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  1. NTU Theses and Dissertations Repository
  2. 工學院
  3. 應用力學研究所
請用此 Handle URI 來引用此文件: http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/31795
完整後設資料紀錄
DC 欄位值語言
dc.contributor.advisor張培仁(Pei-Zen Chang)
dc.contributor.authorTsung-Hua Ouen
dc.contributor.author歐宗樺zh_TW
dc.date.accessioned2021-06-13T03:20:26Z-
dc.date.available2006-07-31
dc.date.copyright2006-07-31
dc.date.issued2006
dc.date.submitted2006-07-28
dc.identifier.citation[1] V. Leus and D. Elata, Fringing Field Effect in Electrostatic Actuators: Technion, 2004.
[2] H. B. Palmer, 'Capacitance of a parallel-plate capacitor by the Schwartz- Christoffel transformation,' Trans. AIEE, Vol. 56, pp. 363, March 1927.
[3] R. S. Elliott, 'Electromagnetics,' pp. 182-189, 1966.
[4] F. R. Morgenthaler, “Theoretical Studies of Microstrip Antennas, Volume 1: General Design Techniques and Analyses of Single and Coupled Elements”, U.S. Department of Transportation, Federal Aviation Administration Report No. FAA-EM-79-11, I, September 1979.
[5] W. H. Chang, 'Analytic IC-metal-line capacitance formulas,' IEEE Trans. Microwave Theory Tech., Vol. MTT-24, pp. 608-611, 1976; also vol. MTT-25, p. 712, 1977.
[6] C. P. Yuan and T. N. Trick, 'A simple formula for the estimation of the capacitance of two-dimensional interconnects in VLSI circuits,' IEEE Electron Device Lett., Vol. EDL-3, pp. 391-393, 1982.
[7] T. Sakurai and K. Tamaru, 'Simple formulas for two- and three-dimensional capacitances, ' IEEE Trans. Electron Devices, Vol. ED-30, pp. 183-185, 1983.
[8] N. Van de Meijs and J. T. Fokkema, 'VLSI circuit reconstruction from mask topology,' Integration, Vol. 2, pp. 85-119, 1984.
[9] H. Yang, 'Microgyroscope and microdynamics,' Ph. D. Dissertation, December, 2000.
[10] W. H. Ko, Q. Wang, and Y. Wang, “Touch Mode Capacitive Pressure Sensors for Industrial Applications”, Proceedings of the 1996 Solid-State Sensor and Actuator Workshop, Hilton Head, SC, June 3-6, 1996, pp. 244-248.
[11] K. H.-L. Chau, S. R. Lewis, Y. Zhao, R. T. Howe, S. F. Bart, and R. G. Marcheselli, “An Integrated Force-Balanced Capacitive Accelerometer for Low-g Applications”, Proceedings of Transducers’ 95 • Eurosensors IX, Volume 1, Stockholm, SWEDEN, June 25-29, 1995, pp. 593-596.
[12] J. Bernstein, S. Cho, A. T. King, A. Kourepenis, P. Marciel, and M. Weinberg, “A Micromachined Comb-Drive Tuning Fork Gyroscope”, Digest IEEE/ASME MEMS Workshop, Ft. Lauderdale, FL, February 1993, pp. 143-148.
[13] T. S. Kim, S. S. Lee, Y. Yee, J. U. Bu, C. G. Park, and M. H. Ha, “Large Tilt Angle Electrostatic Force Actuated Micro-Mirror”, IEEE Photons Technology Lett., Vol. 14, pp. 1569-1571, 2002.
[14] Chienliu Chang and Peizen Chang (2000), “Innovative Micromachined Microwave Switch with Very Low Insertion Loss,” Sensors and Actuators A, Vol. 79, pp. 71-75. (SCI, EI)
[15] Yuh-Chung Hu, Wei-Hsiang Tu, “Non-linear and linearized algorithms for the Young’s modulus extraction of Thin Films through the C-V measurement of Microstructures,” J. Appl. Phys, Vol. 98, Issue 10, Articles 104504, 2005.
[16] K. Wang and C. T.-C. Nguyen, “High-Order Micromechanical Electronic Filters”, Tenth IEEE International Workshop on MEMS 1997, Nagoya, JAPAN, January 26- 30, 1997, pp 25-30.
[17] C. H. Ng, C. S. Ho, S. F. Chu, and S. C. Sun,“MIM Capacitor Integration for Mixed-Signal/RF Applications”, IEEE Trans. Electron Devices, Vol. 52, pp. 1399-1409, 2005.
[18] E. Bogatin, “Design Rules for Microstrip Capacitance”, IEEE Trans. on Components, Vol. 11, pp. 253-259, 1988.
[19] C. Y. Ng, T. P. Chen, L. Ding, M. Yang, J. I. Wong, P. Zhao, X. H. Yang, K. Y. Liu, M. S. Tse, A. D. Trigg, and S. Fung, “Influence of Si Nanocrystal Distributed in the Gate Oxide on the MOS Capacitance”, IEEE Trans. Electron Devices, Vol. 53, pp. 730-736, 2006.
[20] Wolfram MathWorld, URL: http://mathworld.wolfram.com/Agilent
[21] Technology URL: http://www.agilent.com
dc.identifier.urihttp://tdr.lib.ntu.edu.tw/jspui/handle/123456789/31795-
dc.description.abstract這份研究目標在於發展一能夠準確計算邊緣電容的方程式解。現今電容的感測以及靜電力驅動的元件已成熟地應用在微機電領域。因此,電容的設計以及預測準確度足以影響一元件的特性,所以可以得知邊緣電容的計算的挑戰性及重要性。目前許多研究已應用有限元素分析,取代準確度不足的分析模型,而這些有限元素法的應用早已植入在商用的套裝軟體當中,如ANSYS,COMSOL,CovnetorWare,和Intellisuite。雖然有限元素模型已成主流,但其尚有需要改進的缺失,如計算時間的需求長、計算機硬體的需求高等。更重要地,有限元素分析的解答並不能帶來任何物理上的意義,換句話說,這個電容值不能做其他物理上的運算,例如微分、積分等步驟,這也就是發展分析解的最主要目的及優勢。在研究中,先以簡單的平行板電容作為研究的對象,利用保角映射轉換以及一些方程式的近似法,推導一可以表達完整平行板電容的分析解。這個結果與數值模擬(Ansys)結果比較,只有不到百分之一的誤差,而與實驗值相比,也是非常接近。這個高精確度的分析解,相較於其他的方式更為便利,可以快速的計算出正確的結果。zh_TW
dc.description.abstractThis research aims at developing a general solution for calculating the capacitance of fringe field precisely. Capacitive sensing and electrostatic actuating devices are commonly used on microdevices. Therefore, determination of the capacitance is critical in the design to determine the performances of such devices. Accurate determination of capacitance is very challenging in virtue of the fringing field. The finite element method (FEM) is often used for calculating the capacitance as lacking precision analytical model. FEM has been implemented in various commercial MEMS simulation software such as ANSYS, COMSOL, CovnetorWare, and Intellisuite. However, FEM has the disadvantages of un-explicit physical meaning and requiring massive numerical calculations, and therefore is not easy to carry out the parametric study of capacitive devices. This research develops an analytical solution for calculating the three-dimensional fringe field capacitance of paralleled-plate-type capacitors, which is the commonest structure. The analytical solution is derived from the conformal mapping method and simplified by some approximate approaching techniques. The present analytical solution shows very high accuracy within one-percentage error comparing with the experimental results and the numerical simulation by ANSYS. By the present high precision analytical solution, one can easily evaluate the capacitance in few seconds by manual work.en
dc.description.provenanceMade available in DSpace on 2021-06-13T03:20:26Z (GMT). No. of bitstreams: 1
ntu-95-R93543023-1.pdf: 1498203 bytes, checksum: 34fe3f3361edb9ec3b133cb2b3c3cfe2 (MD5)
Previous issue date: 2006
en
dc.description.tableofcontents摘要 (中文) i
Abstract (英文摘要) iii
謝誌 v
目錄 vii
表目錄 ix
圖目錄 xi
Nomenclature (符號定義) xv
第一章:導論 1
1-1 文獻回顧 2
1-2 微元件電容應用之介紹 8
第二章:分析模型 9
2-1 理想電容公式 10
2-2 保角映射 12
2-3 幾何轉換機制 16
2-4 方程式之近似 19
2-5 無厚度平行板電容之電容萃取 20
2-6 真實厚度平行板電容之電容萃取 25
第三章:數值模擬模型 31
3-1 二維數值模型 32
3-2 三維數值模型 40
3-3 分析模型及數值模型之比較 44
第四章:實驗驗證 51
4-1 大尺度模型實驗設計 52
4-2 微結構實驗設計 55
4-3 量測 61
4-4 分析模型、數值模型以及實驗結果比較 71
第五章:結論 73
5-1 結果與討論 74
5-2 未來展望 75
文獻回顧
附錄
dc.language.isozh-TW
dc.subject微機電元件zh_TW
dc.subject邊緣電容zh_TW
dc.subject微機電電容zh_TW
dc.subject電容感測zh_TW
dc.subject保角映射轉換zh_TW
dc.subjectConformal Mappingen
dc.subjectFringe Field Capacitanceen
dc.subjectMicro-devicesen
dc.subjectMEMS Capacitoren
dc.subjectCapacitance Sensingen
dc.title微元件之邊緣電容研究zh_TW
dc.titleFringe Capacitance Analysis of Micro Devicesen
dc.typeThesis
dc.date.schoolyear94-2
dc.description.degree碩士
dc.contributor.oralexamcommittee胡毓忠,楊燿州,黃榮堂
dc.subject.keyword邊緣電容,微機電電容,電容感測,保角映射轉換,微機電元件,zh_TW
dc.subject.keywordFringe Field Capacitance,MEMS Capacitor,Capacitance Sensing,Conformal Mapping,Micro-devices,en
dc.relation.page98
dc.rights.note有償授權
dc.date.accepted2006-07-30
dc.contributor.author-college工學院zh_TW
dc.contributor.author-dept應用力學研究所zh_TW
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