超快雷射製作多層結構之質量轉移轉印技術

Abstract

質量轉移技術(LIFT)是個簡單又快速的技術，利用電腦操控飛秒雷射移除在透明基板上的母板材料(母板)，因此材料轉印至另一塊基板上(子板)。金和介電質夾雜和氧族材料的動力犧牲層構成的多層薄膜，利用質量轉移技術做出多層結構。當雷射光照射後，動力犧牲層產生爆炸性的壓力驅使材料轉印至子板。 利用質量轉移技術已經可以做出完整的五層結構。此法將有潛力製作大量地三維多層超穎材料和電漿子學的應用在任何基板上。

Laser-induced forward transfer (LIFT) is a simple fast one-step process technology, which utilizes short laser pulse to selectively remove the thin film (donor) material from a transparent support substrate and eventually forward transfer it onto a receiver substrate. We utilize LIFT to print the pattern of multi-layer thin film consisted of stacked gold and dielectric material and chalcogenide material dynamic release layer on glass substrate. The manufacture of three layers pattern by LIFT technique has been demonstrated. The proposed method has potential for manufacturing a large number of three-dimension structure on any substrate in metamaterails or other plasmonic applications faster and easier.