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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
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dc.contributor.advisor | 陳立仁(Li-Jen Chen) | |
dc.contributor.author | Chio-Hao Hsu | en |
dc.contributor.author | 許志豪 | zh_TW |
dc.date.accessioned | 2021-06-13T02:02:52Z | - |
dc.date.available | 2012-07-17 | |
dc.date.copyright | 2007-07-17 | |
dc.date.issued | 2007 | |
dc.date.submitted | 2007-07-05 | |
dc.identifier.citation | 1. Xia, Y.; Whitesides, G.M. Angew. Chem. Int. Ed. 1998, 37, 550.
2. Huang, Z.; Wang, P.C.; MacDiarmid, A. G.; Xia, Y.; Whitesides, G.M. Langmuir 1997, 113, 6480. 3. Hidber, P.W.; Helbig, E.; Whitesides, G. M. US Patent 2000, No. 6,060,121. 4. Koura, N. Electroless plating: fundamentals and applications; Ed. by Mallory, G. O.; Hajdu, J. B. American Electroplaters and Surface Finisher Society: Orlando, 1990; Chaper 17. 5. Prissanaroon, W.; Brack, N.; Pigram, P. J.; Hale, P.; Kappen,P.; Liesegane, J. Thin Solid Film 2005, 477, 131. 6. Dubin, V. M.; Shacham-Diamand, Y. J. Electrochem. Soc. 1997, 144, 898. 7. Delamarche, E.; Geissler, M.; Magnuson, R. H.; Schmid, H.; Michel, B. Langmuir 2003, 19, 5892. 8. Delamarche, E.; Vichiconti, J.; Hall, S. A.; Geissler, M.; Graham, W.; Michel, B.; Nunes, R. Langmuir 2003, 19, 6567. 9. Bruinink, C. M.; Nijhuis, C. A.; Péter, M.; Dordi, B.; Crespo-Biel, O.; Auletta, T.; Mulder, A.; Schönherr, H.; Vancso, G. J.; Huskens, J.; Reinhoudt, D. N. Chem. Eur. J. 2005, 11, 3988. 10. Bittner, A. M.; Wu, X. C.; Kern, K. Adv. Funct. Mater. 2002, 12, 432. 11. Wu, X. C.; Bittner, A. M.; Kern, K. Langmuir 2002, 18, 4984. 12. Wu, X. C.; Bittner, A. M.; Kern, K. Adv. Mater. 2004, 16, 413. 13. Mewe, A. N.; Kooij, E. S.; Poelsema, B. Langmuir 2006, 22, 5584. 14. Hannes, K.; Matthias, G.; Heinz, S.; Bruno, M.; Klaus, K.; Emmanuel, D. Langmuir 2000, 16, 16. 15. Fei, G.; Miao, C.; Wu, Y. Applied Surface Science 2004, 131–137, 230 16. Wasserman, S. R.; Whitesides, G. M.; Tidswell, I. M. J. Am. Chem. Soc. 1989, 111, 5852. 17. Chan, L.; Loh, F. C.; Tan, K. L. J. J. Electrochem. Soc., 1998, 145, 3301. 18. Pirmin, C. H.; Hidber, W.; Enoch, K.; Whiteside, G. M. Langmuir 1996, 12, 1375 19. Chun, G. W.; Jieh, Y. C. Chemisrty of materials 1997, 9, 2 20. Kirill, E.; Jan G. Macromolecules 2001, 34, 684-686 21. Chen, L.-J.; Tsai, Y.-H.; Liu, C.-S.; Chiou, D.-R.; Yeh, M.-C. Chemical Physics Letters 2001, 346, 241. 22. Minjer, C. H.; v.d. Boom, P. F. J. Electrochem. Soc. 1973, 120, 1644. 23. Lorenzo, B. H. US Patent 1986, no. 4563217. 24. Ren, D. S.; Donald, A. T.; Kazuhito, H.; Akira, F. J. Electrochem. Soc., 1999, 146, 2117 25. Hsu, H. H.; Lin, K. H.; Lin, S. J.; Yeh, J. W. J. Electrochem. Soc., 2001, 148, C47. 26. Hsu, H. H.; Lin, K. H.; Lin, S. J., Yeh, J. W. J. Electrochem. Soc., 2001, 148, C590. 27. Hsu, H. H.; Lin, K. H.; Lin, S. J.; Yeh, J. W. J. Electrochem. Soc., 2002, 149, 143. 28. Koya, S.R.; Khalil, E.H. J. Colloi. Interf. Sci. 2005, 289, 125. 29. Frank, K. e-Polymers 2005, 060 30. Dhananjay, B.; Chantal, K. Microelectronic Engineering 2006, 83, 1277 31. Sharpe, R. B. A.; Burdinski, D.; Huskens, J.; Zandvliet, H. J. W.; Reinhoudt, D. N.; Poelsema, B. Langmuir 2004, 20, 8646. 32. Schnur, J.M.; Peckerar, M. C. US Patent 1992, No. 5,079,600. 33. Mohilner, D. M.; Alphn, R. A. J. Am. Chem. Soc. 1962, 84, 3618. 34. Jan, G.R; Kirill, E. Science 2000, 290, 2130. | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/30395 | - |
dc.description.abstract | 本研究擬利用微觸印刷法以及無電電鍍法來製作微米級以及次微米級的金屬銅銀圖案,製作的圖案為0.6~10 μm且間隔0.6~10 μm的線條狀圖案,製程可分為兩種,直接蓋印法 ( printing seeding layer ,PSL ) 以及蓋印遮護層法 ( printing masking layer , PML )。直接蓋印法是直接利用微觸印刷蓋上種晶層的圖案,再將基材去做無電電鍍出金屬圖案,而蓋印遮護層法則是利用微觸印刷蓋印能阻擋種晶層的分子膜 (在本研究為 OTS),而後將基材泡入種晶層溶液,則可有效的阻擋種晶。另外為了改進無電電鍍金屬膜的附著性問題,我們也利用了溶膠凝膠法 ( sol-gel ) 來增加基材的表面粗糙度,以及利用基材氧氣電漿的預處理來改善製程以及節省製程時間。
另外,在本研究中我們也嘗試利用微觸印刷法以及化學沉積法來製作高分子導電薄膜聚苯胺的圖案,同時我們也利用拉伸實驗來探討了聚苯胺的導電性與膜本身的聚合密度之間的關係。 | zh_TW |
dc.description.abstract | Microcontact printing (μCP) and electroless plating are combined to produce micro-scale patterns of silver and copper on glass substrates. We fabricate copper and silver line patterns with feature sizes of 0.6~10 μm in length and separated by 0.6~10 μm by using two methods: (1) The printing seeding layer (PSL) method is to apply μCP to directly print the surface-active reagent pattern for further electroless plating. (2) The printing masking layer (PML) method is to use μCP to print the octadecyltrichlorosilane (OTS) self-assembled monolayer as a masking layer on glass substrates. We discuss the relation between the surface roughness and the adhesion property of copper and silver film. We use sol-gel process to increase the surface roughness. We also use the oxygen plasma pretreatment to increase the SAM quality, and to simplify the experimental procedure.
Conducting polymer polyaniline pattern is fabricated by the printing masking layer (PML) method with feature sizes of 10 μm lines and separated by 10 μm. We discuss the conductivity of polyaniline film at different stretching conditions. | en |
dc.description.provenance | Made available in DSpace on 2021-06-13T02:02:52Z (GMT). No. of bitstreams: 1 ntu-96-R94524058-1.pdf: 8718147 bytes, checksum: 9132c0208f128b4c0d685d6e82ca1a70 (MD5) Previous issue date: 2007 | en |
dc.description.tableofcontents | TABLE OF CONTENTS
Abstract (in Chinese) ---------------------------------------------------------------------------I Abstract (in English) ---------------------------------------------------------------------------II Table of Content--------------------------------------------------------------------------------III List of Tables ------------------------------------------------------------------------------------V List of Figures ----------------------------------------------------------------------------------VI CHAPTER 1 Introduction -------------------------------------------------------------------1 CHAPTER 2 Literature Review --------------------------------------------------------------6 2-1 Microcontact printing--------------------------------------------------------------------6 2-2 Electroless plating -----------------------------------------------------------------------9 2-3 Use Sn as the catalyst to fabricate silver pattern -----------------------------------11 2-4 Use Pd as the catalyst to fabricate silver and copper patterns -------------------12 2-5 Surface roughness and adhesion property ------------------------------------------14 2-6 Conducting polymer polyaniline -----------------------------------------------------17 CHAPTER 3 Experimental Methods ------------------------------------------------------30 3-1 Experimental preparation-------------------------------------------------------------31 3-2 Patterns of silver fabricated by Sn-activated surface ----------------------------32 3-3 Patterns of silver and copper fabricated by Pd activated surface ---------------35 CHAPTER 4 Results and Discussion -------------------------------------------------------44 4-1 Fabrication of silver patterns by Sn-activated surfaces --------------------------44 4-2 Fabrication of silver and copper patterns byPd-activated surfaces ------------51 CHAPTER 5 Conducting Polymer Polyaniline --------------------------------------------87 5-1 Experimental method ----------------------------------------------------------------87 5-2 Results and discussion ---------------------------------------------------------------88 CHAPTER 6 Conclusions and Future Works---------------------------------------------100 APPENDIX A: Abbreviation of Symbols--------------------------------------------------102 APPENDIX B: Formulation Table of Electroless Copper Plating Solution-----------103 Formulation Table of Electroless Silver Plating Solution-------------103 References--------------------------------------------------------------------------------------104 | |
dc.language.iso | en | |
dc.title | 利用微觸印刷法製作微米級與次微米級的銅銀以及導電高分子聚苯胺圖案 | zh_TW |
dc.title | Application of Microcontact Printing for the Fabrication of Micrometer-scale and Sub-micrometer-scale Silver and Copper Patterns & Conducting Polymer Polyaniline Patterns | en |
dc.type | Thesis | |
dc.date.schoolyear | 95-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 戴子安(Chi-An Dai),陳炳宏(bing-hung Chen),李岱洲(Tai-Chou Lee) | |
dc.subject.keyword | 微觸印刷,無電電鍍,直接蓋印法,蓋印遮護層法,溶膠凝膠法,化學沉積法, | zh_TW |
dc.subject.keyword | microcontact printing,electroless plating,printing seeding layer,printing masking layer,sol-gel process,chemical deposition, | en |
dc.relation.page | 106 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2007-07-09 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 化學工程學研究所 | zh_TW |
顯示於系所單位: | 化學工程學系 |
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