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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
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dc.contributor.advisor | 陳希立(Sih-Li Chen) | |
dc.contributor.author | Cheng-Yu Cheng | en |
dc.contributor.author | 鄭丞佑 | zh_TW |
dc.date.accessioned | 2021-06-08T07:30:09Z | - |
dc.date.copyright | 2008-07-03 | |
dc.date.issued | 2008 | |
dc.date.submitted | 2008-06-27 | |
dc.identifier.citation | 1. Grover, G. M., Cotter, T. P. and Erikson, G. F., “Structures of Very High Thermal Conductivity”, J. Appl. Phys., 35, 1964.
2. W.J. Bowman and J.E Hitchcock, “Transient compressible heat pipe vapor dynamics”, 1988 National Heat Transfer Conference, Houston, Tx, HTD-96, Vol.1 , pp.329-337, 1988. 3. F. Issacci, I. Catton and N.M. Ghoniem, “Vapor dynamics of heat pipe startup”, ASME J, Heat Transfer 113, pp. 985~994, 1991. 4. W. S. Chang and G.. T. Colwell, “Mathematical modeling of the transient operating characteristics of a low temperature heat pipe”, Numerical Heat Transfer 8, pp. 169-186, 1985. 5. A. Faghri and M. M. Chen, “A numerical analysis of the effects of conjugate heat transfer, vapor compressibility and viscous dissipation in heat pipes”, Numerical Heat Transfer 8, pp.169-186, 1985. 6. Y. Cao and A. Faghri, “Transient two-dimensional compressible analysis for high-temperature heat pipes with pulsed heat input”, Numerical Heat Transfer Part A, 18, pp.483-502, 1990. 7. A. Faghri and C. Harley, “Transient lumped heat pipe analyses”, Heat Recovery System & CHP Vol. 14, No. 4, pp.351-363, 1994. 8. Kenichi Namba, Naoki Kimura, Jun Niekawa, Yuichi Kimura, Nobuyuki Hashimoto, “Heat pipes for electronic devices cooling and evaluation of their thermal performance”, IEEE, Inter Society Conference on Thermal Phenomena, pp.456-459, 1998. 9. S. H. Moon, C. G. Choi, G. Hwang, and T. G. Choy, “Experimental Study on performance of a miniature heat pipe with woven-wired wick”, Inter Socitey Conference on Thermal Phenomena, pp. 129-133, 2000. 10. S. H. Moon, G. Hwang, H. G. Yun, T. G. Choy, Y. Kang, “Improving thermal performance of miniature heat pipe for notebook PC cooling”, Microelectronics Reliability Vol. 42, Issue 1, pp.135-140, 2002. 11. G. P. Peterson, An Introduction to Heat Pipe: Modeling, Testing, and Applications, Wiley, 1994. 12. A. Faghri, Heat Pipe Science and Technology, Taylor & Francis, 1995. 13. Seri Lee, “ Calculating Spreading Resistance in Heat Sinks ”, Electronics Cooling, Vol. 4, No. 1, pp. 30-33, January 1998. 14. Yunus A. Cengel, Heat Transfer,2nd ed, McGrawHill, 2004. 15. P. D. Dunn, Heat Pipe, Pergamon,4th ed, 1994. 16. L. S. Tong, Y. S. Tang, Boiling Heat Transfer and Two-Phase Flow,2nd ed, Taylor & Francis, 1997. 17. X. Zhang, P.X. Cong, and M. Fujii, “A study on Thermal Contact Resisttance at the Interface of Two Solids”, Inernational Journal of Thermophysics, Vol. 27, No.3, 2006. 18. 黃彥銘,「以動態溫度追蹤法量測熱管最大熱傳量」,碩士論文,國立清華大學工程與系統科學系研究所,民國95年。 19. 經濟部,絕熱與熱傳材料之技術手冊。 20. 兆加電熱管,www.taiwei.com.tw/。 21. 潘欽,沸騰熱傳與雙相流,國立編譯館, 2001。 22. 康仁豪,「嵌入式熱管散熱模組之性能研究與熱阻分析」,碩士論文,國立台灣大學機械工程學研究所,民國94年。 23. 陳拓穎,「熱管動態性能分析」,碩士論文,國立台灣大學機械工程學研究所,民國97年6月(2008)。 | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/26876 | - |
dc.description.abstract | 隨著個人電腦的普及其效能之提升,帶動了散熱技術之演進,進而提升熱管散熱模組的需求量和性能要求。在大量散熱模組之生產需求下,品質管理檢測的議題也越來越受到重視,而現下檢測時間過長之問題,將導致生產效率降低、成本增加。
本研究主題為規劃一套熱管散熱模組之完整實驗方法與流程,藉此分析熱管散熱模組各部元件之溫度反應,在不同實驗參數下之的變化;實驗參數主要包含加熱方式、加熱量、風扇開啟時間等。另一方面,運用塊狀系統之理論為基礎,建立一套數值模擬方法來預估熱管散熱模組之動態溫度反應,幫助實驗參數之制定,減少以試誤法求得之檢測參數與判斷準則之時間及成本。 本研究藉由模擬結果求得適當之檢測參數範圍,證實建立散熱模組的模擬方法之可行性,並配合實驗結果得出在不同加熱方式下,各種適當的檢測參數與判斷方法。最終透過動態檢測的方法制定,將測試時間縮短為30秒,提高效率。 | zh_TW |
dc.description.abstract | The higher penetration rate and better performance efficiency of personal computer (PC) nowadays has led to the improvement of cooling technology, increasing demand, and higher quality requirement of heat pipe cooling module. Following this trend, the topic of Quality Management becomes more and more important. Therefore, the existing problem of long examination process, which causes worse manufacturing efficiency and higher cost, turns to be one issue to be further improved in cooling field.
Our research focus on designing the experiment methodology and process for heat pipe cooling module, and try to analyze the temperature response change of each component in heat pipe cooling module under different situations. The main experimental parameters include the heating methods, heating temperature, and time to turn on the fan. In addition, based on Lumped System theory, we build up a simulation model to find out the dynamic temperature response of heat pipe cooling module, and then set up experimental parameters. Under this simulation, we could reduce the time and cost on testing parameters and analysis principles with try and error method. The study proves to be the successful simulation model to find out suitable parameters range and analysis principles under different heating methods. Finally, our research results successfully shorten the examination time to 30 seconds through transient examination method. | en |
dc.description.provenance | Made available in DSpace on 2021-06-08T07:30:09Z (GMT). No. of bitstreams: 1 ntu-97-R95522306-1.pdf: 3510031 bytes, checksum: 104476bc42d71aeedc174ffd4385f424 (MD5) Previous issue date: 2008 | en |
dc.description.tableofcontents | 誌謝 I
摘要 II Abstract III 表目錄 VIII 圖目錄 IX 符號說明 XIII 第一章 緒論 1 1.1 前言 1 1.2 研究動機 2 1.3 研究目的 3 1.4 文獻回顧 4 第二章 基本理論與模擬方法 9 2.1熱管基本介紹 9 2.2動態理論分析模式 12 2.2.1基本理論 12 2.2.2數值模擬方法 15 2.2.3熱管散熱模組動態模擬 17 2.3熱阻分析模式 20 第三章 實驗設備與研究方法 33 3.1 接觸熱阻實驗與量測設備 33 3.1.1 實驗系統 33 3.1.2 實驗設備 34 3.1.3 儀器校正 35 3.1.4 實驗參數設定 35 3.1.5 實驗流程 36 3.2等熱通量加熱動態測試 37 3.2.1實驗系統 37 3.2.2 實驗設備 37 3.2.3實驗參數設定 38 3.2.4實驗流程 39 3.3等溫加熱動態測試 41 3.3.1實驗系統 41 3.3.2 實驗設備 41 3.3.3實驗參數設定 42 3.3.4 實驗流程 43 第四章 實驗結果與討論 51 4.1接觸熱阻實驗結果 51 4.2制定動態測試條件 52 4.2.1等熱通量加熱動態測試參數 52 4.2.2等溫加熱動態測試參數 56 4.2.3溫度量測點簡化 58 4.3熱管散熱模組判斷準則 60 4.3.1底板與熱管接觸之判斷準則 60 4.3.2熱管性能判斷準則 62 4.3.3強制對流效能 62 4.3.4熱管散熱模組判斷準則結論 63 4.4模擬結果討論 66 第五章 結論與建議 94 5.1結論 94 5.2建議 96 參考文獻 99 | |
dc.language.iso | zh-TW | |
dc.title | 熱管散熱模組動態分析 | zh_TW |
dc.title | Dynamic Analysis for Heat Pipe Cooling Module | en |
dc.type | Thesis | |
dc.date.schoolyear | 96-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 柯明村,卓清松,江沅晉 | |
dc.subject.keyword | 熱管,散熱模組,動態分析,動態模擬, | zh_TW |
dc.subject.keyword | Heat Pipe,ooling Module,ynamic Analysis,ynamic Simulation, | en |
dc.relation.page | 100 | |
dc.rights.note | 未授權 | |
dc.date.accepted | 2008-06-27 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
顯示於系所單位: | 機械工程學系 |
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