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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 吳文方 | |
dc.contributor.author | Hsiang-Min Kang | en |
dc.contributor.author | 康翔閔 | zh_TW |
dc.date.accessioned | 2021-06-13T06:44:05Z | - |
dc.date.available | 2017-12-31 | |
dc.date.copyright | 2011-07-29 | |
dc.date.issued | 2011 | |
dc.date.submitted | 2011-07-24 | |
dc.identifier.citation | 1. C. E. Ebeling, An Introduction to Reliability and Maintainability Engineering, McGraw-Hill, 1997.
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dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/35207 | - |
dc.description.abstract | 要在短時間內瞭解如電子連接器等電子元件之可靠度特性,常需以加速試驗取得產品之失效壽命,而後再進行可靠度分析與評估。本研究為瞭解某廠商所設計之2-mm Hard Metric Connector連接器端子之可靠度,特別針對同型但不同鍍層厚度之端子連接器實施不同複合應力加速壽命試驗,而後透過迴歸分析求取連接器端子在加速環境下之壽命,接著藉由加速模型,將端子於加速環境下之壽命反推至正常環境下之壽命,最後搭配可靠度相關理論評估此型連接器端子之可靠度指標。有別於許多加速試驗僅探討兩種加速應力因子對試驗產品的影響,本研究考慮三種以上的加速應力因子,並將加速模型改寫成為高自由度的一種Generalized Log-Linear (GLL)模型,做為分析的依據。分析結果顯示,所探討的連接器端子對於插拔有很高的耐久度,但無法承受高溫造成的影響。透過加速模型,本論文發現在溫度45℃、使用插拔次數50次、MFG倍率為0.5的使用環境下,鍍層50微英吋之端子平均失效時間為595,760小時,相當於68.01年;鍍層40微英吋之端子平均失效時間為600,584小時,相當於68.56年;鍍層30微英吋之端子平均失效時間為490,151小時,相當於55.95年;鍍層20微英吋之端子平均失效時間為415,537小時,相當於47.46年。以上結果顯示,本研究所探討之連接器端子無論在何種鍍層下,均具有相當高的可靠度。 | zh_TW |
dc.description.abstract | In order to understand the reliability characteristics of electronic device, such as electronic connector, researchers often use accelerated life test to obtain the life of products, and then analyze and assess the reliability of products. In this study, to understand the reliability properties of 2-mm Hard Metric Connector, the accelerate life tests with multiple stress factors were conducted for different types of plating thickness of connector pins. After the test, life of connector pins in accelerated life test is analyzed with regression analysis, and the results are used to extrapolate the life in normal environment by acceleration model. Finally, the reliability index of connector pins with reliability theory is evaluated. Unlike many accelerated tests that only cover the impact of products by two acceleration factors, three and more types of acceleration factor are included in this study. For this reason, the common acceleration model is transformed to Generalized Log-Linear (GLL) model with high degree of freedom which this study is based. According to the analysis results, it is found that these types of connector pins have a high durability for plugging and unplugging, but cannot endure the impact of high temperature. The prediction for connector pins life in normal operated condition with temperature of 45 ℃, durability cycles of 50, and MFG rate of 0.5, the life of 50 μ' plating thickness is 595,760 hours, the 40 μ' plating thickness is 600,584 hours, the 30 μ' plating thickness is 490,151 hours, and the life of 20 μ' plating thickness is 415,537 hours. As a result, no matter what the plating thickness of connector pins is, all of them have very high reliability in this study. | en |
dc.description.provenance | Made available in DSpace on 2021-06-13T06:44:05Z (GMT). No. of bitstreams: 1 ntu-100-R98522519-1.pdf: 3468475 bytes, checksum: 6d2648409ee351ae62ceb02866205bf7 (MD5) Previous issue date: 2011 | en |
dc.description.tableofcontents | 致謝 I
摘要 II Abstract III 目錄 IV 表目錄 VII 圖目錄 IX 符號說明 XII 第一章 緒論 1 1-1 研究背景與動機 1 1-2 文獻回顧 2 1-3 研究流程 3 1-4 論文架構 3 第二章 連接器介紹 6 2-1 設計流程 6 2-2 連接器之結構與主要特性 6 2-2-1 連接器之結構 6 2-2-2 機械特性 7 2-2-3 電氣特性 8 2-3 連接器的失效緣由與失效準則 9 2-3-1 失效緣由 9 2-3-2 失效準則 10 第三章 應用理論概述 13 3-1 可靠度與相關理論 13 3-1-1 可靠度數學模型 13 3-1-2 連續機率分布 15 3-1-3 機率點圖 19 3-1-4 卡方適配度檢定 21 3-1-5 蒙地卡羅模擬法 22 3-2 迴歸分析 22 3-2-1 簡單線性迴歸分析 23 3-2-2 複迴歸分析 28 3-2-3 簡單非線性迴歸分析 29 3-3 加速壽命測試及其相關模型介紹 30 3-3-1 阿瑞尼士模型 31 3-3-2 艾琳模型 32 3-3-3 派克模型 33 3-3-4 羅森模型 34 3-3-5 反乘冪模型 35 3-3-6 T-H 模型 35 3-4 加速模型之高自由度型式 36 第四章 加速試驗內容簡介 42 4-1 試驗目的 42 4-2 試驗設備簡介 42 4-3 試驗樣品規格 43 4-4 試驗流程 43 4-5 試驗環境細節設定 43 第五章 試驗數據分析 51 5-1 求取連接器端子於加速環境應力下之壽命 51 5-2 時間比例參數 52 5-3 複合應力之加速模型 54 5-4 反推至正常環境下之端子壽命與可靠度指標 55 5-5 連接器端子位置與壽命之關係 57 第六章 結論與未來展望 108 6-1 結論 108 6-2 未來展望 109 參考文獻 110 | |
dc.language.iso | zh-TW | |
dc.title | 以高自由度加速模型評估電子元件之可靠度 | zh_TW |
dc.title | Reliability Assessment of Electronic Devices Based on a High-Degree-of-Freedom Acceleration Model | en |
dc.type | Thesis | |
dc.date.schoolyear | 99-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 許芳勳,施文彬 | |
dc.subject.keyword | 電子連接器端子,可靠度,加速試驗,加速模型,複合應力,迴歸分析, | zh_TW |
dc.subject.keyword | connector pins,reliability,accelerated test,acceleration model,multiple stress,regression analysis, | en |
dc.relation.page | 113 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2011-07-25 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
顯示於系所單位: | 機械工程學系 |
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