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http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/16593
標題: | 量測SIM卡電極接觸力之荷重元研製 Development of Measuring SIM Card Electrode Contact Load Cell |
作者: | Wei-Ti Lin 林瑋迪 |
指導教授: | 周元昉 |
關鍵字: | 電容式,感測器,SIM卡插槽,陽極接合,MEMS, capacitors,sensors,SIM card slot,anodic bonding,MEMS, |
出版年 : | 2011 |
學位: | 碩士 |
摘要: | 本計畫主要目的為開發一個電容式力感測器,此力感測器使用在量測手機SIM卡插槽的觸腳所給予的力,因為此感測器尺寸相當小,必須利用微機電的技術進行系統的開發。
首先是感測器本身為一組平行板電容,感測器承受外力作用之後會使帄行板電容的間隙改變導致電容改變,藉由量測電容的變化,可反推作用力的大小。感測器是組合矽晶片與有繪製下電極的銅箔基板或是玻璃晶片而成,依據不同的接合方式來進行組合;矽晶片與銅箔基板之間是利用負光阻SU-8來進行接合,由於光阻有曝光、顯影等特性,可以定義出接合的區域;第二種接合方式是利用陽極接合,將矽晶片與玻璃晶片對準後,施加壓力與溫度,並施加1000伏特的電壓,讓矽與玻璃產生接合。 矽晶片經過微系統的加工之後形成可以產生位移的上電極,而銅箔基板與玻璃晶片皆製作成配對的下電極,以及電路的走線,最後接合的動作,則是利用上一段文章所提到的兩種方式來進行。 此組平行板電容嵌入繪有電路的銅箔基板,即完成整個感測器,感測器插入SIM卡插槽受力之後,所接受到的電容值變化將顯示在電腦銀幕,再藉由電腦內的軟體將電容值換算成力的值,即完成所有檢測的過程。 The main purpose of this project for the development of a capacitive force sensor, the force sensor used in the measurement cell phone SIM card slot, touch the force given by the foot, because the sensor size is quite small, must using MEMS techniques. Sensor itself is a set of parallel plate capacitors, sensors will withstand the external force, and after the change in capacitance of the gap changes, by measuring changes can computer the force. Sensor is a combination of silicon and a glass wafer, according to different ways of bonding; using negative photoresist SU-8 to bond silicon and PCB ,you can define bonding area by exposure and development ; the second way is to use anodic bonding, the silicon and glass wafer has aligned, pressure and temperature, then applied voltage of 1000 volts to bond. After the processing of silicon, it can produce displacement of the electrode, the PCB and glass chips are made into a pair of electrode, and using two different ways to bond which has mentioned above. This set of parallel capacitor embedded in PCB, which complete the sensor, the sensor forced by the SIM card slot, the capacitance changes received will be displayed on the computer screen, and then will be converted into values, this is to complete all the testing process. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/16593 |
全文授權: | 未授權 |
顯示於系所單位: | 機械工程學系 |
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ntu-100-1.pdf 目前未授權公開取用 | 1.92 MB | Adobe PDF |
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