請用此 Handle URI 來引用此文件：
http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/17443完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 廖運炫(Yunn-Shiuan Liao) | |
| dc.contributor.author | Cheng-Wei Chen | en |
| dc.contributor.author | 陳正維 | zh_TW |
| dc.date.accessioned | 2021-06-08T00:13:19Z | - |
| dc.date.copyright | 2020-08-20 | |
| dc.date.issued | 2020 | |
| dc.date.submitted | 2020-08-11 | |
| dc.identifier.citation | [1] 楊啟榮，LED 製程與應用技術講義，國立台灣師範大學，2002。 [2] Z. C. Li, Z. J. Pei, P. D. Funkenbusch, 'Machining processes for sapphire wafers: a literature review, ' Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, vol. 225, no. 7, pp. 975-989, 2011. [3] H. J. Moller, 'Basic mechanisms and models of multi-wire sawing,' Advanced Engineering Materials, vol. 6, no. 7, pp. 501-513, 2004. [4] S.Malkin, and C. Guo,’’ Grinding Technology: Theory and application of machining with abrasives. New York: Industrial Press Inc., 2008. [5] J. G. Beesley, et al., 'Swiss wafer slicing technology for the global PV market from Meyer Burger AG-Novel Trends for the future in photovoltaic wafer manufacturing,' Proc. 6th Symposium Photovoltaïque National, 2005. [6] J. Li, I. Kao, and V. Prasad, 'Modeling stresses of contacts in wire saw slicing of polycrystalline and crystalline ingots: application to silicon wafer production,' Journal of Electronic Packaging, vol. 120, no. 2, pp. 123-128, 1998. [7] 廖運炫，許春耀，脆性材料線切割，機械工業雜誌，pp. 122-129, 2002. [8] X. Zhou, and F. Xi, 'Modeling and predicting surface roughness of the grinding process,' International Journal of Machine Tools and Manufacture, vol. 42, no. 8, pp. 969-977, 2002. [9] T. A. Nguyen, and D. L. Butler, 'Simulation of precision grinding process, part 1: generation of the grinding wheel surface,' International Journal of Machine Tools and Manufacture, vol. 45, no. 11, pp. 1321-1328,2005. [10] T. A. Nguyen, and D. L. Butler, 'Simulation of surface grinding process, Part 2: Interaction of the abrasive grain with the workpiece,' International Journal of Machine Tools and Manufacture, vol. 45, no. 11, pp. 1329-1336, 2005. [11] H. Wu, and S. N. Melkote, 'Study of ductile-to-brittle transition in single grit diamond scribing of silicon: application to wire sawing of silicon wafers,' Journal of Engineering Materials and Technology, vol. 134, no. 4, pp. 1-8, 2012. [12] Y. Gao, and P. Q. Ge, 'Relationship between the grit cut depth and process parameters in electroplated diamond wire sawing KDP crystal,' Proc. International Conference on Engineering Design and Optimization, Trans Tech Publications, vol. 101, pp. 950-953, 2012. [13] C. C. Chen, and P. H. Chao, 'Surface texture analysis of fixed and free abrasive machining of silicon substrates for solar cells,' Proc. 13th International Symposium on Advances in Abrasive Technology, Trans Tech Publications, vol. 126, pp. 177-180, 2010. [14] T. Liedke, and M. Kuna, 'A macroscopic mechanical model of the wire sawing process,' International Journal of Machine Tools and Manufacture, vol. 51, no. 9, pp. 711-720, 2011. [15] E. Teomete, 'Investigation of long waviness induced by the wire saw process,' Proc. of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, SAGE Publications Ltd, vol. 225, no. 7, pp. 1153-1162, 2011. [16] E. J. P. o. t. I. o. M. E. Teomete, Part B: Journal of Engineering Manufacture, 'Investigation of long waviness induced by the wire saw process,' vol. 225, no. 7, pp. 1153-1162, 2011. [17] H. Wu, S. N. Melkote, and S. Danyluk, 'Mechanical Strength of Silicon Wafers Cut by Loose Abrasive Slurry and Fixed Abrasive Diamond Wire Sawing,' Advanced Engineering Materials, vol. 14, no. 5, pp. 342-348, 2012. [18] C. H. Chung, 'Abrasive distribution of the fixed diamond wire in wire sawing process,' Advanced Materials Research, vol. 579, pp. 145-152, 2011. [19] T. Liedke, and M. Kuna, 'Discrete element simulation of micromechanical removal processes during wire sawing,' Wear, vol. 304, no. 1-2, pp.77-82, 2013. [20] B. Nassauer, A. Hess, and M. Kuna, 'Numerical and experimental investigations of micromechanical processes during wire sawing,' International Journal of Solids and Structures, vol. 51, no. 14, pp. 2656-2665, 2014. [21] B. Lawn, and R.Wilshaw, ' Indentation fracture: principles and applications.' Journal of materials science, vol. 10, no. 6, pp. 1049-1081, 1975. [22] J. Boussinesq, 'Application des Potentiels a l'Etude de l'Equilibre et du Mouvement des Solides Elastiques,' Gauthier-Villars, pp. 398-402, 1885. [23] H. Hertz and J. R. Angew, 'Hertz's Miscellaneous Papers,' Macmillan Co. Ltd, p. chs. 5 and 6, 1896. [24] T. G. Bifano, T. A. Dow, and R. O. Scattergood, 'Ductile-regime grinding: a new technology for machining brittle materials,' Journal of engineering for industry, vol. 113, no. 2, pp. 184-189, 1991. [25] B. R. Lawn, and D. B. Marshall, 'Hardness, toughness, and brittleness: an indentation analysis.' Journal of the American ceramic society, vol. 62, no. 7‐8, pp. 347-350, 1979. [26] Y. Wang, et al., 'Study on the system matching of ultrasonic vibration assisted grinding for hard and brittle materials processing,' International Journal of Machine Tools and Manufacture, vol. 77, pp. 66-73, 2014. [27] 羅勝益，金屬結合鑽石刀具之製造與磨耗分析，國立台灣大學機械工程研究所博士論文，1992。 [28] S. Turchetta, L. Sorrentino, et al., 'A method to optimize the diamond wire cutting process,' Diamond and Related Materials, vol. 71, pp. 90-97, 2017. [29] U. Pala, et al.,'Experimental investigation of tool wear in electroplated diamond wire sawing of silicon,' Procedia CIRP, vol. 77, pp. 371-374, 2018. [30] R. Knoblauch, et al., 'Investigation of the progressive wear of individual diamond grains in wire used to cut monocrystalline silicon,' Wear, vol. 414, pp. 50-58, 2018. [31] 黃浩維，單晶碳化矽晶圓之鑽石線鋸加工模式分析研究，國立臺灣科技大學機械工程研究所碩士論文，2015。 [32] B. R. Lawn, A. G. Evans, et al., 'Elastic/plastic indentation damage in ceramics: the median/radial crack system,' Journal of the American Ceramic Society, vol. 63, no.9‐10, pp. 574-581, 1980. [33] 梁峻碩，線鋸切割太陽能基板之研究，國立臺灣科技大學機械工程研究所碩士論文，2008。 [34] 詹明賢，單晶與多晶矽基板鑽石線鋸加工之切屑分析研究，國立臺灣科技大學機械工程研究所碩士論文，2014。 [35] K.H. Gahr, 'Microstructure and wear of materials,' Elsevier, vol.10, 1987. [36] T. L. Szabo, and P. A. Lewin, 'Piezoelectric materials for imaging.,' Journal of ultrasound in medicine, vol. 26, no. 3, pp. 283-288, 2007. [37] Y. S. Liao, Y. C. Chen, H. M. Lin, 'Feasibility study of the ultrasonic vibration assisted drilling of Inconel superalloy,' International Journal of Machine Tools and Manufacture, vol. 47, no. 12-13, pp. 1988-1996, 2007. [38] F. Makhdum, et al., 'Cutting forces in ultrasonically assisted drilling of carbon fibre-reinforced plastics,' Journal of Physics-Conference Series, vol. 382, no. 1, pp. 12-19, 2012. [39] V. Baghlani, et al., 'Ultrasonic assisted deep drilling of Inconel 738LC superalloy,' Procedia Cirp, vol. 6, pp. 571-576, 2013. [40] V. Baghlani, et al., 'An optimization technique on ultrasonic and cutting parameters for drilling and deep drilling of nickel-based high-strength Inconel 738LC superalloy with deeper and higher hole quality,' The International Journal of Advanced Manufacturing Technology, vol. 82, no. 5-8, pp. 877-888, 2016. [41] 范光照，精密量測，高立圖書有限公司，2001。 [42] X. Jiang, 'The evolution of surfaces and their measurement,' in the 9th International Symposium on Measurment Technology and Intelligent Instruments, pp. 54-60, 2009. [43] N. Wang., et al., 'Research on the machinability of A-plane sapphire under diamond wire sawing in different sawing directions.' Ceramics International, vol. 45, no. 8, pp. 10310-10320, 2019. [44] H. Huang, X. Li, and X. Xu, 'An experimental research on the force and energy during the sapphire sawing using reciprocating electroplated diamond wire saw,' Journal of Manufacturing Science and Engineering, vol. 139, no. 12, pp. 1-5, 2017. [45] A. A. Busnaina and G. W. Gale, 'Ultrasonic and megasonic particle removal,' Proc. Precis. Clean, vol. 15, pp. 347-359, 1995. [46] E. Herbert, S. Balibar, and F. Caupin, 'Cavitation pressure in water,' Physical Review E, vol. 74, no. 4, pp. 1-22, 2006. [47] 賴耿陽，超音波工學理論實務，復漢出版社，2001。 | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/17443 | - |
| dc.description.abstract | 單晶藍寶石(Sapphire)是一種高透光性、耐高溫且具有高硬度的化合物半導體材料，也因其具備之化學穩定性及高硬度，故目前在LED產業中多以藍寶石作為主要基板材料，而此晶圓基板生產大多以固定磨料線鋸為主要鋸片製程，因線鋸製程為利用鑽石線上之鑽石磨料與工件產生相對運動進而移除材料之製程，故鑽石磨料之使用壽命於線鋸製程中佔非常大的成本，並影響的整個基圓基板生產的品質與價格。 本研究欲藉由超音波振動，使鑽石線材產生強迫式振動，利用使超音波振動下改善其鑽石磨料之磨耗，本篇論文使用實驗室自行開發之超音波導輪，藉由FEM模擬得到超音波導輪之徑向模態，利用耦合(Coupling)特性將其振動能量傳遞至鑽石線材上，使鑽石線材在進行切削時，因超音波振動與工件產生非連續式接觸，經由量測可知線材上具有無衰退並可強迫振動之運動型態優勢，可使切削後之表面因線鋸之振動可獲得均勻且較淺之線痕(Saw mark)，表面粗糙度可降低約44%，並於實際鋸切時觀察發現超音波振動可成功地減少鑽石磨料之磨耗，透過弓角減少的情況下進而使整體的切削力降低，法向切削力可降低約59%，切線切削力可降低約54%，故於超音波振動輔助下可延長線材切削壽命並提高切片表面品質。 | zh_TW |
| dc.description.abstract | Single crystal sapphire is a brittle semiconductor material with high transmittance, temperature resistance, and hardness. Wire sawing is a main slicing process in wafer substrate manufacturing. The process is to remove the material from the workpiece by using diamond abrasive, and it is high-cost due to diamond abrasive’s service life, which may be up to 30% of the total cost of sliced wafer production. In doing so, wire sawing makes a great influence on the quality and price of the entire wafer substrates. The study aims to use ultrasonic vibration on the diamond wire to create forced vibration, and improve the diamond abrasive wear. This research tends to use the ultrasonic wheel developed by the laboratory, and the radial mode of the supersonic ultrasonic wheel obtained by FEM simulation. By means of coupling, the wear transfers its vibration energy to diamond wire. When the diamond wire is in progress, it creates ultrasonic vibration, making discontinuous contact with the workpiece. By measuring the wire, the result shows that the vibration on the wire has the advantages of non-decay and forced vibration, making the surface with uniform and flatter saw marks. Surface roughness can be reduced by 44%. In the experiment, it is observed that ultrasonic vibration can successfully reduce the abrasive wear of diamonds when the bow angle is reduced. And the overall cutting force is reduced. Normal cutting force can be reduced by 59%, tangential cutting force can be reduced by 54%. The measurement of cutting force indicates that the cutting life of wire is extended and the surface quality of the slice is improved by ultrasonic vibration. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-08T00:13:19Z (GMT). No. of bitstreams: 1 U0001-0508202014122500.pdf: 5334951 bytes, checksum: 22bc4bbf3f5a1e612af27d596e71426e (MD5) Previous issue date: 2020 | en |
| dc.description.tableofcontents | 致謝 I 摘要 II Abstract III 目錄 IV 圖目錄 VII 表目錄 XI 第1章 緒論 1 1.1 研究背景與動機 1 1.2 文獻回顧 3 1.2.1 線鋸製程發展 3 1.2.2 線鋸相關研究 6 1.2.3 硬脆材料加工 9 1.2.4 鑽石之磨耗 13 1.3 研究目的與方法 15 1.4 本文架構 16 第2章 相關理論 17 2.1 鑽石磨料移除材料之機制 17 2.1.1 壓印破壞模型 17 2.1.2 磨耗移除材料模型 19 2.2 超音波振動之驅動原理 21 2.2.1 壓電材料之特性 21 2.2.2 蘭杰文(Langevin) 21 2.2.3 超音波輔助加工之特點[37-40] 22 2.3 表面粗糙度 23 第3章 實驗設備與實驗規劃 26 3.1 實驗材料 26 3.1.1 鑽石線 26 3.1.2 藍寶石 27 3.2 實驗設備 29 3.2.1 鑽石線鋸切割機台 29 3.2.2 超音波導輪與超音波發振器 30 3.3 量測設備 32 3.3.1 雷射共軛焦顯微鏡 32 3.3.2 數位顯微鏡 33 3.3.3 形狀量測儀 34 3.3.4 雷射位移計 36 3.3.5 微動力計 37 3.3.6 多通道電荷放大器及資料擷取卡 38 3.4 實驗規劃 39 第4章 超音波裝置設計與觀測 42 4.1 超音波導輪FEM模擬 42 4.2 量測線材振動位移量 45 4.3 超音波空化作用 47 第5章 實驗結果與討論 53 5.1 超音波輔助對工件的影響 53 5.1.1 表面形貌與線痕 53 5.1.2 切片翹曲 57 5.1.3 表面粗糙度 60 5.1.4 切割槽寬 62 5.2 超音波輔助對線材的影響 66 5.2.1 線材磨耗 66 5.2.1 線材弓角 70 5.2.2 切削力分析 73 第6章 結論與未來展望 80 6.1 結論 80 6.2 未來展望 81 參考文獻 82 | |
| dc.language.iso | zh-TW | |
| dc.title | 超音波輔助鑽石線鋸應用於藍寶石加工之研究 | zh_TW |
| dc.title | Study of the Ultrasonic Vibration Assisted Diamond Wire Sawing of Sapphire | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 108-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 趙崇禮(Choung-Lii Chao),蔡曜陽(Yao-Yang Tsai) | |
| dc.subject.keyword | 鑽石線鋸,超音波振動,藍寶石, | zh_TW |
| dc.subject.keyword | diamond wire saw,ultrasonic vibration,sapphire, | en |
| dc.relation.page | 85 | |
| dc.identifier.doi | 10.6342/NTU202002463 | |
| dc.rights.note | 未授權 | |
| dc.date.accepted | 2020-08-12 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
| 顯示於系所單位： | 機械工程學系 | |
文件中的檔案：
| 檔案 | 大小 | 格式 | |
|---|---|---|---|
| U0001-0508202014122500.pdf 未授權公開取用 | 5.21 MB | Adobe PDF |
系統中的文件，除了特別指名其著作權條款之外，均受到著作權保護，並且保留所有的權利。