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| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 莊東漢 | |
| dc.contributor.author | Che-Cheng Chang | en |
| dc.contributor.author | 張哲誠 | zh_TW |
| dc.date.accessioned | 2021-06-08T00:32:14Z | - |
| dc.date.copyright | 2013-07-08 | |
| dc.date.issued | 2013 | |
| dc.date.submitted | 2013-06-30 | |
| dc.identifier.citation | 參考文獻
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| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/17706 | - |
| dc.description.abstract | 摘 要
電子構裝工業打線接合技術在直徑20μm 等級的第一級封裝中，過去大部分主要是使用Au 作為打線接合的材料。而隨著Au 價格從2001 年每盎司不到300美元，成長到2011 年達到每盎司超過1800 美元，未來製造成本只會更加提升。除了原料成本因素，Au wire 與Al pad 容易產生過多的介金屬化合物(IMC)造成接點可靠度降低。本研究使用價格只有Au wire 三分之一的Ag alloy wire， 直徑20μm 等級與Al pad 上進行各種可靠度測試(HTS TCT PCT)。經本研究發現因為Ag alloy wire 的硬度跟Au wire 相近，因此不會有像Pd-coated Cu wire 會損傷Alpad 造成接合強度不佳的問題。Ag alloy wire 與Al pad 的接合界面都非常的完整。熱時效試驗使用溫度100℃到200℃;時效時間0hr 到1000hr 作接合強度測試與界面反應觀察。使用dage 4000 對第一銲點做ball shear 測試後再經由電子顯微鏡的觀察可以明顯發現Ag alloy wire 與Al pad 的接合界面非常的緊密，所以測試結果都會斷在wire 內；而Pd-coated Cu wire 與Al pad 產生的介金屬化合物(IMC)很薄，接合強度不高。在經由200℃ 1000hr 熱時效測試可以發現，Au wire 與Al pad的接合強度會因為過度厚的介金屬化合物(IMC)造成接點脆化與產生大量孔洞而造成接點強度降低；而Ag alloy wire 與Al pad 則是因為生成的介金屬化合物(IMC)成長適中，即使在200℃1000hr 的時效下，接合強度仍然很高。使用Ag alloy wire除了可以降低成本，經由本實驗研究發現Ag alloy wire 在熱時效200℃1000hr後與Al pad 的接合強度測試更強於Au wire 與Al pad 的接合強度，因為Ag alloy wire與Al pad 有著特殊適中的界面反應機制。 | zh_TW |
| dc.description.abstract | Abstract
Electronic packaging industry wire bonding technology in the first stage of diameter 20μm level package, in the past most of the major is to use as an Au wire bonding material. With Au Price from less than $ 300 per ounce in 2001, growing to 2011 reached one ounce more than 1800 U.S. dollars,the future will be more improved manufacturing costs.In addition to raw material cost factor, Au wire and Al pad prone to excessive intermetallic compound (IMC) cause joint reliability decreases.In this study, the price is only one third of the Au wire Ag alloy wire, diameter 20μm level and Al pad on a variety of reliability testing (HTS TCT PCT). The present study found that because of the hardness of Ag alloy wire with Au wire similar, so there is no like Pd-coated Cu wire will damage Al pad causing the problem of poor bonding strength, Ag alloy wire and Al pad bonding interface is very complete. And make more use of the thermal aging test temperature 100 ℃ to 200 ℃; aging time 0hr to 1000hr for bond strength test and interfacial reactions observed. Use dage 4000 made the first solder ball shear test and then observed through an electron microscope can obviously find Ag alloy wire and Al pad bonding interface is very close, so the test results are broken inside the wire; while the Pd-coated Cu wire the Al pad intermetallic compound produced (IMC) is thin, the bonding strength is not high. Via the 200 ℃ 1000hr thermal aging tests can be found, Au wire bonding strength with the Al pad thickness because of excessive intermetallic compound (IMC) cause embrittlement and produce large amounts of the contact holes caused by the contact strength decreases; while Ag alloy wire and Al pad is because the generated intermetallic compound (IMC) growth is moderate, even at 200 ℃ 1000hr the timeliness, the bonding strength is still high. Using the Ag alloy wire in addition to reducing costs, by the experimental study Ag alloy wire after the heat aging and the Al pad is much stronger than the bonding strength test of Au wire bonding strength with the Al pad, since Ag alloy wire and Al pad has a special medium the interfacial reaction mechanism. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-08T00:32:14Z (GMT). No. of bitstreams: 1 ntu-102-D98527023-1.pdf: 9016832 bytes, checksum: 3540f83ce2adce51d930e055bbc07b6b (MD5) Previous issue date: 2013 | en |
| dc.description.tableofcontents | 目 錄
致謝.................................................Ⅰ 摘要.................................................Ⅱ Abstract............................................Ⅲ 目錄.................................................Ⅳ 表目錄...............................................Ⅵ 圖目錄...............................................Ⅶ 第一章 前 言..........................................1 第二章 文獻回顧........................................5 2.1 電子構裝製程中打線接合簡介...........................6 2.1.1 Au wire 與 Au-Pd wire..........................6 2.1.2 Cu wire 與 Pd-coated Cu wire...................10 2.2 Ag alloy wire 與墊層的界面反應.....................14 2.2.1 Ag/Al 界面反應..................................18 2.2.2 Ag wire 與Al、Au或Pd pad 界面反應................19 2.2.3 Ag-Pd wire 與Al 或Au pad 的時效測試與界面反應......22 2.2.4 Au-Ag wire 與Al pad 的時效測試與界面反應...........22 2.2.5 Ag-Au-Pd wire 與Al pad 的時效測試與界面反應........25 2.3 擴散反應的驅動力-高活化能往低活化能....................29 2.3.1 熱力學第二定律....................................29 2.3.2 Ag-Au-Pd 與Al 的Spinodal Decomposition 反應......30 第三章 實驗方法.........................................31 3.1 wire bond 於矽晶片上可靠度測試(TCT PCT HTS)界面分析...33 3.2 wire bond/Al pad 熱時效可靠度測試...................36 第四章 結果與討論.......................................37 4.1 TCT PCT HTS 可靠度測試結果..........................37 4.1.1 溫度循環試驗 (TCT, Temperature Cycling test) .....40 4.1.2 高溫水蒸汽壓力試驗 (PCT, Pressure Cooker test) ....42 4.1.3 高溫貯存試驗 (HTS, High Temperature Storage test).43 4.2 Ag alloy wire/Al pad 熱時效可靠度測試................45 4.2.1 Ag alloy wire/Al pad 熱時效後接合強度測試與IMC厚度...53 4.2.2 Ag-Au-Pd alloy wire/Al pad 三元合金界面反應分析.....53 4.2.3 Ag-Pd alloy wire/Al pad 二元合金界面反應分析........57 4.2.4 Ag alloy wire/Al pad 三元與二元界面反應比較.........59 4.3 Au wire/Al pad 熱時效可靠度測試......................96 4.3.1 Au wire/Al pad 熱時效接合強度測試與IMC厚度..........96 4.3.2 Au wire/Al pad 熱時效後界面反應分析.................99 4.4 Pd-coated Cu wire/Al pad 熱時效可靠度測試............106 4.4.1 Pd-coated Cu wire/Al pad 熱時效後合強度測試與IMC厚度..106 4.4.2 Pd-coated Cu wire/Al pad 熱時效後界面反應分析........107 4.5 Ag alloy wire 與Au wire 與Pd-coated Cu wire 的比較...112 第五章 結 論 ............................................113 參考文獻.................................................116 作者簡介.................................................123 | |
| dc.language.iso | zh-TW | |
| dc.title | Ag 合金線在IC 與LED封裝打線接合之銲墊界面反應 | zh_TW |
| dc.title | Interfacial reactions of Ag alloy wires with wire bonded pads for IC and LED packages | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 101-2 | |
| dc.description.degree | 博士 | |
| dc.contributor.oralexamcommittee | 薛富盛,吳春森,蔡幸樺,李俊德,吳醒非 | |
| dc.subject.keyword | 打線接合,銀合金線,可靠度測試,擴散,介金屬化合物, | zh_TW |
| dc.subject.keyword | wire bonding,silver alloy wire,reliability testing,diffusion,intermetallic compound, | en |
| dc.relation.page | 123 | |
| dc.rights.note | 未授權 | |
| dc.date.accepted | 2013-07-01 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 材料科學與工程學研究所 | zh_TW |
| 顯示於系所單位： | 材料科學與工程學系 | |
文件中的檔案：
| 檔案 | 大小 | 格式 | |
|---|---|---|---|
| ntu-102-1.pdf 目前未授權公開取用 | 8.81 MB | Adobe PDF |
系統中的文件，除了特別指名其著作權條款之外，均受到著作權保護，並且保留所有的權利。