bose-Einstein統計平衡態的分布函數,並採用3D模型來分析,利用週期性邊界條件取出週期性單元作為模擬區域。現今聲子晶格Boltzmann法已證實可應用在二維的微尺度熱傳問題。而在三維情況進行分析,藉由建模以模擬的方式,隨著Knudsen數的改變,流場將呈現不同的特性,經由碰撞和遷移過程,得到新的分布函數,計算溫度分布。由研究結果可發現,導體材料不僅有尺寸效應,於微尺度下材料界面產生的界面散射將使熱傳導係數下降及溫度分布產生滑移。
zh_TW
dc.description.abstractThe feature size of electronic devices in current integrated circuits has become comparable to or even smaller than the mean free path (MFP) of the energy carrier. It has been well known that the continuum-based Fourier heat conduction law may lead to erroneous results when the phonon mean free path becomes comparable or larger than the characteristic size of the material studied. The prevailing approach to calculate the thermal conductivity of semiconductors and dielectric materials is based on phonon Boltzmann transport equation as the energy carriers at temperatures of interest are phonons.
In this thesis, an efficient three-dimensional lattice Boltzmann method based on the phonon Boltzmann-BGK transport equation is developed for solving energy transfer in the subcontinuum regime. The lattice Boltzmann method is derived by expanding the phonon Bose-Einstein distribution in the tensor Hermite polynomials space and standard D3Q19 lattice model is employed. Depending on the order of expansion adopted, different level of approximation of the transport phenomenon can be modeled. The implementations of periodic boundary conditions and constant temperature wall conditions are described. The present phonon lattice Boltzmann method is validated against existing direct discrete ordinate method by modeling and simulation of thermal conductivities for two-dimensional problems. Modeling and simulations of the micro-/nano-scale phonon energy transfer covering broad range of Knudsen numbers range are presented. It is found that the present lattice Boltzmann method solutions are in good agreement with those from the discrete ordinate phonon Boltzmann solver. Results suggest that reducing feature size will decrease the thermal conductivity, and temperature will become non-continuum distributions in the interface. And the effective thermal conductivity changes not only with the length of the thin film, but also with the boundary thermal resistance.
en
dc.description.provenanceMade available in DSpace on 2021-06-13T17:25:45Z (GMT). No. of bitstreams: 1
ntu-100-R98543036-1.pdf: 20446008 bytes, checksum: e24225e05bae5ae22c60fb6998d75c91 (MD5)
Previous issue date: 2011
en
dc.description.tableofcontents摘要 I
Abstract II
誌謝 IV
目錄 V
圖目錄 VII
表目錄 IX
第一章、緒論 1
1.1 引言 1
1.2 微尺度熱傳導 1
1.3 熱電材料應用簡介 2
1.4 晶格Boltzmann法簡介 3
1.5 晶格Boltzmann法文獻回顧 4
1.6 微尺度熱傳文獻回顧 5
1.7 研究目的 7
1.8 本文架構 8
第二章、Boltzmann方程式及Hermite展開法 9
2.1 氣體運動理論(Gas Kinetic Theory) 9
2.2 Liouville方程 11
2.3 Boltzmann方程 13
2.4 鬆弛時間近似 15
2.5 連續體模型方程 16
2.6 平衡態分布函數的Hermite展開 18
第三章、聲子Boltzmann傳輸方程式 23
3.1 聲子 23
3.2 聲子間散射 24
3.3 聲子輻射熱傳方程式 26
第四章、半古典晶格Boltzmann法 30
4.1 三種統計 30
4.2 半古典晶格Boltzmann方程 31
第五章、聲子晶格Boltzmann法與邊界處理方法 37
5.1 分布函數 37
5.2 晶格Boltzmann法 38
5.3 邊界條件 43
5.3.1 黑體定溫邊界 43
5.3.2 週期邊界 44
5.3.3 定溫週期邊界 46
5.4 計算流程 47
第六章、模擬結果與討論 49
6.1 問題描述 49
6.2 模擬結果分析與討論 50
6.3 二維問題 51
6.4 三維矽材料 56
6.5 熱傳導係數 62
6.6 Dispersion Model 63
第七章、結論與展望 65
7.1 結論 65
7.2 展望 66
參考文獻 67
dc.language.isozh-TW
dc.subjectHermite多項式zh_TW
dc.subject聲子Boltzmann傳輸方程zh_TW
dc.subject微尺度熱傳zh_TW
dc.subject等效熱傳導係數zh_TW
dc.subject晶格Boltzmann法zh_TW
dc.subjectThermal Conductivityen
dc.subjectPhonon Boltzmann Transporten
dc.subjectHermite Tensor Polynomialsen
dc.subjectLattice Boltzmann Methoden
dc.subjectSubcontinuum Regime Heat Transferen
dc.title基於晶格波茲曼法之三維微尺度聲子能傳建模與計算zh_TW
dc.titleModeling and Simulation of 3D Subcontinuum Phonon Energy Transport Using Lattice Boltzmann Methoden
dc.typeThesis
dc.date.schoolyear99-2
dc.description.degree碩士
dc.contributor.oralexamcommittee黃俊誠,蔡一男,謝蒼仁,洪立昕
dc.subject.keyword聲子Boltzmann傳輸方程,微尺度熱傳,等效熱傳導係數,晶格Boltzmann法,Hermite多項式,zh_TW
dc.subject.keywordPhonon Boltzmann Transport,Subcontinuum Regime Heat Transfer,Thermal Conductivity,Lattice Boltzmann Method,Hermite Tensor Polynomials,en
dc.relation.page70
dc.rights.note有償授權
dc.date.accepted2011-07-14
dc.contributor.author-college工學院zh_TW
dc.contributor.author-dept應用力學研究所zh_TW
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