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http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/25172
標題: | 應用於高速系統封裝之新型電磁能隙電源平面設計 A Novel Electromagnetic Bandgap (EBG) Power Plane for High-Speed System on Package Design |
作者: | Tzu-Wei Han 韓子偉 |
指導教授: | 吳宗霖 |
關鍵字: | 切換雜訊,電源完整性,信號完整性,電磁能隙,系統封裝, SSN,PI,EBG,Artificial Substrate,SoP, |
出版年 : | 2007 |
學位: | 碩士 |
摘要: | Abstract
Transient current surges resulted from the simultaneous switching of output buffers in the high-speed digital circuits can induce significant ground bounce noise (GBN) on the chip, package, and printed circuit board (PCB). The GBN not only causes the signal integrity problems but also deteriorate the EMI in the high-speed digital circuits. With the design trends of digital circuits toward higher speed, lower voltage level, and smaller package size, the impact of GBN has become one of the most important issues that determine the performance of electronic systems. In this thesis we propose a novel power distribution structure with stopband enhancement by introducing the concept of “Artificial substrate”. Based on the conventional coplanar EBG power plane, it is fabricated by periodically embedding materials with different dielectric constant between the power and ground plane to perturb the effective dielectric constant for different resonance modes. It is found that with proper design of the positions and dielectric constant of the embedded materials, the stopband bandwidth can be enhanced by reducing the frequency of the first mode and increasing the frequency of the second one at the same time. This idea is verified by simulation and measurement both in time- and frequency-domain. Over 60% bandwidth enhancement for the SSN suppression is achieved in this work. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/25172 |
全文授權: | 未授權 |
顯示於系所單位: | 電信工程學研究所 |
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