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  1. NTU Theses and Dissertations Repository
  2. 工學院
  3. 材料科學與工程學系
請用此 Handle URI 來引用此文件: http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/35574
標題: 再摻雜聚苯乙烯-聚苯胺核殼型態奈米導電薄膜之製備
Preparation of Conductive films of Redoping Polyaniline-coated Polystyrene Latexes
作者: Pin-Fan Wang
王品凡
指導教授: 廖文彬(Wen-Bin Liau)
關鍵字: 核殼型態乳膠,聚苯胺,再摻雜,導電薄膜製備,
core-shell latex,polyaniline,depoing,redoping,conducting film,
出版年 : 2005
學位: 碩士
摘要: 本研究之目的在於,借由紫外光/可見光光譜的實驗,討論核殼型態聚苯乙烯-聚苯胺粒子在氨水中,聚苯胺的去摻雜反應,與聚苯胺在有機酸再摻雜反應之機制,並由FTIR判定核殼型態聚苯乙烯-聚苯胺粒子摻雜反應後之化學結構。
再嘗試以三種不同方式,進行核殼粒子中之聚苯胺的去摻雜與再摻雜,分別為在乳膠溶液中摻雜核殼粒子;浸泡溶液摻雜已堆積排列之核殼粒子;與浸泡溶液摻雜聚苯乙烯-聚苯胺之薄膜,討論三種方式再摻雜製作聚苯乙烯-聚苯胺導電薄膜之優缺點。得到再摻雜之聚苯乙烯-聚苯胺核殼粒子,經加熱使之成為導電薄膜,並以SEM觀察導電薄膜之形成,從量測電阻得到薄膜之導電率,與討論長時間在高溫環境下再摻雜薄膜之熱穩定性。
研究結果中以核殼堆積顆粒之再摻雜方式,可成功的得到具有更高導電率與熱穩定性之薄膜,且反應過程仍在水相中進行,再摻雜聚苯乙烯-聚苯胺之導電薄膜的製作也容易。
The purpose of this research is to discuss the mechanism of the PAni of PS/PAni core-shell is in a dedoping process in ammonium hydroxide and replaced with organic acids in a redoping process by using UV-Vis spectrum experiment. And PS/PAni chemical structure were changed after reaction were confirmed by the FTIR experiment.
Three different feasible ways to remove dopant and dope acid of the PAni of PS/PAni core-shell particle. Dedoping and redoping process of the PAni were PS/PAni core-shell latex in solution, PS/PAni core-shell packing immersed in solution, and PS/PAni thin film immersed in solution. After redoping process PS/PAni core-shell thin film were made by heat. And the film formation were observed by SEM. Beside this, the conductivity of film was convert by measured resistance and the thermal stability of film after redoping process were discussed in the high temperature by measuring the change of the resistance.
The result shows that redoping process in PS/PAni core-shell packing was developed higher conductivity and better thermal stability film. All of the reaction process still in water phase. And the preparation of PS/PAni conductive film is easily.
URI: http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/35574
全文授權: 有償授權
顯示於系所單位:材料科學與工程學系

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