請用此 Handle URI 來引用此文件:
http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/37485
完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 吳錫侃 | |
dc.contributor.author | Tsai-Jung Ho | en |
dc.contributor.author | 何彩蓉 | zh_TW |
dc.date.accessioned | 2021-06-13T15:29:48Z | - |
dc.date.available | 2011-07-21 | |
dc.date.copyright | 2008-07-21 | |
dc.date.issued | 2008 | |
dc.date.submitted | 2008-07-15 | |
dc.identifier.citation | 1.李芝媛、吳錫侃,科儀新知第十六卷, No.6 (1995), p.6。
2.徐祖耀等著,”形狀記憶材料”,上海交通大學出版社,(2000) p.18-104 3.羅一中,國立台灣大學材料科學與工程學研究所博士論文,1992。 4.F. Dall, E. Perrin, P. Vermant, M. Masse and R. Portier, Acta Mater., 50 (2002) 3557. 5.S. F. Hsieh and S. K. Wu, J. Alloys & Compounds, 266 (1998) 276. 6.A. Nagasawa, K. Enami, Y. Ishino, Y. Abe and S. Nenno, Scripta Metall.,8 (1974) 1055. 7.T. Saburi and S. Nenno, Scripta Metall., 8 (1974) 1363. 8.T. A. Schroder and C. M. Wayman, Scripta Metall., 11 (1977) 225. 9.K. Enami A. Negasawa and S. Nenno, Scripta Metall., 9 (1975) 941. 10.L. Delaey and J. Thienel, in : Shape Memory Effects in Alloys,( J. Perkins, ed.), Plenum Press, New York, 1975, p.341. 11.M. Nishida and T. Honma, Scripta Metall.,18 (1984) 1293. 12.M. Nishida and T. Honma, Scripta Metall.,18 (1984) 1299. 13.M. Nishida and C. M. Wayman, Scripta Metall., 18(1984) 1389. 14.K. Otsuka and K. Shimizu, Int. Met. Rev, 31 (1986)93. 15.H. Kessler and W. Pitsch, Acta Met., 15 (1967) 401. 16.K. Otsuka and K. Shimizu, Metals Forum., 4 (1981) 142. 17.K. Otsuka and C. M. Wayman, in: Reviews on the Deformation Behavior of Materials, (P. Feltham ed.), Israel, 1977, p.81. 18.K. Otsuka, in: Proc. Int. Conf. On Solid to Solid Phase Transformaitons, TMS-AIME Pittsburgh, Pa. (USA), 1981, p.1267. 19.C. M. Jackson, H. J. Wagner, R. J. Wasilewski, Nasa-SP 5110, 1972. 20.K. Otsuka, S. Sawamura and K. Shimizu, Phys. Stat. Sol., 5 (1971) 457. 21.O. Matsumoto, S. Miyazaki, K. Otsuka and H. Tamura, Acta Mater., 35 (1987) 2137. 22.K. M. Knowls and K. A. Smith, Acta Mater., 29 (1981)101. 23.T. Onda, Y. Bando, T. Ohba and K. Otsuka, Mater. Trans., JIM, 33 (1992) 354. 24.M. Nishida, H. Ohgi, I. Itai, A. Chiba and K. Yamauchi, Acta mater., 43 (1995)1219. 25.D. P. Dautovich, G. R. Purdy, Can. Metall., 6 (1972) 115. 26.D. Bradly, J. Acoust, Soc. Am., 37 (1965) 700. 27.C. M. Wayman, I. Cornelis, Scripta Metall., 6 (1972) 115. 28.H. C. Ling, R. Kaplow, Met.Trans., 11 (1980) A77. 29.F. E. Wang, B. F. Desavage and W. I. Buehler, J. Appl. Phys., 39 (1968) 2166. 30.G. D. Sandrock, A. J. Perkin and R. F. Hechemann, Met. Trans., 2 (1971) 2769. 31.O. Mercier and K. N. Melten, Acta Met., 27 (1979) 1467. 32.E. Goo and R. Siniclair, Acta Met.,33 (1985)1717. 33.S. K. Wu and H. C. Lin, Scripta Met., 25 (1991) 1529. 34.C. M. Hwang, M. Meichle, M. B. Salamon and C. M. Wayman, Phys. Mag., A47 (1983) 31. 35.Abujudom DN, Thoma PE, Kao M-Y and Angst DR., US Patent 5, 144, 504. Johnson Service Company, Milwaukee (WI),1992. 36.X. L. Meng, Y. F. Zheng, Z. Wang, L. C. Zhao, Mater. Lett., 45 (2000) 128. 37.P. L. Potapov, A. V. Shelyakov, A. A. Gulyaev, E. L. Svistunova, N. M. Matveeva and D. Hodgson, Mater. Lett., 32 (1997) 247. 38.X. D. Han, W. H. Zou, R. Wang, Z. Zhang and D. Z. Yang, Acta Mater.,44, (1996)3711. 39.Bowles JS and Mackenzie JK., Acta Metall., 2 (1954) 129. 40.Y. Q. Wang, Y. F. Zheng, W. Cai and L. C. Zhao, Scripta Mat. 14 (1999) 1327. 41.F. Dalle, E. Perrin, P. Vermaut, M.Masse and R. Portier, Acta Mater. 50 (2002) 3557. 42.林振川,國立台灣大學材料科學與工程研究所碩士論文,1991。 43.S. Mayazaki, Y. Igo and K. Otsuka, Acta metal.,34 (1986) 2045. 44.K. N. Melton and O. Mercier, Met. Trans., 9A (1978) 1487. 45.O. Mercier and K. N. Melton, Met. Trans., 10A (1979) 387. 46.R. H. Bricknell, K. N. Melton and O. Mercier, Met. Trans., 10A (1979) 693 47.O. Mercier, E. Torok and B. Tirbonod, ICOMAT-79, p.702. 48.R. H. Bricknell and K. N. Melton, Met. Trans., 11A (1980) 1541. 49.T. Tadaki and C. M. Wayman, Metallography, 15 (1982) 233. 50.T. Tadaki and C. M. Wayman, Metallography, 15 (1982) 247. 51.T. Saburi, T. Komatsu, S. Nenno and Y. Watanabe, J. Less. Common Metals, 118 (1986) 217. 52.Y. Shugo and T. Honma, Bull. Res. Inst. Miner. Dress. Met. 43 (1987) 117 53.T. H. Nam, T. Saburi, Y. Kawamura and K. Shimizu, Mat. Trans. JIM, 31 (1990) 262. 54.T. H. Nam, T. Saburi and K. Shimizu, Mat. Trans. JIM, 31 (1990) 959. 55.T. H. Nam, T. Saburi, Y. Kawamura and K. Shimizu, Mat. Trans. JIM, 31 (1990) 1050. 56.T. H. Nam, T. Saburi and K. Shimizu, Mat. Trans. JIM, 33 (1991) 814. 57.B. S. Murty, S. Ranganathan and M. Mohan Rao, Mat. Sci. Eng. 149A (1992) 231. 58.Y. Furuya, M. Matsumoto, H. Kimura, K. Aoki and T. Masumoto, Mat. Trans. JIM 31 (1990) 504. 59.L. Chang and D. S. Grummon, Scripta Met. 25 (1991) 2079. 60.Y. Furuya, M. Matsumoto, H. Kimura and T. Masumoto, Mater. Sci. Eng. A, L7 (1991) 147. 61.T. H. Nam, J. H. Lee, J. M. Nam, K. W. Kim, G. B. Cho and Y. W. Kim, Mat. Sci. Eng.A 483-484 (2008) 460. 62.J. L. Lee, T. H. Nam, H. J Ahn and Y. W. Kim, Mat. Sci. Eng.A 438-440 (2006) 691. 63.T. H. Nam, J. H. Lee, K. W. Kim, H. J. Ahn and Y. W. Kim, J. of Mat. Sci. (2005) letters 64.T. H. Nam, J. P. Noh, D. W. Jung, Y. W. Kim, H. J. Im, J. S. Ahn and T. Mitani, J. Mat. Sci. Lett.21 (2002) 685. 65.Y. W. Kim and T. H. Nam, Scripta mater. 51(2004) 653. 66.H. C. Lin, S. K. Wu and J. C. Lin, Material Chem. Phys. , 37(1994) 184. 67.S. F. Hsieh and S. K. Wu, Journal of Alloys and Compounds, 403 (2005) 154. 68.H. D. Gu, L. You, K. M. Leung, C. Y. Chung, K. S. Chan and J. K. L. Lai, Applied Surface Science 127-129 (1998) 579. 69.X. D. Han, R. Wang, Z. Zhang and D. Z. Yang, Mater. Lett. 30 (1997) 23. 70.X. L. Meng, W. Cai, F. Chen and L. C. Zhao, Scripta Mater., 54 (2006) 1599. 71.V. T. Huett and K. F. Kelton, Philosophical Magazine Letters, 2002 Vol. 82, No.4, 191. 72.X. D. Han, W. H. Zou, R. Wang, Z. Zhang and D. Z. Yang, Acta Mater., Vol.44, No.9 (1996) 3711. 73.X. D. Liu, X. B. Liu and Z. Altounian, Acta Mater., 53 (2005) 1439. 74.K. M. Knowles and D. A. Smith, Acta Met., 29 (1981) 101. 75.X. D. Han, W. H. Zou, S. Jin, Zhang and D. Z. Yang, Scripta metal. Mater., 32 (1995) 1441. 76.Y. Kudoh, Tokonami M., S. Miyazaki, K. Otsuka, Acta Metall., 33 (1985) 2049. 77.S. Besseghini, E. Villa and A. Tuissi, Mater. Sci. Eng.A273-275 (1999) 390. 78.謝世峰,國立台灣大學材料科學與工程學研究所博士論文,1997。 79.林凱南,國立台灣大學材料科學與工程學研究所碩士論文,2005。 80.C. Satto, A. Ledda, P. Potapov, J. F. Janssens, D. Schryvers, Intermetallics 9 (2001) 395. 81.T. Goryczka and P. Ochin, Mater. Sci. Eng. A438-440 (2006) 714. | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/37485 | - |
dc.description.abstract | 在Ti50.5-XNi49.5HfX(X=5,10)合金之研究中,發現兩合金皆為B2←→B19’一階相變態,且Hf含量多者其相變態溫度越高,其中,TiNiHf10合金之形狀回復率可高達90%以上。兩合金之相變態溫度在熱循環次數20次內均快速下降,但高於20次後,即不再有太大的變化;少數的熱循環次數會使合金由一階相變態轉變為二階,但隨次數增加,又由二階轉為一階,此變態行為之改變與熱循環後合金內雙晶模式由TypeⅡ<011>M雙晶轉變為(001)M Compound雙晶有關。在冷加工後退火處理對兩合金之影響上,發現在低溫或短時間下,退火對合金之影響為消除殘留應力及缺陷,並造成變態溫度的快速上升;當高溫或長時間退火後,退火對合金之影響轉為回復、再結晶及成長,使變態溫度不再上升。而時效處理對兩合金相變態行為之影響則較小,顯示合金中第二相相當穩定,不因時效而改變。在研究退火處理對富鈦之Ti50Ni40Cu10薄帶之影響上,發現冷卻銅輪的轉速越快,其變態溫度及潛熱越低。薄帶之微結構在快速冷卻端是不具方向性之細小晶粒,但在空冷自由端則是具方向性之柱狀晶。退火處理可使薄帶之缺陷與殘留應力消除並提升變態溫度與潛熱;但短時間之退火會有不均勻的Ti2Ni析出,造成變態點降低與變態峰分離。而700℃以上退火者除Ti2Ni外,尚有TiNi2Cu相之析出。 | zh_TW |
dc.description.abstract | Thermal cycling effect on transformation behavior and microstructure of Ti40.5Ni49.5Hf10 shape memory alloy (SMAs) is investigated. Experimental results show that Ti40.5Ni49.5Hf10 SMA exhibits one-stage transformation of B2 ↔B19’ to two–stage one of B2←→B19’1 and B2←→B19’2 within 10 thermal cycles. Transformation temperature rapidly decreases during the early 20 cycles and then keeps almost constant for the further cycles. The evolution of transformation behavior and the decrease of transformation temperature can be ascribed to the dislocations induced by thermal cycling, which can suppress the transformation temperature and cause (001)M micro-twins to replace <011>M Type II twins in B19’ martensite. The formation mechanism of (001)M micro-twins associated with the thermal cycling is also proposed. Aging effect on transformation behavior of Ti50Ni40Cu10 ribbons is also investigated. Experimental results show that aging treatment can eliminate the defect and retained strain induced by RSP and increases quickly the transformation temperature. However, at the same time, aging treatment can cause Ti2Ni precipitation inside grains which can lower the Ti content in matrix and result in the decreases of transformation temperature. Low temperature aging or aging for short period would induce multi-stage B2←→B19 transformation owing to composition deviation generated by non-uniform Ti2Ni precipitation inside the grains. The multi-stage transformation would merge to one stage with high temperature aging or aging for long period due to the homogeneous composition caused by uniform precipitation. When aging temperature is above 500oC, Ti2Ni particles precipitate inside grains and cause the multi-stage transformation during short period aging, while, except Ti2Ni, TiNi2Cu particles also precipitate at 700oC aging with homogeneous matrix composition. | en |
dc.description.provenance | Made available in DSpace on 2021-06-13T15:29:48Z (GMT). No. of bitstreams: 1 ntu-97-R95527009-1.pdf: 12264100 bytes, checksum: f205f09e0b8c6fb86422c4fbbc64e532 (MD5) Previous issue date: 2008 | en |
dc.description.tableofcontents | 中文摘要.................................................i
Abstract................................................iii 目錄.....................................................V 第一章 前言.............................................1 第二章 文獻探討 2-1 形狀記憶合金簡介...................................3 2-2 形狀記憶合金之特性 2-2-1 形狀記憶效應......................................4 2-2-2 熱彈性麻田散體變態................................5 2-2-3 擬彈性............................................7 2-3 TiNi形狀記憶合金...................................9 2-4 TiNiX高溫形狀記憶合金.............................10 2-5 TiNiHf形狀記憶合金................................11 2-6 熱循環對TiNi合金之影響............................13 2-7 TiNiCu形狀記憶合金................................14 第三章 實驗方法 3-1 TiNiHf合金配置、試片準備、熱製程與熱處理 3-1-1 TiNiHf合金配置、試片準備與熱製程.................28 3-1-2 TiNiHf合金冷軋延及退火處理.......................30 3-1-3 TiNiHf合金熱循環.................................31 3-1-4 TiNiHf合金時效處理...............................31 3-2 TiNiCu合金薄帶配置、試片準備、熱製程與熱處理 3-2-1 TiNiCu合金薄帶熱製程與熱處理.....................32 3-2-2 TiNiCu合金薄帶時效處理...........................32 3-3 DSC(Differential Scanning Calorimeter)熱分析儀實驗......................................................33 3-4 光學顯微鏡(OM)與掃瞄是電子顯微鏡(SEM)觀察.....33 3-5 穿透式電子顯微鏡(TEM)觀察.......................34 3-6 EPMA成份分析......................................34 3-7 XRD晶體結構分析...................................35 3-8 形狀記憶效應測試..................................35 第四章 Ti50.5-XNi49.5HfX合金實驗結果與討論 4-1 Ti45.5Ni49.5Hf5合金之變態溫度與變態行為 4-1-1 Hf5合金均質化後DSC測量結果.......................46 4-1-2 均質化後熱循環處理對Hf5合金相變態溫度及相變態行為之影響....................................................47 4-1-3 冷軋延後退火處理對Hf5合金相變態溫度及變態潛熱之影響......................................................48 4-1-4 時效處理.........................................50 4-2 Ti40.5Ni49.5Hf10合金之變態溫度與變態行為 4-2-1 Hf10合金均質化後DSC變態點測量結果................50 4-2-2 均質化後熱循環處理對Hf10合金相變態行為之影響.....51 4-2-2-1 均質化後熱循環處理對Hf10合金相變態溫度及相變態行為之影響(DSC)...........................................51 4-2-2-2 熱循環處理對Hf10合金顯微結構之影響(OM及SEM)...53 4-2-2-3 熱循環處理對Hf10合金晶體結構之影響(XRD).......54 4-2-2-4 熱循環處理對Hf10合金成分分佈之影響(EPMA)......55 4-2-2-5 熱循環處理對Hf10合金微結構之影響(TEM).........55 4-2-3 冷軋延後退火處理對變態溫度及變態潛熱之影響.......61 4-2-4 時效處理.........................................62 4-3 形狀記憶效應......................................63 4-4 綜合討論 4-4-1 Ti45.5Ni49.5Hf5合金與Ti40.5Ni49.5Hf10合金之比較..64 4-4-2 Ti50.5-XNi49.5HfX合金與Ti50.5-XNi49.5ZrX合金之比較67 第五章 Ti50Ni40Cu10薄帶實驗結果與討論 5-1 冷卻銅輪2000轉之Cu10薄帶 5-1-1 As-spun 2000轉Cu10薄帶...........................116 5-1-2 退火處理對2000轉Cu10薄帶相變態行為之影響(DSC)....117 5-1-3 650℃退火處理對2000轉Cu10薄帶相變態行為之影響 (SEM、EPMA及XRD)........................................119 5-2 冷卻銅輪4000轉之Cu10薄帶 5-2-1 As-spun 4000轉Cu10薄帶...........................122 5-2-2 退火處理對4000轉Cu10薄帶相變態行為之影響(DSC)....123 第六章 結論.............................................142 參考文獻................................................144 | |
dc.language.iso | zh-TW | |
dc.title | 熱處理對TiNiHf塊材及TiNiCu薄帶形狀記憶合金變態行為之研究 | zh_TW |
dc.title | Heat Treatment on Transformation Behavior of TiNiHf Bulk and TiNiCu Ribbon Shape Memory Alloys | en |
dc.type | Thesis | |
dc.date.schoolyear | 96-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 王文雄,林新智,胡塵滌,王建義 | |
dc.subject.keyword | TiNiHf合金,TiNiCu薄帶,熱循環,退火處理,時效處理,形狀回復率, | zh_TW |
dc.subject.keyword | TiNiHf alloy,TiNiCu ribbon,thermal cycling,annealing,aging, | en |
dc.relation.page | 148 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2008-07-16 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 材料科學與工程學研究所 | zh_TW |
顯示於系所單位: | 材料科學與工程學系 |
文件中的檔案:
檔案 | 大小 | 格式 | |
---|---|---|---|
ntu-97-1.pdf 目前未授權公開取用 | 11.98 MB | Adobe PDF |
系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。