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http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/29779完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 周賢福 | |
| dc.contributor.author | Yi-Ping Wang | en |
| dc.contributor.author | 王逸彬 | zh_TW |
| dc.date.accessioned | 2021-06-13T01:18:31Z | - |
| dc.date.available | 2007-07-27 | |
| dc.date.copyright | 2007-07-27 | |
| dc.date.issued | 2007 | |
| dc.date.submitted | 2007-07-17 | |
| dc.identifier.citation | [1]H. Matsushima, S. Matsushita, I. Asano, T. Takeuchi, O. Suzuki, US Patent 20050126752A1.
[2]S. Ohashi, T. Naganawa, R. Minamitani, A. Nishihara, US Patent 20050180106A1. [3]古賀 慎彌, JP Patent No. 特開2004-288809(P2004-288809A). [4]吉野 靖, JP Patent No. 特開2002-170915. [5]林 建一, 中出口 真治, JP Patent No. 特開平9-102568. [6]J. A. Valenzuela, US Patent No. US20010050162A1. [7]Y. H. Liann,“Theoretical and Experimental Investigations on Swirl Atomizers,”M.S. Thesis, ME Dept., National Taiwan University, 2005. [8]S. F. Chou, H. I. Lin, Y. P. Wang “Performance Improvement on Water-Cooled Cold-Plate,” WSEAS TRANSACTIONS on HEAT AND MASS TRANSFER , Issue 5, Volume 1, pp. 618, May 2006. [9]H.Y. Zhang, T.N. Wong, Y. K. Joshi,“Development of Liquid Cooling Techniques for Flip Chip Ball Grid Array Packages With High Heat Flux Dissipations,” IEEE Trans. Compon., Packag., Manufact. Technol. Vol. 28, No. 1, pp. 127-135, March 2005. [10]S. Lee, S. Song, V.Au, K.P. Moran,“Optimization and selection of heat sinks,” IEEE Trans. Compon., Packag., Manufact. Technol. A, Vol. 18, No. 4, pp. 812-817, Dec 1995. [11]Y. Murakami, B. B. Mikić,“Parametric Optimization of Multichanneled Heat Sinks for VLSI Chip Cooling,” IEEE Trans. Compon., Packag., Manufact. Technol. Vol. 24, No. 1, pp. 2-9, March 2001. [12]C. Y. Liu and Y. H. Hung, “Heat Transfer and Flow Friction Characteristic for Compact Cold Plates,”Journal of Electronic Packaging, Trans. ASME, Vol. 125, No. 1, pp. 104-113, 2003. [13]A. D. Kraus and A. Bar-Cohen, “Thermal Analysis and Control of Electronic Equipment,” Hemisphere Publishing Corporation, 1983. [14]C.C. Lu, C.C. Wang, and B.C. Yang, “Numerical Study of Flow Mal- distribution on the Flow and Heat Transfer for Multi-channel Cold-Plates,”20th Annual IEEE Semiconductor Thermal Measurement and Management Symposium-Proceedings, pp. 205-212, 2004. [15]W. Qu, and I. Mudawar, “Analysis of Three- dimensional Heat Transfer in Micro-channel Heat Sinks,”Int. Journal of Heat and Mass Transfer, Vol. 45, No. 19, pp. 3973-3985, 2002. [16]A. Hasan, K. Sirén, “Performance investigation of plain and finned tube evaporatively cooled heat exchangers,” Applied Thermal Engineering, Vol. 23, No. 3, pp. 325-340, 2003. [17]R. J. McGlen, R. Jachuck, S. Lin, “Integrated thermal management techniques for high power electronic devices,” Applied Thermal Engineering, Vol. 24,pp 1143-1156, 2004 [18]A.Cengel, 1988, Heat Transfer, McGraw Hill, N.Y.. [19]A. Hasan, K. Siren, 2002, “Theoretical and Computational Analysis of Closed Wet Cooling Towers and Its Applications in Cooling of Building,” Energy and Buildings, Vol. 34, No. 5, pp. 477-486. [20]A. Hasan, G. Gan, 2002, “Simplification of Analytical Models and Incorporation with CFD for the Performance Prediction of Closed Wet Cooling Towers,” International Journal of Energy Research, Vol. 26, No. 13, pp. 1161-1174. | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/29779 | - |
| dc.description.abstract | 本文藉由理論分析與實驗量測探討具渦漩結構的中央處理器散熱裝置(CPU散熱塊)，在不同冷卻流道幾何與體積流率下之散熱效能，未來可應用於電子元件之散熱上。經由明顯的物理現象做出合理的假設，可預測渦旋結構自發加速性對熱傳效率之影響及經驗式的概略結構，再經由充分的實驗數據支持假設的可靠性。藉由在文中對控制體積、初始條件、模型修正之物理假設，將渦旋腔各種不同的幾何條件，及工作流體的控制條件加以分析，可直接自理論預測渦漩結構散熱裝置之熱傳效率。本研究所進行之實驗與理論相互比較，亦應證了理論之趨勢。藉由軟體之輔助，可求得無因次化熱傳效率與流速之趨勢分布。最後，本文期望建立可適用於不同幾何尺寸之渦旋結構流場的熱傳效率經驗式，便於未來渦旋結構流道設計者分析渦旋流場。 | zh_TW |
| dc.description.abstract | Recently, high-performance electronic devices generated more heat than former. Mini-channel liquid coolers should be studied, to dissipate heat generated by the high-power electronic devices. In this research, the performances of swirling-cold-plates with different channel designs by using water as the cooling fluid were studied with different flow rate.. The results of experiment were measured and analyzed. The influence of the swirling structures on the heat transfer efficiency of liquid-cooling cold-plate can be predicted under some reasonable assumptions. The theoretical predictions were well verified by experimental analyses. The nondimensional relationship between heat transfer coefficient and relative parameters can be established during a lot of precision experiments. These parameters include geometric structure of swirling channel, properties and flow rate of cooling fluid, and heat dissipation rate demanded. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-13T01:18:31Z (GMT). No. of bitstreams: 1 ntu-96-R94522401-1.pdf: 5392402 bytes, checksum: f4a9c99d802493d65a28fc6cbe28d1be (MD5) Previous issue date: 2007 | en |
| dc.description.tableofcontents | 論文審定書……………………………………i
誌謝……………………………………………ii 摘要……………………………………………iii Abstract………………………………………iv 第1章 緒論……………………………………1 1.1 前言………………………………………1 1.2 研究背景與原理 …………………………2 1.3 文獻回顧…………………………………2 1.4 研究目的…………………………………3 第2章 研究理論基礎…………………………4 第3章 實驗操作設備及步驟…………………11 3.1 實驗設備…………………………………11 3.2 實驗步驟…………………………………14 第4章 分析實驗結果與討論…………………16 第5章 結論與建議……………………………24 5.1 結論………………………………………24 5.2 建議與未來發展 …………………………25 | |
| dc.language.iso | zh-TW | |
| dc.subject | 電子散熱 | zh_TW |
| dc.subject | 散熱塊 | zh_TW |
| dc.subject | 自發加速 | zh_TW |
| dc.subject | 液態冷卻 | zh_TW |
| dc.subject | 渦漩結構 | zh_TW |
| dc.subject | cold plate | en |
| dc.subject | dissipate | en |
| dc.subject | mini channel | en |
| dc.subject | liquid cooler | en |
| dc.subject | Swirling channel | en |
| dc.title | 具渦旋結構散熱板之熱傳分析 | zh_TW |
| dc.title | Thermal Analysis of Cold-Plates with Swirling Cavities | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 95-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 陳瑤明,林恒毅 | |
| dc.subject.keyword | 液態冷卻,渦漩結構,自發加速,散熱塊,電子散熱, | zh_TW |
| dc.subject.keyword | Swirling channel,liquid cooler,mini channel,cold plate,dissipate, | en |
| dc.relation.page | 78 | |
| dc.rights.note | 有償授權 | |
| dc.date.accepted | 2007-07-19 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
| 顯示於系所單位： | 機械工程學系 | |
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