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標題: | 微結構蒸氣腔體之研究與電子散熱應用 Study of Micro Structure Vapor Chamber and Its Application in Electronic Cooling |
作者: | Yuan-Chin Chiang 江沅晉 |
指導教授: | 陳希立 |
關鍵字: | 微結構蒸氣腔體,沸騰表面,薄膜蒸發,LED, Micro Structure Vapor Chamber,Boiling Surfaces,Film Evaporation,LED, |
出版年 : | 2005 |
學位: | 博士 |
摘要: | 隨著電子產業的發展,電子產品不斷朝高性能、小尺寸方向邁進,伴隨而來的問題則是電子產品發熱量日趨愈高,傳統散熱方式已無法滿足未來高功率電子元件需求,有鑑於此;本研究藉由微結構蒸氣腔體,並以水做為工作流體,藉由工作流體於蒸氣腔體內沸騰(蒸發)與冷凝的兩相熱傳機制,而達到快速傳遞熱量的目的。本研究首先以實驗量測與理論分析方式進行微結構蒸氣腔體熱傳性能研究,接著並針對微結構蒸氣腔體於各種不同之應用進行討論與分析。研究結果發現;四種不同沸騰表面(光滑、蝕刻、溝槽與燒結表面),燒結板於填充量15%時:有最佳性能表現,且此時是以薄膜蒸發之熱傳機制進行熱傳遞,其餘沸騰表面之性能表現依序為溝槽、蝕刻與光滑平板。接著並以O’Neill所建立的理論,預測燒結板之沸騰熱傳係數,研究結果發現,理論與實驗值有相當吻合之趨勢,但在最佳填充量下,理論與實驗值有較大之誤差,探討其原因為燒結板在最佳填充量下之熱傳機制為薄膜蒸發,而O’Neill的理論為針對核沸騰熱傳機制所建立。最後則是針對毛細結構進行毛細極限實驗,並藉由實驗結果得到毛細結構之孔隙率(ε)、有效半徑(reff)與滲透度(K)。最後則是將微結構蒸氣腔體應用於各種不同之領域,包含了電子熱傳、LED散熱與PCB鑽孔機散熱系統之應用。於電子熱傳應用上,研究發現;微結構蒸氣腔體等效熱傳係數最大可達到銅的1.6倍,且均溫性較銅表現優異。於LED燈散熱應用上,研究發現;藉由蒸氣腔體優異的均溫性,的確可減少溫度集中現象,並使鋁基板的溫度維持在45℃。最後則是以微結構蒸氣腔體製作成一熱交換模組,並應用於PCB鑽孔機散熱系統,研究結果顯示,藉由此熱交換器模組可有效的回收冷卻空氣之能量,以減少系統所需冷凍能力,達到節約能源目的。 With the advance of the electronics industry, electronic products are getting higher performance and smaller size themselves. What happens is that the heat is generated accordingly. Traditional heat dissipation method can’t be satisfied the need of high-power electronic components. Therefore, this research makes use of the Vapor Chamber and with the water as the working fluid to transmit the heat; with the mechanism of Boiling (evaporation) and Condense of the working fluid in the Vapor Chamber to achieve the goal of rapid heat transmission. The research starts from the experimental measurement and the theoretical analysis of the heat transmission capability of the Vapor Chamber to the various applications of the Vapor Chamber. The result of the research on four different boiling surfaces, flat surface, grooved surface, etched surface, and sintered surface, it is discovered that sintered surface outperform the other three surfaces. The etched surface is second, the grooved surface is third, and the flat surface is the last. The sintered surface achieves the best performance while the fill ratio is 15%. And in the meanwhile its mechanism of the heat transmission is the Film Evaporation. Then O’Neill’s theory is used to predict the Boiling heat transfer coefficient while the sintered surface is used. The result of the research matches the theory and the experiment. However, under best fill ratio, there is a serious deviation between the theory and the experiment. The reason is that under best fill ratio the heat transfer mechanism of the sintered board is Film Evaporation while the heat transfer mechanism of O’Neill’s theory is for nucleate boiling heat transfer mechanism. Finally, we test the Capillary Limit on the sintered board. With this experiment, we get to know about the effective pore radius (reff) and permeability (k). Regarding to the applications, different applications of the Vapor Chamber are studied. In the respect of the electronic heat transfer application, effective thermal conductivity of the Vapor Chamber can be as 1.6 times high as copper and uniform temperature of the top and under surfaces of the Vapor Chamber outperform that of copper. In the respect of the LED heat dissipation application, because of the excellent uniform temperature of the Vapor Chamber, it did reduce the phenomenon of the thermal centralization and make the temperature of the aluminum board maintain at 45℃. Finally the Vapor Chambers are used in a heat exchange module and applied to the cooling system of the PCB driller. With the heat exchange module, the heat can be efficiently exchanged so as to reduce the power consumption of the cooling system and the energy conservation purpose can be also achieved. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/36037 |
全文授權: | 有償授權 |
顯示於系所單位: | 機械工程學系 |
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