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  1. NTU Theses and Dissertations Repository
  2. 工學院
  3. 應用力學研究所
請用此 Handle URI 來引用此文件: http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/26829
完整後設資料紀錄
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dc.contributor.advisor張正憲(Jeng-Shian Chang)
dc.contributor.authorYueh-Lung Wuen
dc.contributor.author吳岳龍zh_TW
dc.date.accessioned2021-06-08T07:27:45Z-
dc.date.copyright2011-08-17
dc.date.issued2011
dc.date.submitted2011-08-09
dc.identifier.citation[1]. 陳金鑫、黃孝文,'Materials and Devices of Dream Displays 夢幻顯示器:OLED材料與元件,' 2007.
[2]. Sung Kyu Park, Jeong In Han, Dae Gyu Moon, and Won Keun Kim, 'Mechanical Stability of Externally Deformed Indium-Tin-Oxide Films on Polymer Substrates, 'Japanese Journal of Applied Physics 42, 623, 2003.
[3]. Letterier Y., 'Durability of Nanosized Oxygen-barrier Coatings on Polymers,' Pro. Mater. Sci.48,pp1-55, 2003.
[4]. 李佩璇, '含薄膜之可撓性基板的力學分析及應用, '國立成功大學工程科學系碩士論文, 2005.
[5]. 彭于芳, '含阻隔層可撓式有機發光二極體(FOLED)黏彈性力學分析,'國立成功大學工程科學系碩士論文, 2006.
[6]. Chien-Jung Chiang, Chris Winscom, Steve Bull, Andy Monkman, 'Mechanical modeling of flexible OLED device, ' Organic Electronics 10, 2009.
[7]. Timoshenko, S.P.﹐'Analysis of Bi-metal Thermostats, 'Journal of the Optical Society of America, Vol. 11, pp. 233-255, 1925.
[8]. Aleck, B. J., 'Thermal Stresses in a Rectangular Plate Clamped along the Edge,' ASME Journal of Applied Mechanics, Vol.16, pp.118-122, 1949.
[9]. Hess, M. S., 'The End Problem for a Laminated Elastic Strip—The General solution, 'Journal of Composite Materials, Vol.3, pp.262-292, 1969.
[10]. Zeyfang, R., 'stress and strains in a plate Bonded to a substrate: Semi-conductor Devices, 'Solid-State Electron, 14, pp.1035-1039, 1971.
[11]. Chen, W. T., and Nelson, C. W., 'Thermal Stress in Bolted Joints, 'IBM Journal of Research and Development, Vol.23, pp.178-188, 1979.
[12]. Suhir, E., 'Stresses in Bi-metal Thermostats, ' ASME Journal of Applied Mechanics, Vol.53, pp.657-660, 1986.
[13]. Suhir, E., 'An Approximate Analysis of Stresses in Multilayered Elastic Thin Films, 'ASME Journal of Applied Mechanics, Vol.55, pp.43-148, 1988.
[14]. Suhir, E., 'Interfacial Stresses in Bimetal Thermostats, ' ASME Journal of Applied Mechanics, Vol.56, pp.595-599, 1989.
[15]. Suhir, E., 'Analysis of interfacial thermal stresses in a trimaterial assembly, ' Journal of Applied Physics, Vol.89(7), 2001.
[16]. Ghorbani, H. R., 'Interfacial Thermal Stresses in Trilayer Assemblies, ' ASME Journal of Applied Mechanics, Vol.127, 2005.
[17]. M. Pope, 'H. Kallmann, P. Magnante, 'J. Chem. Phys., Vol.38,1963.
[18]. Tang C. W., Van Slyke S. A., 'Organic Electroluminescent Diodes, 'Appl. Phys. Lett. Vol.51, pp.913-915, 1987.
[19]. D.G. Howells, B.M. Henry, 'Y. Leterrier, J.-A.E. M
dc.identifier.urihttp://tdr.lib.ntu.edu.tw/jspui/handle/123456789/26829-
dc.description.abstract可撓性有機發光二極體顯示器(FOLED)是相當受到矚目的新型顯示器,是將OLED製作塑膠基板上。氧化銦錫(Indium tin oxide,ITO)是FOLED的陽極導電層,是一種透光性極佳導電性良好的材料,也是廣泛應用在顯示器及觸控面板中常見的陽極材料。在ITO的製程中,要將ITO濺鍍在具有阻隔層的可撓性基板上,因為ITO的製程需要較高的溫度,在製程降溫過程中,會因多層結構不同的熱膨脹係數,使的基板產生翹曲且有應力的殘留。
本文主要是透過Suhir的三層薄板理論來分析製程降溫產生的翹曲和殘餘應力,並配合商用數值分析軟體Ansys,建構線性和黏彈實體模型來模擬這個現象,不只能與Suhir的二維理論互相作比較,還考慮了材料的黏彈情形,將更符合實際情形。本文並分析不同阻隔層的熱膨脹係數、楊氏模數對於基板翹曲和殘餘應力的影響,也分析各層的厚度對殘餘應力和翹曲的影響,透過這樣的分析,提供設計者最佳的阻隔層材料選擇和各層厚度設計,達到減少殘餘應力和翹曲的目的,提高元件的可靠度和壽命。
zh_TW
dc.description.abstractFlexible Organic Light Emitting Diodes (FOLEDs) that attracted much attention are new display technology. A flexible organic light emitting diode is typically fabricated on a thin plastic substrate so that the resulting device can be flexible and bendable. Indium tin oxide (ITO) is used as the anode of FOLED because of high optical transmission and low electrical resistivity. Indium tin oxide (ITO) has also been widely applied in the flat panel display and touch panels. A sputtering deposition method is applied to prepare Indium tin oxide (ITO) on a flexible substrate containing thin barrier layer. ITO must be manufactured at an elevated temperature and subsequently cooled to a low temperature. However, the mismatch of coefficient of thermal expansion between every two layer of them induces large warpage and residual stresses during cooling process.
The object of this thesis is to analyze warpage and residual stresses by using Suhir’s structural analysis approach. In addition, we also create elastic and viscoelastic models to simulate our problem by using commercial FEM software, Ansys. So we can compare Suhir solution with simulation. In the thesis, we also discuss different kind of barrier and different thickness of each layer to compare warpage and residual stresses. By building the thermal stress analysis system, the analytic results may help designer to choose correct material and thickness to reduce warpage and residual stresses. It is helpful to increase product reliability and life.
en
dc.description.provenanceMade available in DSpace on 2021-06-08T07:27:45Z (GMT). No. of bitstreams: 1
ntu-100-R98543041-1.pdf: 28783659 bytes, checksum: 059b814bbb75f3db502dc3c5a6a63526 (MD5)
Previous issue date: 2011
en
dc.description.tableofcontents目錄
論文口試委員審定書 I
誌謝 II
摘要 III
ABSTRACT IV
目錄 V
圖目錄 VII
表目錄 XI
第一章 緒論 1
1.1 前言 1
1.2 研究動機 2
1.3 文獻回顧 3
第二章 可撓性有機發光二極體顯示器簡介 6
2.1 有機發光二極體顯示器(OLED)發展 6
2.2 有機發光二極體顯示器(OLED)發光原理 8
2.3 可撓性有機發光二極體顯示器(FOLED)之結構 9
2.4 濺鍍ITO於可撓性基材上 11
2.4.1 ITO濺鍍(sputtering)製程介紹 11
2.4.2 ITO製程溫度 13
第三章 熱應力理論與黏彈概論 15
3.1 SUHIR三層薄板理論 15
3.2 黏彈概論 24
第四章 ITO沉積於可撓性基板之翹曲和熱應力模擬分析與參數討論 28
4.1 數值模擬方法 28
4.1.1 Ansys簡介 28
4.1.2 分析模型建立 29
4.1.3 材料選取 32
4.2 翹曲理論與模擬比較和參數討論 42
4.2.1 Ansys模擬翹曲與Suhir理論解析解比較 42
4.2.2 溫度對於翹曲值的影響 45
4.2.3 阻隔層熱膨脹系數對翹曲的影響 50
4.2.4 ITO層的厚度對翹曲的影響 56
4.2.5 阻隔層厚度和楊氏模數對於翹曲的影響 58
4.2.6 基板厚度對翹曲的影響 62
4.3 ITO層殘餘應力理論與模擬比較和參數討論 64
4.3.1 溫度對於ITO層殘餘應力影響的理論和模擬比較 64
4.3.2 ITO層的厚度對ITO層殘餘應力的影響 67
4.3.3 阻隔層厚度對於ITO層殘餘應力的影響 69
4.3.4 基板厚度對ITO層殘餘應力的影響 71
第五章 結論與未來展望 73
5.1 結論 73
5.2 未來展望 75
參考文獻 76
dc.language.isozh-TW
dc.subject有限元素法zh_TW
dc.subject黏彈zh_TW
dc.subject可撓性基板zh_TW
dc.subject熱應力zh_TW
dc.subjectFOLEDzh_TW
dc.subjectFlexible substrateen
dc.subjectFOLEDen
dc.subjectviscoelasticen
dc.subjectFEMen
dc.subjectthermal stressen
dc.title可撓性有機發光二極體顯示器的熱應力和翹曲分析zh_TW
dc.titleThe Analysis of Thermal Stresses and Warpage of Flexible OLEDen
dc.typeThesis
dc.date.schoolyear99-2
dc.description.degree碩士
dc.contributor.oralexamcommittee吳光鐘(Kuang-Chong Wu),王安邦(An-Bang Wang)
dc.subject.keyword熱應力,FOLED,有限元素法,可撓性基板,黏彈,zh_TW
dc.subject.keywordthermal stress,FOLED,FEM,Flexible substrate,viscoelastic,en
dc.relation.page78
dc.rights.note未授權
dc.date.accepted2011-08-10
dc.contributor.author-college工學院zh_TW
dc.contributor.author-dept應用力學研究所zh_TW
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