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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 莊東漢(Tung-Han Chuang) | |
dc.contributor.author | Chih-Chien Chi | en |
dc.contributor.author | 紀志堅 | zh_TW |
dc.date.accessioned | 2021-06-13T15:25:53Z | - |
dc.date.available | 2010-08-04 | |
dc.date.copyright | 2008-08-04 | |
dc.date.issued | 2008 | |
dc.date.submitted | 2008-07-18 | |
dc.identifier.citation | 【1】 G. E. Moore, Lithography and the future of Moore's law, Proceedings of SPIE - The International Society for Optical Engineering, Vol. 2440, p. 2-17. (1995)
【2】 H. Xiao, Introduction to semiconductor manufacturing technology, Prentice Hall. (2001) 【3】 Intel, http://www.intel.com/technology/mooreslaw/index.htm 【4】 R. R. Tummala, E. J. Rymaszewski and A. G. Klopfenstein, Microelectronic Packaging Handbook, Chapman&Hall. (1997) 【5】 R. R. Tummala, Fundametals of Microsystems Packing, McGraw-Hill. (2001) 【6】 C. A. Giffels, R. J. Gashler, J. M. Morabito and K. M. Striny, Interconnection Media, AT&T Technical Journal, Vol. 66, No. 4, p. 31-44. (1987) 【7】 M. R. Pinnel and W. H. Knausenberger, Interconnection System Requirements And Modeling, AT&T Technical Journal, Vol. 66, No. 4, p. 45-56. (1987) 【8】 J. H. Lau, Ball Grid Array Technology, McGraw-Hill. (1995) 【9】 J. H. Lau, Flip Chip Technologies, McGraw Hill. (1995) 【10】 T. Liukkonen, P. Nummenpaa and A. Tuominen, The Effect of Lead-Free Solder Paste on Component Placement Accuracy and Self-Alignment during Reflow, Soldering and Surface Mount Technology, Vol. 16, No. 1, p. 44-47. (2004) 【11】 W. Zhang, C. Q. Wang and Y. H. Tian, Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering, Journal of Electronic Packaging, Vol. 130, No. 1, p. 011009. (2008) 【12】 J. Glazer, Microstructure and Mechanical Properties of Pb-Free Solder Alloys for Low-Cost Electronic Assembly, Journal of Electronic Materials, Vol. 23, No. 8, p. 693-700. (1994) 【13】 M. Abtew and G. Selvaduray, Lead-Free Solders in Microelectronics, Materials Science & Engineering R-Reports, Vol. 27, No. 5-6, p. 95-141. (2000) 【14】 C. M. L. Wu, M. L. Huang, J. K. L. Lai and Y. C. Chan, Developing a Lead-Free Solder Alloy Sn-Bi-Ag-Cu by Mechanical Alloying, Journal of Electronic Materials, Vol. 29, No. 8, p. 1015-1020. (2000) 【15】 J. H. Lau, C. P. Wong, N. C. Lee and S. W. R. Lee, Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials, McGraw-Hill. (2003) 【16】 D. Suraski and K. Seelig, The Current Status of Lead-Free Solder Alloys, IEEE Electronics Packaging Manufacturing, Vol. 24, No. 4, p. 244-248. (2001) 【17】 K. N. Subramanian and J. G. Lee, Physical Metallurgy in Lead-Free Electronic Solder Development, JOM, Vol. 55, No. 5, p. 26-32. (2003) 【18】 徐光憲與倪家纘, 稀土科學基礎研究, 湖南科學技術出版社. (1995) 【19】 鄭子樵與李紅英, 稀土功能材料, 化學工業出版社. (2003) 【20】 C. M. L. Wu and Y. W. Wong, Rare-Earth Additions to Lead-Free Electronic Solders, Journal of Materials Science-Materials in Electronics, Vol. 18, No. 1-3, p. 77-91. (2007) 【21】 白蓉生, 禁用有害物質RoHS指令之現狀, 電路板會刊(TPCA), No. 31, p. 21-33. (2006) 【22】 顏秀芳, Sn3Ag0.5Cu無鉛銲錫添加稀土元素Ce之球格陣列構裝界面反應與錫鬚成長研究, 國立台灣大學材料科學與工程學研究所博士論文. (2006) 【23】 T. H. Chuang and S. F. Yen, Abnormal Growth of Tin Whiskers in a Sn3Ag0.5Cu0.5Ce Solder BGA Package, Journal of Electronic Materials, Vol. 35, No. 8, p. 1621-1627. (2006) 【24】 T. H. Chuang, Rapid Whisker Growth on the Surface of Sn-3Ag-0.5Cu-1.0Ce Solder Joints, Scripta Materialia, Vol. 55, No. 11, p. 983-986. (2006) 【25】 T. H. Chuang and S. F. Yen, Abnormal Tin Whisker Growth in Rare Earth Element-Doped Sn3Ag0.5CuXCe Solder Joints, Materials Science Forum, Supplement to THERMEC 2006, 5th International Conference on PROCESSING and MANUFACTURING OF ADVANCED MATERIALS, THERMEC 2006, Vol. 539-543, No. PART 4, p. 4019-4024. (2007) 【26】 T. H. Chuang, Temperature Effects on the Whiskers in Rare-Earth Doped Sn-3Ag-0.5Cu-0.5Ce Solder Joints, Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, Vol. 38A, No. 5, p. 1048-1055. (2007) 【27】 謝坤龍與王正全, PCB無鉛表面處理製程技術之介紹, 工業材料雜誌, No. 207, p. 159-166. (2004) 【28】 D. P. Seraphim, R. C. Lasky and C. Y. Li, Principle of Electronic Package, McGraw-Hill. (1993) 【29】 J. J. Liu, H. Berg, Y. T. Wen, S. Mulgaonker, R. Bowlby and A. Mawer, Plastic Ball Grid Array (PBGA) Overview, Materials Chemistry and Physics, Vol. 40, No. 4, p. 236-244. (1995) 【30】 Z. Mei, M. Kaufmann, A. Eslambolchi and P. Johnson, Brittle Interfacial Fracture of Packages Soldered on Electroless Nikel/Immersion Gold, IEEE Electronic Components and Technology Conference 48th, p. 952-961. (1998) 【31】 C. Y. Lee, J. W. Yoon, Y. J. Kim and S. B. Jung, Interfacial Reactions and Joint Reliability of Sn-9Zn Solder on Cu or Electrolytic Au/Ni/Cu BGA Substrate, Microelectronic Engineering, Vol. 82, No. 3-4, p. 561-568. (2005) 【32】 J. W. Yoon and S. B. Jung, Solder Joint Reliability Evaluation of Sn-Zn/Au/Ni/Cu Ball-Grid-Array Package during Aging, Materials Science and Engineering A, Vol. 452, p. 46-54. (2007) 【33】 J. L. Fang and D. K. Chan, The Advantages of Mildly Alkaline Immersion Silver as a Final Finish for Solderability, Circuit World, Vol. 33, No. 2, p. 43-51. (2007) 【34】 R. E. Reed-Hill and R. Abbaschian, Physical Metallurgy Principles, PWS Publishing Company. (1994) 【35】 李正中, 物理冶金學, 國立台北科技大學材料及資源工程系. (2001) 【36】 J. Bath, C. Handweker and E. Bradley, Research Update: Lead-Free Solder Alternatives, Circuits Assembly, Vol. 11, No. 5, p. 30-40. (2000) 【37】 iNEMI, http://www.inemi.org 【38】 I. E. Anderson, Development of Sn-Ag-Cu and Sn-Ag-Cu-X Alloys for Pb-Free Electronic Solder Applications, Journal of Materials Science-Materials in Electronics, Vol. 18, No. 1-3, p. 55-76. (2007) 【39】 KITCO, http://www.kitco.com 【40】 K. W. Moon, W. J. Boettinger, U. R. Kattner, F. S. Biancaniello and C. A. Handwerker, Experimental and Thermodynamic Assessment of Sn-Ag-Cu Solder Alloys, Journal of Electronic Materials, Vol. 29, No. 10, p. 1122-1136. (2000) 【41】 I. E. Anderson, Microstructural Modifications and Properties of Sn-Ag-Cu Solder Joints Induced by Alloying, Journal of Electronic Materials, Vol. 31, No. 11, p. 1166-1174. (2002) 【42】 S. K. Kang, W. K. Choi, D. Y. Shih, D. W. Henderson, T. Gosselin, A. Sarkhel, C. Goldsmith and K. J. Puttlitz, Ag3Sn Plate Frmation in the Slidification of Near-Ternary Eutectic Sn-Ag-Cu, JOM, Vol. 55, No. 6, p. 61-65. (2003) 【43】 Y. Kariya and M. Otsuka, Mechanical Fatigue Characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) Solder Alloys, Journal of Electronic Materials, Vol. 27, No. 11, p. 1229-1235. (1998) 【44】 Y. Kariya, Y. Hirata and M. Otsuka, Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints, Journal of Electronic Materials, Vol. 28, No. 11, p. 1263-1269. (1999) 【45】 林國書, 吳宗憲, 葉雅靜, 紀佳良與王彰盟, 新世代低成本無鉛銲錫合金特性研究, 銲接與切割(Welding&Cutting), Vol. 17, No. 3, p. 21-26. (2007) 【46】 T. B. Massalski, H. Okamoto, P. R. Subramanian and L. Kacprzak, Binary Alloy Phase Diagrams, ASM International. (1990) 【47】 F. Bartels, J. W. Morris, G. Dalke and W. Gust, Intermetallic Phase Formation in Thin Solid-Liquid Diffusion Couples, Journal of Electronic Materials, Vol. 23, No. 8, p. 787-790. (1994) 【48】 C. W. Hwang, J. G. Lee, K. Suganuma and H. Mori, Interfacial Microstructure between Sn-3Ag-xBi Alloy and Cu Substrate with or without Electrolytic Ni Plating, Journal of Electronic Materials, Vol. 32, No. 2, p. 52-62. (2003) 【49】 C. R. Kao, Microstructures Developed in Solid-Liquid Reactions: Using Cu-Sn Reaction, Ni-Bi Reaction, and Cu-In Reaction as Examples, Materials Science and Engineering A, Vol. 238, No. 1, p. 196-201. (1997) 【50】 M. Schaefer, W. Laub, R. A. Fournelle and J. Liang, Evalution of Intermetallic Phase Formation and Concurrent Dissolution of Intermetallic during Reflow Soldering, Proceedings of the 1997 TMS Annual Meeting, p. 247-257. (1997) 【51】 A. Zribi, A. Clark, L. Zavalij, P. Borgesen and E. J. Cotts, The Growth of Intermetallic Compounds at Sn-Ag-Cu Solder/Cu and Sn-Ag-Cu Solder/Ni Interfaces and the Associated Evolution of the Solder Microstructure, Journal of Electronic Materials, Vol. 30, No. 6, p. 1157-1164. (2001) 【52】 C. E. Ho, Y. L. Lin and C. R. Kao, Strong Effect of Cu Concentration on the Reaction between Lead-Free Microelectronic Solders and Ni, Chemical of Materials, Vol. 14, No. 3, p. 949-951. (2002) 【53】 C. E. Ho, S. C. Yang and C. R. Kao, Interfacial Reaction Issues for Lead-Free Electronic Solders, Journal of Materials Science: Materials in Electronics, Vol. 18, No. 1-3, p. 155-174. (2007) 【54】 T. Laurila, V. Vuorinen and J. K. Kivilahti, Interfacial Reactions between Lead-Free Solders and Common Base Materials, Materials Science & Engineering R-Reports, Vol. 49, No. 1-2, p. 1-60. (2005) 【55】 K. Zeng, R. Stierman, T. C. Chiu, D. Edwards, K. Ano and K. N. Tu, Kirkendall Void Formation in Eutectic SnPb Solder Joints on Bare Cu and its Effect on Joint Reliability, Journal of Applied Physics, Vol. 97, 024508. (2005) 【56】 T. C. Chiu, K. Zeng, R. Stierman, D. Edwards and K. Ano, Effect of Thermal Aging on Board Level Drop Reliability for Pb-Free BGA Packages, IEEE Electronic Components and Technology Conference 54th, Vol. 2, No. 1-4, p. 1256-1262. (2004) 【57】 S. W. Chen, S. H. Wu and S. W. Lee, Interfacial Reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu, and Sn/(Cu,Ni) Systems, Journal of Electronic Materials, Vol. 32, No. 11, p. 1188-1194. (2003) 【58】 J. Y. Tsai, Y. C. Hu, C. M. Tsai and C. R. Kao, A Study on the Reaction between Cu and Sn3.5Ag Solder Doped with Small Amounts of Ni, Journal of Electronic Materials, Vol. 32, No. 11, p. 1203-1208. (2003) 【59】 L. Garner, S. Sane, D. Suh, T. Byrne, A. Dani, T. Martin, M. Mello, M. Patel and R. Williams, Finding Solutions to the Challenges in Package Interconnect Reliability, Intel Technology Journal, Vol. 9, No. 4, p. 297-308. (2005) 【60】 C. M. Chuang and K. L. Lin, Effect of Microelements Addition on the Interfacial Reaction between Sn-Ag-Cu Solders and Cu Substrate, Journal of Electronic Materials, Vol. 32, No. 12, p. 1426-1430. (2003) 【61】 H. Watanabe, N. Hidaka, I. Shohji and M. ITO, Effect of Ni and Ag on Interfacial Reaction and Microstructure of Sn-Ag-Cu-Ni-Ge Lead-Free Solder, Materials Science and Technology: Product Manufacturing, p. 135-146. (2006) 【62】 E. K. Ohriner, Intermetallic Formation in Soldered Copper-Based Alloys at 150℃ to 250℃, Welding Journal, Vol. 66, No. 7, p. 191-202. (1987) 【63】 S. Bader, W. Gust and H. Hieber, Rapid Formation of Intermetallic Compounds Interdiffusion in the Cu-Sn and Ni-Sn Systems, Acta Metallurgica et Materialia, Vol. 43, No. 1, p. 329-337. (1995) 【64】 W. G. Bader, Dissolution and Formation of Intermetallics in the Soldering Process, IAHS-AISH Publication (International Association of Hydrological Sciences-Association Internationale des Sciences Hydrologiques), p. 257-268. (1980) 【65】 J. A. Vanbeek, S. A. Stolk and F. J. J. Vanloo, Multiphase Diffusion in the Systems Fe-Sn and Si-Sn, Zeitschrift Fur Metallkunde, Vol. 73, No. 7, p. 439-444. (1982). 【66】 P. L. Liu and J. K. Shang, Thermal Stability of Electroless-Nickel/Solder Interface: Part B. Interfacial Fatigue Resistance, Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, Vol. 31, No. 11, p. 2867-2875. (2000) 【67】 C. E. Ho, R. Y. Tsai, Y. L. Lin and C. R. Kao, Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni, Journal of Electronic Materials, Vol. 31, No. 6, p. 584-590. (2002) 【68】 C. E. Ho, Y. L. Lin and C. R. Kao, Strong Effect of Cu Concentration on the Reaction between Lead-Free Microelectronic Solders and Ni, Chemistry of Materials, Vol. 14, No. 3, p. 949-951. (2002) 【69】 C. H. Lin, S. W. Chen and C. H. Wang, Phase Equilibria and Solidification Properties of Sn-Cu-Ni Alloys, Journal of Electronic Materials, Vol. 31, No. 9, p. 907-915. (2002) 【70】 C. Y. Li and J. G. Duh, Phase Equilibria in the Sn-Rich Corner of the Sn-Cu-Ni Ternary Alloy System at 240℃, Journal of Materials Research, Vol. 20, No. 11, p. 3118-3124. (2005) 【71】 B. F. Dyson, T. R. Anthony and D. Turnbull, Interstitial Diffusion of Copper in Tin, Journal of Applied Physics, Vol. 38, No. 8, p. 3408. (1967) 【72】 D. C. Yeh and H. B. Huntington, Extreme Fast-Diffusion System - Nickel in Single-Crystal Tin, Physical Review Letters, Vol. 53, No. 15, p. 1469-1472. (1984) 【73】 H. Mehrer, Landolt-Börnstein: Numerical Data and Functional Relationships in Science and Technology: Diffusion in Solid Metals and Alloys, Springer-Verlag Berlin Heidelberg New York. (1990) 【74】 S. Anhock, H. Oppermann, C. Kallmayer, R. Aschenbrenner, L. Thomas and H. Reichl, Investigations of Au-Sn Alloys on Different End-Metallizations for High Temperature Applications, IEEE/CMPT Electronics Manufacturing Technology Symposium, p. 156-165. (1998) 【75】 C. E. Ho, R. Zheng, G. L. Luo, A. H. Lin and C. R. Kao, Formation and Resettlement of (AuxNi1-x)Sn4 in Solder Joints of Ball-Grid-Array Packages with the Au/Ni Surface Finish, Journal of Electronic Materials, Vol. 29, No. 10, p. 1175-1181. (2000) 【76】 L. Y. Hsiao, G. Y. Jang, K. J. Wang and J. G. Duh, Inhibiting AuSn4 Formation by Controlling the Interfacial Reaction in Solder Joints, Journal of Electronic Materials, Vol. 36, No. 11, p. 1476-1482. (2007) 【77】 W. C. Luo, C. E. Ho, J. Y. Tsai, Y. L. Lin and J. G. Duh, Solid-State Reactions between Ni and Sn-Ag-Cu Solders with Different Cu Concentrations, Materials Science and Engineering A, Vol. 396, No. 1-2, p. 385-391. (2005) 【78】 L. C. Shiau, C. E. Ho and C. R. Kao, Reactions between Sn-Ag-Cu Lead-Free Solders and the Au/Ni Surface Finish in Advanced Electronic Packages, Soldering & Surface Mount Technology, Vol. 14, No. 3, p. 25-29. (2002) 【79】 K. N. Tu and K. Zeng, Tin-Lead (SnPb) Solder Reaction in Flip Chip Technology, Materials Science & Engineering R-Reports, Vol. 34, No. 1, p. 1-58. (2001) 【80】 Y. C. Lin, J. G. Duh and B. S. Chiou, Wettability of Electroplated Ni-P in Under Bump Metallurgy with Sn-Ag-Cu Solder, Journal of Electronic Materials, Vol. 35, No. 1, p. 7-14. (2006) 【81】 B. L. Young, J. G. Duh and B. S. Chiou, Wettability of Electroless Ni in the Under Bump Metallurgy with Lead Free Solder, Journal of Electronic Materials, Vol. 30, No. 5, p. 543-553. (2001) 【82】 Y. C. Lin and J. G. Duh, Phase Transformation of the Phosphorus-Rich Layer in SnAgCu/Ni-P Solder Joints, Scripta Materialia, Vol. 54, No. 9, p. 1661-1665. (2006) 【83】 Y. C. Lin, T. Y. Shih, S. K. Tien and J. G. Duh, Suppressing Ni-Sn-P Growth in SnAgCu/Ni-P Solder Joints, Scripta Materialia, Vol. 56, No. 1, p. 49-52. (2007) 【84】 Y. C. Lin and J. G. Duh, Optimal Phosphorous Content Selection for the Soldering Reaction of Ni-P Under Bump Metallization with Sn-Ag-Cu Solder, Journal of Electronic Materials, Vol. 35, No. 8, p. 1665-1671. (2006) 【85】 D. Q. Yu, J. Zhao and L. Wang, Improvement on the Microstructure Stability, Mechanical and Wetting Properties of Sn-Ag-Cu Lead-Free Solder with the Addition of Rare Earth Elements, Journal of Alloys and Compounds, Vol. 376, No. 1-2, p. 170-175. (2004) 【86】 C. M. L. Wu, D. Q. Yu, C. M. T. Law and L. Wang, Improvements of Microstructure, Wettability, Tensile and Creep Strength of Eutectic Sn-Ag Alloy by Doping with Rare-Earth Elements, Journal of Materials Research, Vol. 17, No. 12, p. 3146-3154. (2002) 【87】 Z. Chen, Y. Shi, Z. Xia and Y. Yan, Properties of Lead-Free Solder SnAgCu Containing Minute Amounts of Rare Earth, Journal of Materials Research, Vol. 32, No. 4, p. 235-243. (2003) 【88】 H. Mavoori, A. G. Ramirez, and S. Jin, Universal Solders for Direct and Powerful Bonding on Semiconductors, Diamond, and Optical Materials, Applied Physics Letters, Vol. 78, No. 19, p. 2976-2978. (2001) 【89】 E. Gebhardt, and G. Petzow, Uber Den Aufbau Des Sustems Silber-Kupfer-Zinn, Zeitschrift Fur Metallkunde, Vol. 50, No. 10, p. 597-605. (1959) 【90】 C. M. L. Wu, D. Q. Yu, C. M. T. Law and L. Wang, Microstructure and Mechanical Properties of New Lead-Free Sn-Cu-RE Solder Alloys, Journal of Electronic Materials, Vol. 31, No. 9, p. 928-932. (2002) 【91】 C. M. L. Wu, D. Q. Yu, C. M. T. Law and L. Wang, The Properties of Sn-9Zn Lead-Free Solder Alloys Doped with Trace Rare Earth Elements, Journal of Electronic Materials, Vol. 31, No. 9, p. 921-927. (2002) 【92】 C. M. L. Wu, D. Q. Yu, C. M. T. Law and L. Wang, The Properties of Sn-9Zn Lead-Free Solder Alloys Doped with Trace Rare Earth Elements, Journal of Electronic Materials, Vol. 32, No. 2, p. 63-69. (2003) 【93】 P. T. Vianco and A. C. Claghorn, Effect of Substrate Preheating on Solderability Performance as a Guideline for Assembly Process Development Part 1: Baseline Analysis, Soldering & Surface Mount Technology, Vol. 8, No. 3, p. 12-18. (1996) 【94】 C. C. Tu and M. E. Natishan, Wettability Test Method for Surface Mount Technology Assessment, Soldering & Surface Mount Technology, Vol. 12, No. 2, p. 10-15. (2000) 【95】 P. T. Vianco and D. R. Frear, Issues in the Replacement of Lead-Bearing Solders, JOM, Vol. 45, No. 7, p. 14-19. (1993) 【96】 C. M. L. Wu, D. Q. Yu, C. M. T. Law and L. Wang, Properties of Lead-Free Solder Alloys with Rare Earth Element Additions, Materials Science & Engineering R-Reports, Vol. 44, No. 1, p. 1-44. (2004) 【97】 C. M. T. Law, C. M. L. Wu, D. Q. Yu, L. Wang and J. K. L. Lai, Microstructure, Solderability, and Growth of Intermetallic Compounds of Sn-Ag-Cu-RE Lead-Free Solder Alloys, Journal of Electronic Materials, Vol. 35, No. 1, p. 89-93. (2006) 【98】 K. N. Tu and R. D. Thompson, Kinetics of Interfacial Reaction in Bimetallic Cu-Sn Thin-Films, Acta Metallurgica, Vol. 30, No. 5, p. 947-952. (1982) 【99】 K. N. Tu, Irreversible-Processes of Spontaneous Whisker Growth in Bimetallic Cu-Sn Thin Film Reactions, Physical Review B, Vol. 49, No. 3, p. 2030-2034. (1994) 【100】 A. G. Ramirez, H. Mavoori and S. Jin, Bonding Nature of Rare-Earth-Containing Lead-Free Solders, Applied Physics Letters, Vol. 80, No. 3, p. 398-400. (2002) 【101】 Z. Xia, Z. Chen, Y. Shi, N. Mu and N. Sun, Effect of Rare Earth Element Additions on the Microstructure and Mechanical Properties of Tin-Silver-Bismuth Solder, Journal of Electronic Materials, Vol. 31, No. 6, p. 564-567. (2002) 【102】 C. M. T. Law, C. M. L. Wu, D. Q. Yu, M. Li and D. Z. Chi, Interfacial Microstructure and Strength of Lead-Free Sn-Zn-RE BGA Solder Bumps, IEEE Transactions on Advanced Packaging, Vol. 28, No. 2, p. 252-258. (2005) 【103】 X. Ma, Y. Y. Qian and F. Yoshida, Effect of Rare Earths on Solidification Microstructure and High Temperature Mechanical Property of Sn60-Pb40 Solder Alloy, Journal of Rare Earths, Vol. 18, No. 4, p. 289-292. (2000) 【104】 Z. Chen, Y. Shi, Z. Xia and Y. Yan, Study on the Microstructure of a Novel Lead-Free Solder Alloy SnAgCu-RE and Its Soldered Joints, Journal of Electronic Materials, Vol. 31, No. 10, p. 1122-1128. (2002) 【105】 M. A. Dudek, R. S. Sidhu, N. Chawla and M. Renavikar, Microstructure and Mechanical Behavior of Novel Rare Earth-Containing Pb-Free Solders, Journal of Electronic Materials, Vol. 35, No. 12, p. 2088-2097. (2006) 【106】 M. A. Dudek, R. S. Sidhu and N. Chawla, Novel Rare-Earth-Containing Lead-Free Solders with Enhanced Ductility, JOM, Vol. 58, No. 6, p. 57-62. (2006) 【107】 蔡碧娥、王碩顯、王宣勝、顏秀芳、紀志堅與莊東漢, 錫鬚的成長機制, 電路板會刊(TPCA), No. 39, p. 4-14. (2008) 【108】 R. W. Gedney, Foreword Special Issue on Tin Whiskers, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 28, No. 1, p. 1-2. (2005) 【109】 W. J. Choi, T. Y. Lee, K. N. Tu, N. Tamura, R. S. Celestre, A. A. Macdowell, Y. Y. Bong and L. Nguyen, Tin Whiskers Studied by Synchrotron Radiation Scanning X-Ray Micro-Diffraction, Acta Materialia, Vol. 51, No. 20, p. 6253-6261. (2003) 【110】 I. Sakamoto, Whisker Test Methods of JEITA Whisker Growth Mechanism for Test Methods, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 28, No. 1, p. 10-16. (2005) 【111】 G. T. Galyon, Annotated Tin Whisker Bibliography and Anthology, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 28, No. 1, p. 94-122. (2005) 【112】 H. L. Cobb, Cadmium Whiskers, Monthly Review America Electroplaters Society, Vol. 33, No. 28, p. 28-30. (1946) 【113】 B. Z. Lee and D. N. Lee, Spontaneous Growth Mechanism of Tin Whiskers, Acta Materialia, Vol. 46, No. 10, p. 3701-3714. (1998) 【114】 K. G. Compton, A. Mendizza and S. M. Arnold, Filamentary Growths on Metal Surfaces - Whiskers, Corrosion, Vol. 7, No. 10, p. 327-334. (1951) 【115】 C. Herring and J. K. Galt, Elastic and Plastic Properties of Very Small Metal Specimens, Physical Review, Vol. 85, No. 6, p. 1060-1061. (1952) 【116】 N. Furuta and K. Hamamura, Growth Mechanism of Proper Tin-Whisker, Japanese Journal of Applied Physics, Vol. 8, No. 12, p. 1404-1410. (1969) 【117】 M. O. Peach, Mechanism of Growth of Whiskers on Cadmium, Journal of Applied Physics, Vol. 23, No. 12, p. 1401-1403. (1952) 【118】 S. E. Koonce and S. M. Arnold, Growth of Metal Whiskers, Journal of Applied Physics, Vol. 24, No. 3, p. 365-366. (1953) 【119】 J. D. Eshelby, A Tentative Theory of Metallic Whisker Growth, Physical Review, Vol. 91, No. 3, p. 755-756. (1953) 【120】 F. R. N. Nabarro and P. J. Jackson, Growth of Crystal Whiskers, International Conference on Crystal Growth, p. 11-101. (1958) 【121】 W. C. Ellis, D. F. Gibbons and R. G. Treuting, Growth of Metal Whiskers from the Solid, International Conference on Crystal Growth, p. 102-119. (1958) 【122】 R. H. Doremus, B. W. Roberts and D. Turnbull, Growth and Perfection of Crystals, New York: Wiley & Sons Inc. (1958) 【123】 G. T. Galyon and L. Palmer, An Integrated Theory of Whisker Formation: The Physical Metallurgy of Whisker Formation and the Role of Internal Stresses, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 28, No. 1, p. 17-30. (2005) 【124】 R. M. Fisher, L. S. Darken and K. G. Carroll, Accelerated Growth of Tin Whiskers, Acta Metallurgica, Vol. 2, No. 3, p. 368-373. (1954) 【125】 C. Xu, Y. Zhang, C. Fan and J. A. Abys, Driving Force for the Formation of Sn Whiskers: Compressive Stress-Pathways for its Generation and Remedies for its Elimination and Minimization, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 28, No. 1, p. 31-35. (2005) 【126】 N. Vo, M. Kwoka and P. Bush, Tin Whisker Test Standardization, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 28, No. 1, p. 3-9. (2005) 【127】 S. H. Liu, C. Chen, P. C. Liu and T. Chou, Tin Whisker Growth Driven by Electrical Currents, Journal of Applied Physics, Vol. 95, No. 12, p. 7742-7747. (2004) 【128】 K. N. Tu, Cu/Sn Interfacial Reactions: Thin-Film Case Versus Bulk Case, Materials Chemistry and Physics, Vol. 46, No. 2-3, p. 217-223. (1996) 【129】 W. J. Choi, T. Y. Lee, K. N. Tu, N. Tumara, R. S. Celestre, A. A. Macdowell, Y. Y. Bong, L. Nguyen and G. T. T. Sheng, Structure and Kinetics of Sn Whisker Growth on Pb-Free Solder Finish, IEEE Electronic Components and Technology Conference 52th, p. 628-633. (2002) 【130】 G. T. T. Sheng, C. F. Hu, W. J. Choi, K. N. Tu, Y. Y. Bong and L. Nguyen, Tin Whiskers Studied By Focused Ion Beam Imaging and Transmission Electron Microscopy, Journal of Applied Physics, Vol. 92, No. 1, p. 64-69. (2002) 【131】 K. N. Tu and J. C. M. Li, Spontaneous Whisker Growth on Lead-Free Solder Finishes, Materials Science And Engineering A, Vol. 409, No. 1-2, p. 131-139. (2005) 【132】 T. H. Chuang, H. J. Lin and C. C. Chi, Rapid Growth of Tin Whiskers on the Surface of Sn-6.6Lu Alloy, Scripta Materialia, Vol. 56, No. 1, p. 45-48. (2007) 【133】 T. H. Chuang, H. J. Lin and C. C. Chi, Oxidation-Induced Whisker Growth on the Surface of Sn-6.6(La, Ce) Alloy, Journal of Electronic Materials, Vol. 36, No. 12, p. 1697-1702. (2007) 【134】 T. H. Chuang, C. C. Chi and H. J. Lin, Formation of Whiskers and Hillocks on the Surface of Sn-6.6RE Alloys, Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, Vol. 39A, No. 3, p. 604-612. (2008) 【135】 B. Jiang and A. P. Xian, Spontaneous Growth of Tin Whiskers on Tin-Rare-Earth Alloys, Philosophical Magazine Letters, Vol. 87, No. 9, p. 657-662. (2007) 【136】 C. Xu, Y. Zhang, C. Fan and J. A. Abys, Understanding Whisker Phenomenon: The Driving Force for Whisker Formation, CircuiTree, Vol. 15, No. 5, p. 10-21. (2002) 【137】 林修任, 含稀土銲錫合金接點之界面反應、電遷移與錫鬚成長研究, 國立台灣大學材料科學與工程學研究所博士論文. (2007) 【138】 T. H. Chuang and H. J. Lin, Size Effect of Rare-Earth Precipitates in Sn9Zn0.5Ce and Sn3Ag0.5Cu0.5Ce Solders on the Growth of Tin Whiskers, Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, In Press. (2002) 【139】 S. W. Cho, K. Han, Y. J. Yi, S. J. Kang, K. H. Yoo, K. Jeong and C. N. Whang, Thermal Oxidation Study on Lead-Free Solders of Sn-Ag-Cu and Sn-Ag-Cu-Ge, Advanced Engineering Materials, Vol. 8, No. 1-2, p. 111-114. (2006) 【140】 R. Lee, W. S. Sin, J. K. Jeon and H. S. Kim, Sn2.5Ag0.5Cu Lead Free Solder Balls With 'Ge' and 'Ni', IEEE Advanced Packaging Materials: Processes, Properties and Interfaces, p. 121-125. (2005) 【141】 D. Cavasin, Yellow Solder: An Assessment of the Quality and Reliability of Pb-Free Lead Finishes and Solder Ball Alloys Exhibiting Excessive Sn Oxidation, IEEE Electronic Components and Technology Conference 56th, p. 1060-1063. (2006) 【142】 J. N. Lalena, N. F. Dean and M. W. Weiser, Experimental Investigation of Ge-Doped Bi-11Ag as a New Pb-Free Solder Alloy for Power Die Attachment, Advanced Engineering Materials, Vol. 31, No. 11, p. 1244-1249. (2002) 【143】 P. Zhang, H. Guo, F. Yang and J. Xu, Effects of Alloying Elements on the High-Temperature Oxidation Resistance and Wettability of the Sn-9Zn Alloy, IEEE International Conference on Electronic Packaging Technology 7th, p. 1-4. (2006) 【144】 X. X. Ren, M. Li and D. L. Mao, Effect of Alloying Elements on the High-temperature Oxidation Resistance of Sn-Zn Based Lead-Free Solder, Electronic Components Materials, Vol. 23, No. 11, p. 40-44. (2004) 【145】 S. P. Yu, H. C. Wang, M. H. Hon and M. C. Wang, Composition and Heat-Treatment Effects on the Adhesion Strength of Sn-Zn-Al Solders on Cu Substrate, JOM, Vol. 52, No. 6, p. 36-39. (2000) 【146】 T. C. Chang, Y. T. Hsu, M. H. Hon and M. C. Wang, Enhancement of the Wettability and Solder Joint Reliability at the Sn-9Zn-0.5Ag Lead-Free Solder Alloy-Cu Interface by Ag Precoating, Journal of Alloys and Compounds, Vol. 360, No. 1-2, p. 217-214. (2003) 【147】 K. L. Lin, K. I. Chen and P. C. Shi, A Potential Drop-In Replacement for Eutectic Sn-Pb Solder - The Sn-Zn-Ag-Al-Ga Solder, Journal of Electronic Materials, Vol. 32, No. 12, p. 1490-1495. (2003) 【148】 Y. S. Kim, K. S. Kim, C. W. Hwang and K. Suganuma, Effect of Composition and Cooling Rate on Microstructure and Tensile Properties of Sn–Zn–Bi Alloys, Journal of Alloys and Compounds, Vol. 352, No. 1-2, p. 237-245. (2003) 【149】 C. M. L. Wu, C. M. T. Law, D. Q. Yu and L. Wang, The Wettability and Microstructure of Sn-Zn-RE Alloys, Journal of Electronic Materials, Vol. 32, No. 2, p. 63-69. (2003) 【150】 J. M. Song, T. S. Lui, Y. L. Chang and L. H. Chen, Compositional Effects on the Microstructure and Vibration Fracture Properties of Sn-Zn-Bi Alloys, Journal of Alloys and Compounds, Vol. 403, No. 1-2, p. 191-196. (2005) 【151】 D. Q. Yu, H. P. Xie and L. Wang, Investigation of Interfacial Microstructure and Wetting Property of Newly Developed Sn-Zn-Cu Solders with Cu Substrate, Journal of Alloys and Compounds, Vol. 385, No. 1-2, p. 119-125. (2004) 【152】 M. Kitajima and T. Shono, Development of Sn-Zn-Al Lead-Free Solder Alloys, Fujitsu Scientific & Technical Journal, Vol. 41, No. 2, p. 225-235. (2005) 【153】 G. L. Gong and A. P. Xian, Influence of Trace Ge on Oxidation of Liquid Tin in Atmosphere, Acta Metallurgica Sinaca, Vol. 43, No. 7, p. 759-763. (2007) 【154】 O. J. Kleppa and R. C. King, Heats of Formation of Solid Solutions of Zinc, Gallium and Germanium in Copper, Acta Metallurgica, Vol. 10, No. 12, p. 1183. (1962) 【155】 K. Habu, N. Takeda, H. Watanabe, K. Ooki, J. Abe, T. Saito, Y. Taniguchi and K. Takayama, Development of New Pb-Free Solder Alloy of Sn-Ag-Bi System, IEEE Electronics and the Environment, p. 21-24. (1999) 【156】 C. M. Miller, I. E. Anderson and J. F. Smith, A Viable Tin-Lead Solder Substitute: Sn-Ag-Cu, Journal of Electronic Materials, Vol. 23, No. 7, p. 595-601. (1994) 【157】 G. G. Meng, T. Y. Yang and L. D. Chen, Microstructure and Melting Property of Sn-2.5Ag-0.7Cu-XGe Solder, Transactions of the China Welding Institution, Vol. 28, No. 10, p. 65-68. (2007) 【158】 PCPDFWIN, JCPDS-International Center for Diffraction Data, JCPDS-ICDD. (2003) 【159】 H. Cecil, Metallography, Lodon, New York, Longmans, Green, and co.. (1874) 【160】 JESD22-B117A(Revision of JESD22-B117), Solder Ball Shear, JEDEC SOLID STATE TECHNOLOGY ASSOCIATION. (2006) 【161】 JESD22-B115, Solder Ball Pull, JEDEC SOLID STATE TECHNOLOGY ASSOCIATION. (2007) 【162】 J. X. Boucherle, f. Givord, P. Lejay, J. Schweizer and A. Stunault, Structures of Ce2Sn5 and Ce3Sn7, Two Superstructures of CeSn3, Acta Crystallographica Section B, Vol. 44, No. 4, p. 377-380. (1988) 【163】 Z. L. Wang and X. Feng, Polyhedral Shapes of CeO2 Nanoparticles, The Journal of Physical Chemistry B, Vol. 107, No. 49, p. 13563-13566. (2003) 【164】 Corrosion Source, http://www.corrosionsource.com 【165】 R. M. German and Z. A. Munir, A Correlation between the Pilling-Bedworth Ratio and the Radius of Curvature of Metallic Substrates with Coherent Thin Oxide Layers, Oxidation of Metals, Vol. 8, No. 3, p. 123-129. (1974) | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/37371 | - |
dc.description.abstract | 錫銀銅(Sn-Ag-Cu)三元合金已被評估為最有潛力取代傳統錫鉛共晶(Sn-37Pb)合金而成為主流的無鉛銲錫,但因其相較於傳統錫鉛共晶銲錫合金仍有著熔點過高、潤濕性較差等數項缺點,故許多研究嘗試於錫銀銅銲錫合金中添加稀土元素以進行改質處理。研究結果已證實於銲錫合金中添加稀土元素可有效提高機械強度及提升物理特性。然而本研究室(國立台灣大學材料所莊東漢教授所主持之電子構裝實驗室)於西元2006年首度發現在銲錫合金內添加稀土元素將引發錫鬚異常快速的成長,其成長速率在室溫可達8.6 Angstrom/Sec,遠高於文獻上過去有關錫鬚研究的成長速率(0.01 Angstrom/Sec∼0.1 Angstrom/Sec),此種異常成長的錫鬚將有可能造成電子接點短路而產生嚴重的可靠度問題。經研究指出因添加稀土元素所產生的錫鬚異常成長主要是由於銲錫合金內部的稀土介金屬化合物氧化所導致,故本研究嘗試於含稀土之錫銀銅銲錫合金中添加具有顯著抗氧化能力的鍺元素,並針對其抑制錫鬚生成的效果、物理性質與機械性質的變化進行廣泛的的討論,且同時對於各種添加鍺元素的含稀土之錫銀銅無鉛銲錫的球格陣列構裝接點其界面反應與機械強度進行全面性的整理。
實驗結果指出於Sn3Ag0.5Cu0.5RE銲錫合金中添加0.5wt.%以上的鍺元素時,在稀土介金屬化合物周圍與銲錫合金基地中將可觀察到明顯的「含鍺相」出現;不僅如此,於Sn3Ag0.5Cu0.5Ce銲錫合金中添加0.5wt.%以上的鍺元素可有效的抑制室溫中的錫鬚成長與高溫(150℃)中的錫堆出現,但於Sn3Ag0.5Cu0.5La銲錫合金中則其效果並不明顯;推測此與於含稀土之錫銀銅銲錫合金中添加鍺元素可有效降低稀土介金屬化合物CeSn3的氧化速率,但對LaSn3則無明顯的影響有密切的關係。此外添加適量的鍺元素亦可提升Sn3Ag0.5Cu0.5RE銲錫合金本身與電子構裝接點中大部分的機械性質(如:抗拉強度、維克式微硬度等),但若鍺元素添加量過多時,則反而會使其機械強度及潤濕性質大幅下降。 | zh_TW |
dc.description.abstract | Ternary Sn-Ag-Cu alloys have been recommended as potential candidates to replace the eutectic Sn-37Pb alloy as a major Pb-free solder. Due to the higher melting temperature and poorer wettability of the Sn-Ag-Cu solder, many researchers have tried to improve these properties by adding rare earth elements into the Sn-Ag-Cu solder. The studies on adding rare earth elements into Sn-Ag-Cu solder indicate that the mechanical strength and physical properties are, indeed, improved. However, as our laboratory was the first to discover, the phenomenon of amazingly rapid growth of tin whiskers on the surface of solder alloys containing rare earth elements is another problem that needs to be solved. The growth rate at room temperature can reach 8.6 Angstrom/Sec, which is much higher than the values reported in the literature (0.01 Angstrom/Sec~0.1 Angstrom/Sec). It is known that tin whiskers can cause short circuits in solder joints and lead to serious problems with reliability. Our studies of Sn-Ag-Cu-RE solder indicate that “Rare Element Intermetallic Compound” (RE-IMC) oxidation causes that abnormal tin whisker growth, so we added Germanium (Ge), which effectively prevents the surface oxidation of the solder into the Sn-Ag-Cu-RE solder, and observed its effects on the tin whisker growth, physical properties, and mechanical strength.
The results of our experiments indicate that a “Ge-Containing Phase” (GCP) exists around the “Rare-Earth Intermetallic Compound” (RE-IMC) and in the matrix of the solder when Germanium addition is greater than 0.5wt.% in Sn-Ag-Cu-RE. The tin whisker growth behaviors resulting from the RE-IMC depend on the amount of Germanium addition in Sn3Ag0.5Cu0.5Ce solder. When the amount of Germanium addition in Sn3Ag0.5Cu0.5Ce solder is greater than 0.5wt.%, the growth of tin whiskers at room temperature, and that of hillocks at high temperature (150℃), can be inhibited. However, the influence of adding Germanium into the Sn3Ag0.5Cu0.5La solder is not significant. The reason why adding Germanium can inhibit tin whisker and hillock growth is that the rate of CeSn3 oxidation in Sn-Ag-Cu-Ce is decreased, but the rate of LaSn3 oxidation in Sn-Ag-Cu-La system is not changed significantly. Furthermore, the addition of a suitable amount of Germanium in Sn3Ag0.5Cu0.5RE solder can improve a lot of mechanical properties of alloy and solder joint (for example: ultimate tensile strength, Vickers microhardness), but excessive addition of Germanium causes a significant degradation of the mechanical strength and wettability. | en |
dc.description.provenance | Made available in DSpace on 2021-06-13T15:25:53Z (GMT). No. of bitstreams: 1 ntu-97-F93527062-1.pdf: 89136639 bytes, checksum: 83ec7f0e0034b3516001f768ab00a3a7 (MD5) Previous issue date: 2008 | en |
dc.description.tableofcontents | 壹、前言—————————————————————————————001
1—1 研究背景—————————————————————————001 1—1—1 電子構裝簡介—————————————————————002 1—1—2 球格陣列構裝簡介———————————————————004 1—1—3 無鉛銲錫的發展————————————————————006 1—2 研究動機—————————————————————————008 貳、理論與文獻回顧————————————————————————016 2—1 塑膠球格陣列構裝之基板及其表面處理方式——————————016 2—2 界面介金屬成長動力學———————————————————022 2—2—1 擴散控制之界面介金屬成長———————————————025 2—2—2 界面控制之界面介金屬成長———————————————025 2—3 錫銀銅基銲錫合金概述———————————————————026 2—3—1 錫銀銅銲錫合金簡介——————————————————027 2—3—2 錫銀銅銲錫合金與銅基板之界面反應———————————030 2—3—3 錫銀銅銲錫合金與鎳基板之界面反應———————————036 2—4 添加稀土元素對無鉛銲錫合金的影響—————————————045 2—5 鬚晶概述—————————————————————————053 2—5—1 早期錫鬚成長機構簡介—————————————————053 2—5—1—1 差排理論—————————————————————054 2—5—1—2 再結晶理論————————————————————055 2—5—2 近期錫鬚成長機構之壓應力理論成長機構簡介———————056 2—5—2—1 製程中於內部所留下的殘留應力———————————056 2—5—2—2 外加的機械應力——————————————————057 2—5—2—3 兩材料間熱膨脹係數不同所產生的熱應力———————057 2—5—2—4 電致遷移所產生的原子堆積應力———————————059 2—5—2—5 材料化學反應所產生的化學應力與氧化膜理論—————060 2—5—3 含稀土元素銲錫之異常錫鬚成長概述———————————062 2—5—4 抑制錫鬚成長的原理與方式———————————————064 2—6 添加鍺元素對無鉛銲錫的影響————————————————066 參、實驗方法———————————————————————————107 3—1 銲錫合金的配製——————————————————————107 3—1—1 稀土母合金配製————————————————————107 3—1—2 各種成份之錫銀銅銲錫合金配製—————————————109 3—2 各種成份之銲錫合金的材料性質實驗—————————————109 3—2—1 X光繞射儀分析————————————————————109 3—2—2 光學顯微鏡之微結構觀察————————————————110 3—2—3 掃瞄式電子顯微鏡之微結構觀察—————————————110 3—2—4 電子微探儀分析————————————————————111 3—2—5 拉伸試驗———————————————————————111 3—2—6 維克式微硬度機分析——————————————————112 3—2—7 示差掃瞄熱卡儀分析——————————————————112 3—2—8 潤濕角實驗——————————————————————112 3—2—9 穿透式電子顯微鏡分析—————————————————113 3—2—10 錫鬚觀察——————————————————————114 3—3 球格陣列構裝上之銲錫接點性質實驗—————————————115 3—3—1 球格陣列構裝試片準備—————————————————115 3—3—2 球格陣列構裝之銲錫接點界面反應觀察——————————116 3—3—3 球格陣列構裝之銲錫接點強度試驗————————————116 3—3—3—1 推球強度試驗———————————————————117 3—3—3—2 拉球強度試驗———————————————————117 3—3—4 球格陣列構裝之銲錫接點硬度試驗————————————118 肆、結果與討論——————————————————————————134 4—1 稀土母合金中錫鬚成長之研究————————————————134 4—1—1 稀土母合金中稀土介金屬化合物(氧化物)之錫鬚觀察———134 4—1—2 稀土母合金中稀土介金屬化合物(氧化物)之截面氧化觀察—139 4—1—3 稀土母合金中稀土介金屬化合物(氧化物)產生之錫鬚形式—141 4—1—4 鈰元素之稀土母合金的穿透式電子顯微鏡觀察———————145 4—1—5 稀土母合金中稀土介金屬化合物(氧化物)之錫鬚成長機構—150 4—1—6 稀土母合金中錫鬚成長研究之結論————————————154 4—2 各種成份之錫銀銅銲錫合金之材料性質研究——————————202 4—2—1 各種成份之錫銀銅銲錫合金之微結構金相組織———————202 4—2—2 各種成份之錫銀銅銲錫合金之電子微探儀分析結果—————204 4—2—3 各種成份之錫銀銅銲錫合金之維克式微硬度試驗結果————206 4—2—4 各種成份之錫銀銅銲錫合金之拉伸試驗結果————————208 4—2—5 各種成份之錫銀銅銲錫合金之元素分佈分析結果——————216 4—2—6 各種成份之錫銀銅銲錫合金之錫鬚成長實驗結果——————220 4—2—7 各種成份之錫銀銅銲錫合金之稀土介金屬化合物截面觀察——227 4—2—8 各種成份之錫銀銅銲錫合金之潤濕角實驗結果———————231 4—2—9 各種成份之錫銀銅銲錫合金之示差掃瞄熱卡儀分析結果———235 4—2—10 各種成份之錫銀銅銲錫合金材料性質研究之結論—————239 4—3 各種成份之錫銀銅銲錫合金於球格陣列構裝上之研究——————311 4—3—1 化銀基板之界面反應研究————————————————311 4—3—1—1 Sn3Ag0.5Cu、Sn3Ag0.5Cu0.5Ce、Sn3Ag0.5Cu0.5La———311 4—3—1—2 Sn3Ag0.5Cu0.5CeXGe(X= 0.1、0.5、1.0)———————321 4—3—1—3 Sn3Ag0.5Cu0.5LaXGe(X= 0.1、0.5、1.0)———————325 4—3—2 化金基板之界面反應研究————————————————327 4—3—2—1 Sn3Ag0.5Cu、Sn3Ag0.5Cu0.5Ce、Sn3Ag0.5Cu0.5La———328 4—3—2—2 Sn3Ag0.5Cu0.5CeXGe(X= 0.1、0.5、1.0)———————336 4—3—2—3 Sn3Ag0.5Cu0.5LaXGe(X= 0.1、0.5、1.0)———————338 4—3—3 化銀基板與化金基板的構裝接點之機械性質研究——————340 4—3—3—1 Sn3Ag0.5Cu、Sn3Ag0.5Cu0.5Ce、Sn3Ag0.5Cu0.5La———340 4—3—3—2 Sn3Ag0.5Cu0.5CeXGe(X= 0.1、0.5、1.0)———————347 4—3—3—3 Sn3Ag0.5Cu0.5LaXGe(X= 0.1、0.5、1.0)與化銀基板——351 4—3—4 構裝接點之銲錫球觀察—————————————————353 4—3—4—1 Sn3Ag0.5Cu0.5RE1.0Ge之銲錫球缺陷觀察———————353 4—3—4—2 銲錫球之表面錫鬚觀察———————————————354 4—3—5 各種成份之錫銀銅銲錫合金於球格陣列構裝上研究之結論——356 伍、結論—————————————————————————————461 陸、參考圖表———————————————————————————466 柒、參考文獻———————————————————————————482 捌、作者簡介———————————————————————————497 | |
dc.language.iso | zh-TW | |
dc.title | 添加鍺對於含稀土錫銀銅銲錫之特性影響研究 | zh_TW |
dc.title | The Effect of Germanium Additions on the Properties of SnAgCu-RE Solder | en |
dc.type | Thesis | |
dc.date.schoolyear | 96-2 | |
dc.description.degree | 博士 | |
dc.contributor.oralexamcommittee | 林招松(Chao-Sung Lin),高振宏(C Robert Kao),吳春森,賴宏仁,洪健龍,王彰盟 | |
dc.subject.keyword | 無鉛銲錫,稀土元素,錫鬚,氧化,鍺元素,界面反應,接點強度, | zh_TW |
dc.subject.keyword | Pb-Free Solder,Rare-Earth Element,Tin Whisker,Oxidation,Germanium,Interfacial Reaction,Joint Strength, | en |
dc.relation.page | 506 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2008-07-18 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 材料科學與工程學研究所 | zh_TW |
顯示於系所單位: | 材料科學與工程學系 |
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