請用此 Handle URI 來引用此文件:
http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/33639
完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 謝國煌(Kuo-Huang Shieh) | |
dc.contributor.author | Fu-Sheng Ko | en |
dc.contributor.author | 柯富升 | zh_TW |
dc.date.accessioned | 2021-06-13T05:44:05Z | - |
dc.date.available | 2008-07-27 | |
dc.date.copyright | 2006-07-27 | |
dc.date.issued | 2006 | |
dc.date.submitted | 2006-07-14 | |
dc.identifier.citation | 1. S. Hamilton, “EMI Shielding for Plastic Encolsures”, New Electronics, Vol.28, pp.22 (1987)。
2. 劉有台, “電磁遮蔽性:紡織品之發展與應用”, 化工資訊月刊, 9, pp.66 (2002)。 3.天笠啟祐,電磁波的夢魘 ,pp.40(1997)。 4. 黃振燦, “塑膠導電及電磁干擾之遮屏”, 塑膠資訊, Vol.8, pp.51 (1998) 5.R. M. Gresham, ”EMI/RFI Shielding of Plastics”, Plat. and Sur. Fin., February, pp.63 (1988)。 6.G. G. Bush,“Measurement Techniques for Permeability, Permittivity and Emi Shielding: A Review”, IEEE, pp.333 (1994)。 7. W. Graf and E. F. Vance,“ Shielding Effectiveness and Electromagnetic Protection”, IEEE Trans. Ele. Comp. Vol.30, No.3, pp.289 (1988)。 8. 針谷 學藏,'防電磁波干擾材料電磁波之評估方法上效果', 日本工業材料,pp. 22 (1989)。 9. R.B. SchulZ, V.C.Plantz and D.R. Brush,'Shielding Theory and Practice',IEEE, pp.187 (1988)。 10. 塚田憲一, 工業材料(日), Vol. 44, No.9, pp.56 (1996)。 11. 沈永清, 化工資訊, vol.10 (1999)。 12. P. France,“EMI Shielding-Conductive Plastics and Elastomers,'Innovation pp.128 (1987)。 13.黃淑禎, “液晶顯示器(LCD)構裝用導電膠材料技術與應用,” 工業材料,155 期, pp. 159(1999)。 14.Endo, Yasuhiro, Kagami, Yasuo, Maruyama, Toru, Kodama, Kazunari, U.S. Patent NO.6165386(2000)。 15. Jose, J. and Khadar, M.A., ”Role of grain boundaries on the electrical properties of ZnO-Ag nanocomposites:an impedance spectroscopic study”Acta Materials, Vol.49,pp. 729(2001)。 16.路慶華和和田弘,” 新型導電膠的研究(I)”,功能材料,Vol.28,pp. 546(1997)。 17.Inada, T. and Wong, C. P., “Fundamental Study on Adhesive Strength of Electrical Conductive Adhesives (ECAs),” 1998 Proceedings of 4th International Symposium on Advanced Packaging Materials, Chateau Elan, Braselton, Georgia, pp.268( 1998)。 18.Li, L. and Morris, J. E., “Electrical Conduction Models for Isotropically Conductive Adhesive Joints,” IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part A, Vol.20, No.1, pp.3(1997) 19. Lu, D. and Wong, C. P., “Effects of Shrinkage on Conductivity of Isotropic Conductive Adhesives,” International Journal of Adhesion & Adhesives, Vol.20, pp.189(2000)。 20. Ye Lilei, Lai Zonghe, Liu Johan,” Effect of Ag Particle Size on Electrical Conductivity of Isotropically Conductive Adhesives”, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 22(1999)。 21.Kim, H.K. and Shi, F.G., ” Electrical reliability of electrically conductive adhesive joints:dependence on curing condition and current density”, Microelectronics Journal ,vol.32, pp. 315(2001)。 22.陳素貞, 石燕鳳, “亞克力樹脂/環氧樹脂互穿網狀結構之研究”, 樹德學報, Vol. 16, pp. 29-58(1995)。 23. Decker, C., Zahouily, K., Decker, D., Nguyen, T., and Thi Viet, “Performance of acylpphosphine oxides in photoinitiated polymerization”, Polymer, Vol.42, pp. 7551(2001)。 24. Segurola, J., Allen, N. S., Edge, M., McMahon , A., and Wilson, S.,“Photoyellowing and discolouration of UV cured acrylated clear coatings systems: influence of photoinitiator type”, Polymer Degradation and Stability,64, pp. 39(1999)。 25.Fouassier, J. P., Photoinitiation, photopolymerization, and photocuring: fundamentals and application, Hanser publishers, Munich Vienna New York(1995)。 26.羅介聰,”混鍊程序對於導電膠導電性的影響”,國立清華大學化學工程研究所碩士論文(2000)。 27.Trypson, G. R. and Shultz, A. R., “A calorimetric study of acrylate photopolymerization”, J. Polym. Sci. Polym. Phys. Edn, Vol.17, pp. 2059(1979)。 28.Tan, Y. Y. and Doornkamp, A. T., “Kinetic study of the ultraviolet-initiated polymerization of a polyester ureathane diacrylate by differential scanning calorimetry”, Polymer communications, Vol.31, pp. 362 (1990)。 29.Andrzejewska, E. and Andrzejewski, M. A., “Polymerization kinetics of photocurable acrylic resins”, J. Polym. Sci., Part A Polym Chem, Vol.36, pp. 665(1998)。 30.Dietz, J. E. and Peppas, N. A., “Reaction kinetics and chemical changes during polymerization of multifunctional (meth)acrylates for the production of highly crosslinked polymers used in information storage systems”, Polymer, Vol.38, pp. 3767 (1997)。 31.Doornkamp, A. T. and Tan, Y. Y., “Kinetic study of the uv-initiated polymerization of polyester urethane diacrylate by differential scanning calorimetry”, Polymer Communications, Vol.31, pp. 362( 1990)。 32.Trypson, G. R. and Shultz, A. R., “A calorimetric study of acrylate photopolymerization”, J. Polym. Sci. Polym. Phys. Edn, Vol.17, pp. 2059 (1979)。 33.柯以侃和吳明珠, 儀器分析第十五章-熱分析法,文京圖書有限公司(1999)。 34.羅聖全,江正誠,林智仁,陳淑貞,林麗娟和洪健龍, ”電子顯微鏡試片製備技術總論”,工業材料, No.206, pp. 150(2004)。 35.何正恩和高振宏, ”SEM/EDS的原理與操作應用之簡介”,化工技術,No.11, pp. 102(2003)。 36. 林敬二和林宗義,”儀器分析”,雅美出版社(1994)。 37. 方向威, “材料測試與分析”, 五南出版社(2002)。 38.Gong,Yang,Kan,”Magnetoresisitivity Measurement of Magnetic Film”, Journal of Shanghai University(Natural Science),vol.5, pp.200(1999)。 39.Sze, S. M., “Semiconductor Devices Physics and Technolgy”, John Wiley&Sons, New York(1985)。 | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/33639 | - |
dc.description.abstract | 本研究是以製作具有導電度並且可微影的電磁波屏蔽材料。採用的兩種方式;方法一將微米級之銀粉以不同比例與紫外光可硬化樹脂摻,並混塗佈於PET薄膜作成具有電磁波屏蔽效果之薄膜。方法二使用表面改質技術將表面接支成具有的特殊官能基(-SH),再利用自組裝方式將銀還原吸附於表面而得奈米銀薄膜。方法一的製作過程需要克服的問題為如何使銀粉分散於環氧丙烯酸脂基材中。本研究中先以機械攪拌的方式將不同比例的環氧壓克力樹脂加入不同量的銀粉經由球磨混鍊機將銀粉均勻分散於樹脂中,將所得到的銀膠塗佈於PET薄膜上。當銀粉在樹脂中的含量為72%時可得到表面電阻約1.162Ω/cm2之薄膜。而於方法二的製作過程需確認表面是否經過改質而使其具有吸咐銀粒子的官能基(-SH)。使用自組裝所製得的導電薄膜其表面電阻約為0.799Ω/cm2。改變光罩圖案後經不同製程可製備出不同的導電線路,觀察其電磁波屏蔽的效果。 | zh_TW |
dc.description.abstract | Two synthesis methods of conductive materials were developed in EMI shielding field. The first one was prepared by the blending of silver and epoxy acrylate at different ratios. Via the lithography process, the various silver contents of conductive resin films were cured by UV-light on the PET film. The lowest surface resistance of 1.162Ω/cm2.was achieved via the method. The second conductive material was based on the self-assembly method to develop a conductive film. The colloidal silver was self-assembling onto the silane-modified surface through the –SH group of the MPS, and the adhesive force between the glass microscope slide and silver could be improved obviously. The lowest surface resistance of 0.799Ω/cm2 was achieved via the method.Two kinds of conductive materials were transfer to various pattern forms and the EMI properties of each pattern films were investigated. | en |
dc.description.provenance | Made available in DSpace on 2021-06-13T05:44:05Z (GMT). No. of bitstreams: 1 ntu-95-R93549019-1.pdf: 10232663 bytes, checksum: cc42a4ad77485d56fe4cdb12a3d2ddf8 (MD5) Previous issue date: 2006 | en |
dc.description.tableofcontents | 中文摘要…………………………………………………………………I
英文摘要 ………………………………………………………………II 目錄……………………………………………………………………Ⅲ 表目錄………………………………………………………………Ⅶ 圖目錄 …………………………………………………………………Ⅸ 第一章 緒論 ……………………………………………………………1 第二章 文獻回顧 ………………………………………………………4 2-1電磁波 ………………………………………………………4 2-1-1 電磁波的危害…………………………………………4 2-1-2 電磁波防治對策………………………………………5 2-1-3 電磁波遮蔽方式………………………………………6 2-1-4 電磁波遮蔽與吸收材料………………………………8 2-2 導電性黏著劑………………………………………………14 2-2-1 壓克力樹脂之光硬化反應 …………………………21 2-2-2 光起始劑…………………………………………….23 2-2-3 反應性單體 …………………………………………25 2-3 導電粒子分散技術…………………………………………25 第三章 實驗方法………………………………………………………28 3-1實驗藥品……………………………………………………28 3-1-1銀粉部分………………………………………………28 3-1-2紫外光可硬化樹脂部份………………………………28 3-2 實驗設備……………………………………………………32 3-3 實驗流程……………………………………………………34 3-3-1 實驗總流程 …………………………………………34 3-3-2 紫外光可硬化樹脂製備 ……………………………35 3-3-3 紫外光可硬化導電銀膠之製備……………………36 3-3-4 微影定義線路圖案 …………………………………37 3-3-5 奈米銀粒子自組裝 …………………………………38 3-3-5-1奈米銀粒子自組裝製作導電薄膜……………38 3-3-5-1奈米銀粒子自組裝製作導電線路……………38 3-4實驗步驟……………………………………………………39 3-4-1 導電銀膠部份………………………………………39 3-4-1-1合成感光性紫外光可硬化樹脂………………39 3-4-1-2 感光性膠體的配製 …………………………39 3-4-1-3導電銀膠的配備………………………………40 3-4-1-4導電薄膜之製備 ……………………………42 3-4-1-5 微影製程 ……………………………………42 3-4-2 以自組裝方式製備奈米銀導電薄膜………………43 3-4-2-1 導電薄膜的製備 ……………………………43 3-4-2-2 導電線路……………………………………43 3-5性質測試 …………………………………………………44 第四章 結果討論………………………………………………………47 4-1 導電銀膠部份………………………………………………47 4-1-1紫外光可硬化樹脂之製備與特性分析………………47 4-1-1-1 化學結構分析 ………………………………47 4-1-1-2 FTIR光譜分析…………………………………47 4-1-1-3 GPC分子量分析………………………………49 4-1-2導電銀薄膜性質分析…………………………………49 4-1-2-1 銀粒子性質分析 ……………………………49 4-1-2-2 塗膜熱性質分析 ……………………………50 4-1-2-3 導電銀薄膜表面分析………………………52 4-1-2-4 表面電阻測定 ………………………………53 4-1-3 微影製程分析………………………………………56 4-1-3-1線路圖案轉移結果分析………………………56 4-2 自組裝奈米銀薄膜部份……………………………………58 4-2-1表面型態學分析………………………………………58 4-2-2 接觸角的測試 ………………………………………59 4-2-3 表面電阻的測試 ……………………………………61 4-3 電磁波屏蔽測試……………………………………………62 第五章 結論……………………………………………………………65 第六章 參考文獻………………………………………………………68 | |
dc.language.iso | zh-TW | |
dc.title | 可微影電磁波屏蔽材料之開發與研究 | zh_TW |
dc.title | Studies on UV-curable conductive materials for EMI shielding | en |
dc.type | Thesis | |
dc.date.schoolyear | 94-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 邱文英(Wen-Yen Chiu),江孟丹(Meng-Dan Jiang),王怡仁 | |
dc.subject.keyword | 紫外光可硬化,導電膠,自組裝,電磁波屏蔽, | zh_TW |
dc.subject.keyword | UV-curable,conductive paste,self-assembly,EMI shielding effectiveness, | en |
dc.relation.page | 115 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2006-07-17 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 高分子科學與工程學研究所 | zh_TW |
顯示於系所單位: | 高分子科學與工程學研究所 |
文件中的檔案:
檔案 | 大小 | 格式 | |
---|---|---|---|
ntu-95-1.pdf 目前未授權公開取用 | 9.99 MB | Adobe PDF |
系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。