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標題: | 連通柱不連續結構之電氣特性與補償設計 Electrical Characteristics of Via Discontinuity and Compensation Design |
作者: | Wei-Ning Chian 錢韋寧 |
指導教授: | 吳瑞北(Ruey-Beei Wu) |
關鍵字: | 連通柱,開路殘段,膠囊狀清潔環, via,via stub,capsule-shaped anti-pad, |
出版年 : | 2007 |
學位: | 碩士 |
摘要: | 在多層印刷電路板當中,連通柱結構總是被用來連結位於不同層的傳輸線。隨著資料傳輸速率到達數個十億位元的範圍以上,連通柱結構對於信號完整度的影響就必須要被考慮。通常連通柱結構是呈現電容的效應,因此在輸入訊號端可以觀察到電容性的反射波形。
為了減少反射雜訊,本論文使用高阻抗元件來改善連通柱結構所造成的不連續效應,並提出一套有系統的設計流程來加以使用。此外,更提出了新穎的補償方法,即藉由改變清潔環的形狀,使其從圓形變成膠囊狀來達到更寬頻的補償。此補償方法也可有效的應用在差模連通柱結構上。同時也結合二種補償方法對於包含開路殘段的連通柱結構作一補償分析,使整體補償設計更為完整。最後利用時域模擬與量測結果來驗證此方法的正確性。 In the multilayer printed circuit boards (PCBs), the through-hole via transitions are always utilized to link the signal traces between different layers. As the data rates increase up to several GHz, it is essential to consider the significant impact of vias on signal integrity of high-speed digital systems. Usually, it is found to be capacitive and would cause a voltage drop in the time-domain reflectometry (TDR) waveform. To reduce this reflection noise, this thesis describes a systematic design procedure to improve the electrical performance of multilayer through-hole via transitions by using the high-impedance interconnects. In addition to the thinner transmission line, a novel matching structure is proposed by changing the anti-pad shape from circular to capsular to achieve the better broadband matching condition. The compensation method also applies to a differential via transition successfully. To make the design of compensation more complete, a way of combining two compensation methods applies to the via stub structures. This method is demonstrated by the time-domain simulation and measurements, accordingly. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/29733 |
全文授權: | 有償授權 |
顯示於系所單位: | 電信工程學研究所 |
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