應用TOC限制理論改善工廠營運績效： 以半導體封裝廠個案研究

Abstract

半導體市場持續成長，特別是手機快速成長，已經大幅改變我們的生活並帶動相關產品及半導體的蓬勃發展，台灣在半導體產業的供應鏈上完整也極具競爭力。但是近年來由於全球生產供應鏈持續整合，手機成長趨緩，加上中國大陸的政策獎勵半導體產業，以及資金的挹注，生產競爭的壓力日益嚴重。 進入一個新的市場，要如何做才有競爭力? 首要針對市場及產品做動態的競爭分析，了解競爭對手反應，進而獲利。選對對的產品及策略，加上TOC限制理論管理方法，改善生產製造流程中的瓶頸(制約因子)，用創新的思維、方法，加上運用自動化科技，提高生產力、降低成本，才能持續保有競爭優勢。 本論文研究以半導體封裝廠覆晶封裝（flip chip）生產為例，從新產品策略的訂定，再運用限制理論中五大循環步驟持續改善，利用創新方法、提升生產製造流程的效能、進而提升企業獲利。

IC Semiconductor continues growth, especially on smart phone market recently, which has made a big improvement on our daily life. Taiwan’s semiconductor play a key role on the IC supply chain. We have complete solution in semiconductor manufacturing Top 1 in wafer foundry and Package assembly. However. higher growth rate on the semiconductor IC and more consolidation on customers, and suppliers, have result in price and market share competition. In addition, China’s 5 years policy plus funding support have also leaded significant higher grow on the semi conduct’s market. To continue the strength and leading position of Taiwan semiconductor. We have to choose the right product &portfolio, and have good methodology to improve the cost and competitive. It can be done by TOC (theory of constrain), step by step, resolve and improve the bottle neck process. Using creative method and automation solution to improve the productivity of flip chip bonding process.