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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 吳瑞北(Ruey-Beei Wu) | |
dc.contributor.author | Chien-Lin Wang | en |
dc.contributor.author | 王健霖 | zh_TW |
dc.date.accessioned | 2021-06-13T05:48:22Z | - |
dc.date.available | 2007-07-20 | |
dc.date.copyright | 2006-07-20 | |
dc.date.issued | 2006 | |
dc.date.submitted | 2006-07-07 | |
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[2] Y. Chen, Z. Wu, A. Agrawal, Y. Liu, and J. Fang, “Modeling of delta-I noise in digital electronics packaging,” 1994 IEEE Multi-Chip Module Conf., pp. 126-131, Santa Cruz, CA, March 1994. [3] S. Van den Berghe, F. Olyslager, D. De Zutter, J. De Moerloose, and W. Temmerman, “Study of ground bounce caused by power plane resonances,” IEEE Trans. Electromagn. Compat., vol. 40, pp. 111-119, May 1998. [4] C. T. Wu, G. H. Shiue, S. M. Lin, and R. B. Wu, “Composite effects on reflections and ground bounce for signal line through a split power plane,” IEEE Trans. Adv. Packag., vol. 25, pp. 297-301, 2002. [5] R. K. Ulrich and L. W. Schaper, Integrated Passive Component Technology, New York:IEEE and Wiley Intersci., 2003. [6] J. M. Hobbs, H. Windlass, V. Sindaram, S. Chun, G. E. White, M. Swaminathan, and R. Tummala, “Simultaneous switching noise suppression for high speed systems using embedded decoupling,” Proc. 51st Electronic Comp. Technol. Conf., 2001, pp. 339-343. [7] C. T. Wu and R. B. Wu, “Two-dimensional finite- difference time-domain method combined with open boundary for signal integrity issues between isolation islands,” IEEE 11th Topical Meeting Elect. Perform. Electron. Packag., pp. 283–286. 2002. [8] Y. Jeong, H. Kim, J. Kim, J. Park, and J. Kim, “Analysis of noise isolation methods on split power/ground plane of multi-layer package and PCB for low jitter mixed mode system,” 2003 IEEE Proc. Topical Meeting on Electrical Performance of Electronic Packag., pp. 199-202, Oct. 2003. [9] J. S. Pak, J. Lee, H. Kim, and J. Kim, “Prediction and verification of power/ground plane edge radiation excited by through-hole signal via based on balanced TLM and via coupling model,” 2003 IEEE Proc. Topical Meeting on Electrical Performance of Electronic Packag., pp. 181-184, Oct. 2003. [10] R. Abhari and G. V. Eleftheriades, “Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of parallel-plate noise in high-speed circuits,” IEEE Trans. Microwave Theory Tech., vol. 51, pp. 1629-1639, June 2003. [11] T. Kamgaing and O. M. Ramahi, “A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface,” IEEE Microwave Wireless Comp. Lett., vol. 13, pp. 21-23, Jan. 2003. [12] T. L. Wu, Y. H. Lin, and S. T. Chen, “A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic band-gap structures, ” IEEE Microw. Compon. Lett., vol. 14, no. 7, pp. 337–339, Jul. 2004. [13] T. L. Wu, C. C. Wang, Y. H. Lin, T. K. Wang, and George Chang, “A Novel Power Plane With Super-Wideband Elimination of Ground Bounce Noise on High Speed Circuits,” IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, VOL. 15, NO. 3, MARCH 2005 [14] T.L. Wu, T.K. Wang, ,”Embedded power plane with ultra-wide stop-band for simultaneously switching noise on high-speed circuits,” IEE Electronics Letters , Vol. 42, pp. 213 – 214, Feb. 2006 [15] D.Pozar, Microwave Engineering, 2nd ed., New York: Wiley, 1998. [16] S.V. den Berghe, F. Olyslager, D. De Zutter, J De Moerloose, and W. Temmerman, “Study of the ground bounce caused by power planes resonance,” IEEE Trans. Electromagn. Compat., vol. 40, no.2, pp.111-119, May 1998. [17] K.B. Wu, A.S. Liu, G.H. Shiue, C.M Lin, R.B. Wu, “Optimization for the locations of decoupling capacitors in suppressing the ground bounce by Genetic Algorithm', Progress in Electromagnetics Research Symposium (PIERS), Hangzhou, China (2005). [18] Jinwoo Choi; Govind, V.; Swaminathan, M.; “Noise Suppression in Ultra Wide Band (UWB) Applications Using Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structures,” 2005 IEEE Proc. Topical Meeting on EUMC, Vol. 3, Oct. 4-6, 2005. [19] D. Sievenpiper, L. Zhang, R. F. Jimenez Broas, N. G. Alexopolous, and E. Eli Yablonovitch, “High-impedance electromagnetic surfaces with a forbidden frequency band,” IEEE Trans. Mircowave Theory Tech., vol. 47, pp. 2059 – 2073, Nov. 1999. [20] L. Yang, Z. Feng, F. Chen, and M. Fan “A novel compact electromagnetic band-gap(EBG) structures and its application in microstrip antenna arrays,” IEEE Trans. MTT, vol 53, pp. 183-190, Jan. 2005. [21] S. Shahparnia and O. M. Ramahi, “Simple and accurate circuit models for high-impedance surfaces embedded in printed circuit boards,” IEEE Antenna Propagat. Symposium 2004. [22] H.W.Johnsonand M. Graham, High-Speed Signal Propagation: Advanced Black Magic, Prentice Hall, 2003. ch.5. [23] 孫瑞伯,多層連通柱結構的等效模型擷取與時域分析,國立台灣大學碩士論文, 2004年6月. [24] Ansoft, High Frequency Structure Simulator, Version 9.1 (www.ansoft.com). [25] Shahrooz Shahparnia, and Omar M. Ramahi, “A Simple and Effective Model for Electromagnetic Bandgap Structures Embedded in Printed Circuit Boards” IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, VOL. 15, NO. 10, Oct. 2005. [26] J. Lee, H. Kim, and J. Kim, “High dielectric constant thin flim EBG power/ground network for broadband suppression of SSN and radiation emissions,” IEEE Microwave Wireless Comp. Lett., vol. 15, pp. 505-507, Aug. 2005. [27] S. Shahparnia and O M Ramahi, “Miniaturized electromagnetic bandgap structures for ultra-wide band switching noise mitigation in high-speed printed circuit boards and packages,” IEEE 13th Topical Meeting Elect. Perform. Electro. Packag., Oct. 2004, pp. 211-214. [28] Microwave Studio, Version 5.1, (www.cst.com). [29] Guang Chen, Kathleen Melde, and John Prince, “The Applications of EBG structures in Power/Ground plane pair SSN suppression,” in Proc. 13th Topical Meeting on EPEP , Oct.25-27 2004, pp.207-210 [30] R.B.Wu, “Resistance Computations for Multi-layer Packaging Structures by Applying the Boundary Element Method,” IEEE Trans. Comp. , Hybrids , Manuf . , Technol. , vol.15, no.1, pp. 87-96, Jan.1992 [31] 2004年英業達公司建教合作專題研究計畫期末報告第三章微分電壓降 | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/33893 | - |
dc.description.abstract | 對於內嵌式電磁能隙結構(Embedded Electromagnetic Band-Gap)的設計,本論文實現一寬頻接地雜訊的抑制方法於槽線結構以及去耦合電容的電路佈局上。其主要是利用串接多種不同設計頻帶的EBG結構來達成抑制特定槽線耦合雜訊以及去耦合電容無法抑制高頻雜訊的效果;並且,也提出縮小化的螺旋型EBG的結構來達成接地雜訊抑制的效果。
在本文中,為了能夠有效率與系統地設計EBG結構,修正的連通柱電感公式、螺旋縮小化結構的設計圖表、截止帶頻帶邊緣的設計公式以及有效結構的佈局面積,皆在本文中有詳細的討論。並且,利用此一系統化的設計與分析流程,可大幅節省全波模擬軟體所需的運算時間,以更有效且方便的設計方法,來針對所欲抑制的雜訊頻率設計符合規格的EBG結構, 使其能夠更為方便的應用於高速數位電路電磁系統的設計上。 同時,對於另一種常用於寬頻接地雜訊抑制的低週期共平面式電磁能隙結構(Low Periodic Coplanar Photonic Band-Gap),本文也針對四種已被提出的PBG架構,討論其應用在高速數位電路之電氣系統的設計時容易造成之電阻壓降(IR-drop)與迴流平面不連續的兩大主要問題。並且,分析不同結構的佈局方式對於高速電磁系統的訊號完整性與電源完整性所會造成的影響與考量,以進一步了解不同PBG結構對於整個電氣系統佈局的穩定 性,以及探討相關設計上的優缺點。 | zh_TW |
dc.description.abstract | Embedded Electromagnetic Band-Gap-enhanced structures for the ultra-wide band noise suppression on split power/ground planes, signal line crossing slot, and decoupling capacitor combination are proposed, designed, examined, and validated. Using the concept of cascading EBG structures with the different stop-band frequencies and band-edge estimation, the coupling noise between isolation islands can be significantly reduced. A compact size can also be achieved by spiral EBG structures with increasing number of turns to save the occupied area. For the ease and accuracy in the design of EBG structures, the modified inductance formula, the design diagram of spiral EBG structures, and the effective occupied area of EBG structures are also presented. A systematic design procedure is established and based on which, the design of EBG structures for suppressing undesired frequencies becomes more
convenient, without resorting to the time-consuming full-wave simulator. In addition to the analysis for Embedded EBG structure, the application of Low Periodic Coplanar Photonic Band-Gap structure is discussed in this thesis. LPC-PBG structure is well-known for a good and wide-band ground-bounce reduction, but two main issue of signal integrity including the IR-drop and return path destruction are needed to be reconsidered in a high-speed digital circuit. Thus, some proposed PBG structures are discussed and analyzed with the design of power distribution network, for which the power integrity and signal integrity problem are taken into account. | en |
dc.description.provenance | Made available in DSpace on 2021-06-13T05:48:22Z (GMT). No. of bitstreams: 1 ntu-95-R93942010-1.pdf: 4463100 bytes, checksum: 3b8abcd8167b311729b00504cb4d47b7 (MD5) Previous issue date: 2006 | en |
dc.description.tableofcontents | 目 錄
第一章 研究動機與簡介............................... 1 1-1 研究動機..................................... 1 1-2 文獻回顧..................................... 2 1-3 章節概要..................................... 3 1-4 貢獻......................................... 4 第二章 接地雜訊的抑制............................... 6 2-1 高速數位電路接地雜訊現象與原因.............. 6 2-2 接地雜訊的抑制方法與比較.................... 8 2-3 電磁能隙結構簡介............................ 9 2-3-1 共平面式電磁能隙結構對於接地雜訊的抑制.. 9 2-3-1 內嵌式電磁能隙結構對於接地雜訊的抑制.... 11 第三章 電磁能隙結構基本設計方法..................... 18 3-1 內嵌式EBG結構設計概念....................... 18 3-2 縮小化螺旋式EBG結構......................... 20 3-3 等效電路模型與止帶設計...................... 22 3-4 內嵌式EBG結構設計流程圖......................... 28 第四章 電磁能隙結構參數分析與有效面積設計........... 39 4-1 幾何參數分析與討論.......................... 39 4-2 有效面積對抑制雜訊的影響.................... 45 4-3 內嵌式電容與螺旋縮小化結構的結合............ 47 第五章 電磁能隙結構於抑制寬頻雜訊之應用.............. 56 5-1 開槽平行板寬頻雜訊抑制...................... 56 5-2 訊號線跨槽線引發雜訊的改善.................. 60 5-3 結合去耦合電容最佳化的方法.................. 62 5-4 實驗模擬與驗證.............................. 65 第六章 低週期共平面式電磁能隙結構................... 81 6-1 共平面式PBG結構對於接地雜訊的抑制............... 81 6-2 電源層壓降問題的分析............................ 83 6-3 迴流平面破壞與訊號完整度的探討.................. 88 6-4 實驗模擬與驗證.................................. 91 第七章 結論......................................... 113 參考文獻.............................................. 115 | |
dc.language.iso | zh-TW | |
dc.title | 利用電磁能隙結構達成寬頻接地雜訊抑制之系統化設計 | zh_TW |
dc.title | A Systematic Design to Suppress Wideband Ground Bounce Noise In High-Speed Circuits by EBG-Enhanced Structures | en |
dc.type | Thesis | |
dc.date.schoolyear | 94-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 郭建男(Chien-Nan Kuo),林建民(Chien-Min Lin),吳宗霖(Tzong-Lin Wu) | |
dc.subject.keyword | 電磁能隙結構,低週期共平面式電磁能隙結構,電阻壓降,訊號完整度,電源完整度,接地雜訊, | zh_TW |
dc.subject.keyword | Embedded Electromagnetic Band-Gap,Low Periodic Coplanar Photonic Band-Gap,IR-drop,Signal integrity,Power integrity,Ground bounce noise, | en |
dc.relation.page | 118 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2006-07-11 | |
dc.contributor.author-college | 電機資訊學院 | zh_TW |
dc.contributor.author-dept | 電信工程學研究所 | zh_TW |
顯示於系所單位: | 電信工程學研究所 |
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