三維積體電路熱分析及TSV 安置最佳化

Abstract

由於功率和封裝技術的密度不斷的提高，散熱議題和現代VLSI設計上的穩定度和效能都非常的息息相關。因此，要如何有效的分析溫度在晶片上面的分佈及找到溫度最高的熱點，變得非常的重要。 在這篇論文中，我們利用有限差分的方法來分析熱傳導方程式進而算出熱在晶片上的分佈。此外我們讓程式去自動找出最精確的解析度。使用者不需要耗費大量時間在尋求能讓溫度解精確的所需格點數。在得到了晶片的溫度分佈之後，我們提出了一個有效放置散熱via的方法。藉由我們所提出的方法，溫度在晶片熱點處可下降百分之十五左右。 在第一章中，我們介紹最基本的熱傳導概念及公式。第二章則介紹怎麼利用第一章所講的來分析晶片上的溫度，以及簡單介紹3-D IC的架構。第三章介紹解析度自動化及散熱via放置的演算法。第四章為我們程式模擬跑出來的一些結果。第五章為總結。

Because of the rapid increase of power and packaging densities, thermal issues have became important factors of the reliability and performance concerns for advanced very large scale integration (VLSI) design and manufacturing. Therefore, how to effectively analyze the thermal distribution and hot spot location in 3-D IC is very important. In this thesis, we use finite difference method to analyze thermal conduction equation and calculate the temperature distribution on 3-D IC. Besides, we make the program to find appropriate resolution spontaneously. Users don’t have to waste too much time on deciding suitable mesh grids. After obtaining the temperature distribution, we propose an efficient algorithm of via insertion. By the method we advised, the temperature on the hot spot position of the chip can decrease up to 15% of its’ original temperature. We introduce some basic concepts of thermal conduction equation in Chapter 1. Chapter 2 presents the way of utilizing the equation to analyze temperature in practical, and also introduce the fundamental concepts of 3-D IC. Then, the resolution automation and via insertion algorithm are told in chapter 3. Chapter 4 shows some simulation results of our algorithm and the conclusion will be made in Chapter 5.